Abstract: A battery pack including battery cells, a housing to house the battery cells, and a cooling device that cools air flowing through the housing. The cooling device may be installed on an intermediate portion of the housing. The cooling device may include a cooling pipe, in which water flows.

Abstract: A stator module and a motor including the stator module are provided. The motor includes a stator and a stator module. The rotor includes a rotor core and a plurality of rotor poles arranged around a circumference of the rotor core, each generating a magnetic flux. The stator module includes a first stator and a second stator disposed coaxially with each other, each being rotatable in a circumferential direction and each having a coil wound thereon, and a rotation driving unit which controls a rotation of the first stator and the second stator through the same angle in opposite directions, thereby controlling a flux linkage of a rotor according to the rotational angle of each of the first stator and the second stator.

Abstract: A battery and a battery pack including the battery. The battery includes: a frame; an electrode assembly disposed around the frame; a main body to house the electrode assembly; and electrode terminals extending from the electrode assembly in a first direction, through the main body. A cooling hole extends through opposing sides of the main body, in a second direction that is generally perpendicular to the first direction.

Abstract: A printed circuit board assembly capable of having an electronic component mounted at a wafer level by using a wafer itself as a printed circuit board, the printed circuit board assembly including a plurality of electronic components, a printed circuit board having the plurality of electronic components mounted thereon, a protection body configured to entirely cover the printed circuit board, and a connection unit having one end that is exposed to an outside of the protection body for the printed circuit board to be electrically connected to a sub board, wherein the printed circuit board comprises a wafer printed circuit board formed with a wafer.

Abstract: Disclosed is a connection structure for a circuit board using a solder bump to arrange circuit boards. The circuit board connection structure includes a solder bump prepared on one of two circuit boards and a perforated part formed at the other of the circuit boards to receive the solder bump. Facing both circuit boards towards each other and inserting the solder bump into the perforated part, the circuit boards are desirably arranged.

Abstract: The three-dimensional stack structure includes a printed circuit board, a first wafer chip mounted on the printed circuit board, a second wafer chip stacked above the first wafer chip, and first interposers interposed between the second wafer chip and the printed circuit board. The first interposers are configured to electrically connect the second wafer chip to the printed circuit board.

Abstract: Disclosed herein is a printed circuit board and a connecting method thereof. The connecting method of the circuit board assembly may include molding the printed circuit board assembly by applying a resin to the printed circuit board assembly, exposing ends of the electrode terminals of a connector mounted on a printed circuit board by partially removing the molded printed circuit board assembly, and connecting a connection member to the exposed ends of the electrode terminals of the connector. Therefore, even if the whole of the printed circuit board assembly is molded, the connection member may be freely connected to the connector of the printed circuit board assembly.

Abstract: A storage node may include a lower electrode, a phase change layer on the lower electrode and an upper electrode on the phase change layer, and the lower electrode and the upper electrode may be composed of thermoelectric materials having a melting point higher than that of the phase change layer, and having different conductivity types. An upper surface of the lower electrode may have a recessed shape, and a lower electrode contact layer may be provided between the lower electrode and the phase change layer.

Abstract: A display panel and a method of manufacturing the same are provided. The display panel includes a plurality of chip panels, each chip panel having an upper surface, a lower surface disposed parallel to the upper surface, a side surface between the upper surface and the lower surface and a connection portion between the side surface and at least one of the upper surface and the lower surface, the connection portion having a rounded configuration, and an adhesive layer interposed between the chip panels in order to vertically stack the chip panels to connect the chip panels. Therefore, in the display panel, the strength of the edge portion can be improved. Also, by forming a connection portion, a stress can be suppressed from being concentrated at the edge portion by an external mechanical stress.

Abstract: Disclosed is a printed circuit board assembly PBA on which a connector for electrical connection to an external connection element is mounted. Such an assembly may be formed with a molding method of a PBA which includes applying a polymer resin to the PBA to mold the PBA in order to offer stiffness thereto. The foregoing method of molding the PBA according to the present disclosure is a molding method of a PBA including a PCB and a connector mounted on the PCB to electrically connect the same to an external connection element. The method includes combining the connector with a connector cover, applying a resin to the PBA combined with the connector cover to execute molding of the PBA, and separating the connector cover from the molded PBA to expose the electrode terminal for an external connection element.

Abstract: Disclosed herein are printed circuit board assemblies made of a brittle material such as silicon, glass or ceramic and provided with a connector to electrically connect the same to an external connection member, and a method for molding the printed circuit board assembly wherein the printed circuit board assembly is molded by applying a polymer resin thereto to impart hardness to the printed circuit board assembly, and an electrode terminal to connect the same to the external connection member is exposed to the outside. Disclosed herein is also an interconnection structure of an interposer, the interconnection structure electrically connected to a main printed circuit board (PCB) through a solder joint is interposed between the interposer and the solder joint to prevent or reduce concentration of stress on the solder joint caused by differences in coefficients thermal expansion between the interposer and the main PCB.

Abstract: A storage node, a phase change memory device, and methods of operating and fabricating the same are provided. The storage node may include a lower electrode, a phase change layer on the lower electrode and an upper electrode on the phase change layer, and the lower electrode and the upper electrode may be composed of thermoelectric materials having a melting point higher than that of the phase change layer, and having different conductivity types. An upper surface of the lower electrode may have a recessed shape, and a lower electrode contact layer may be provided between the lower electrode and the phase change layer. A thickness of the phase change layer may be about 100 nm or less, and the lower electrode may be composed of an n-type thermoelectric material, and the upper electrode may be composed of a p-type thermoelectric material, or they may be composed on the contrary to the above.

Abstract: An electrorheological fluid is provided. The electrorheological fluid includes polarizing particles and a dispersion medium in which the polarizing particles are dispersed. The polarizing particles may include silica particles. The dispersion medium may include silicon oil. The silicon oil may be modified silicon oil including at least one functional group selected from the group consisting of a hydroxyl group (—OH group), an amine group (—NH2 group), a mercapto group (—SH group), and a carboxy group (—COOH group).

Abstract: A hydrogen generator and a method of operating the hydrogen generator. The hydrogen generator includes: a cylindrical reformer catalyst; and a cylindrical shift catalyst disposed inside of the reformer catalyst; a separation wall provided between the reformer catalyst and the shift catalyst; a cylinder that is disposed inside of the reformer catalyst, and comprises, on an outer surface thereof, a plurality of first nozzles to direct a plurality of flames to the reformer catalyst and a plurality of second nozzles to direct a plurality of flames to the shift catalyst; and a combustion fuel supply valve that selectively guides a combustion fuel to the first nozzles and or the second nozzles.

Abstract: Disclosed herein is a case structure of an electronic product to which a film-type electronic circuit is adhered. The case structure may include a case of an electronic product and a first film adhered to the case. The case structure may further include a second film adhered to the first film such that one surface of the second film contacts the first film, and an electronic circuit layer adhered to the first film. The electronic circuit layer may be arranged between the first film and the second film, wherein the first film is thermally adhered to the case. The first film may have a melting at a melting point that is lower than a heat-resistant temperature of the case.

Abstract: A reformer for a fuel cell system, and a method of controlling the reformer. The reformer includes a cylindrical reforming catalyst; a burner disposed inside of the reforming catalyst and comprising a plurality of nozzles to direct flames at the reforming catalyst; a nozzle covering element to selectively cover a portion of each of the nozzles; a combustion fuel supply valve to change the amount of a combustion fuel that is supplied to the burner; and a controller that controls the nozzle covering units and the combustion supply valve. The method of controlling the reformer includes: moving the nozzle covering element to cover a decreasing portion of each of the nozzles in response to an increasing amount of the combustion fuel being supplied to the burner; and moving the nozzle covering element to cover a increasing portion of each of the nozzles in response to a decreasing amount of the combustion fuel supplied to the burner.

Abstract: A touch panel and an electronic device having the same are provided. The touch panel includes a first substrate; a second substrate that is spaced apart from the first substrate by a gap, the second substrate including a touch surface; an array of driving electrode pairs that is arranged on the first substrate and the second substrate, and induces an electrical field locally between the first substrate and the second substrate when a driving voltage is applied thereto; and electro-rheological fluid that is filled in the gap between the first substrate and the second substrate, a viscosity of the electro-rheological fluid changing depending on the electrical field induced by the driving electrode pairs. An operating force or a return force is adjusted by controlling an application or release of the driving voltage.

Abstract: A reformer burner that includes a fuel supply tube through which a fuel is supplied and a fuel supply chamber that surrounds the fuel supply tube and has a plurality of atomizing holes to atomize a fuel into a combustion chamber of a reformer.

Abstract: A cooling system includes a heat pipe for contacting a heated member and absorbing heat from the heated member, and a first heat exchange unit for containing a refrigerant that is heated by absorbing the heat from a heat emitting part. Also, the heated member cooling system includes a second heat exchange unit for containing the refrigerant entered from the first heat exchange unit and cooling the refrigerant, and for emitting the cooled refrigerant to the first heat exchange unit.

Abstract: A fuel reformer burner for a polymer electrolyte membrane fuel cell (PEMFC) system includes a first tube through which a fuel for a fuel reformer is supplied and a second tube through which anode-off gas (AOG) is supplied from a fuel cell stack. The second tube is not connected to the first tube, and an inlet line through which an air is supplied is connected to the first tube.