Abstract: A semiconductor wafer baking apparatus includes a hot plate, a container of which an upper part is open, and a cover that covers the upper part of the container. The cover includes an upper plate, a lower plate and a side wall that form a gas circulating space therebetween. At least one gas inlet is formed in the side wall, a plurality of gas supply holes are formed in a central region of the lower plate, and a skirt on which is formed a gas exhaust unit is coupled to a lower edge of the cover.

Abstract: A phase change memory device includes a substrate, a switching element formed in the substrate and a storage node connected to the switching element. The storage node may include a lower electrode connected to the switching element, a first phase change layer formed on the lower electrode, a magnetic resistance layer formed on the first phase change layer, a second phase change layer formed on the magnetic resistance layer and an upper electrode formed on the second phase change layer.

Abstract: A reformer for a fuel cell system, and a method of controlling the reformer. The reformer includes a cylindrical reforming catalyst; a burner disposed inside of the reforming catalyst and comprising a plurality of nozzles to direct flames at the reforming catalyst; a nozzle covering element to selectively cover a portion of each of the nozzles; a combustion fuel supply valve to change the amount of a combustion fuel that is supplied to the burner; and a controller that controls the nozzle covering units and the combustion supply valve. The method of controlling the reformer includes: moving the nozzle covering element to cover a decreasing portion of each of the nozzles in response to an increasing amount of the combustion fuel being supplied to the burner; and moving the nozzle covering element to cover a increasing portion of each of the nozzles in response to a decreasing amount of the combustion fuel supplied to the burner.

Abstract: A hydrogen generator and a method of operating the hydrogen generator. The hydrogen generator includes: a cylindrical reformer catalyst; and a cylindrical shift catalyst disposed inside of the reformer catalyst; a separation wall provided between the reformer catalyst and the shift catalyst; a cylinder that is disposed inside of the reformer catalyst, and comprises, on an outer surface thereof, a plurality of first nozzles to direct a plurality of flames to the reformer catalyst and a plurality of second nozzles to direct a plurality of flames to the shift catalyst; and a combustion fuel supply valve that selectively guides a combustion fuel to the first nozzles and or the second nozzles.

Abstract: A reformer burner that includes a fuel supply tube through which a fuel is supplied and a fuel supply chamber that surrounds the fuel supply tube and has a plurality of atomizing holes to atomize a fuel into a combustion chamber of a reformer.

Abstract: A hydrogen generator having double burners and a method of operating the samewhere the hydrogen generator includes a housing, a barrier wall to divide a space in the housing into a first chamber and a second chamber, a fuel reformer installed in the first chamber, a first burner installed in the first chamber to heat a fuel reformer, a shift reactor installed in the second chamber, a second burner mounted in the barrier wall to heat the shift reactor, and a first igniter and a second igniter respectively ignite the first burner and the second burner.

Abstract: A storage node, a phase change memory device, and methods of operating and fabricating the same are provided. The storage node may include a lower electrode, a phase change layer on the lower electrode and an upper electrode on the phase change layer, and the lower electrode and the upper electrode may be composed of thermoelectric materials having a melting point higher than that of the phase change layer, and having different conductivity types. An upper surface of the lower electrode may have a recessed shape, and a lower electrode contact layer may be provided between the lower electrode and the phase change layer. A thickness of the phase change layer may be about 100 nm or less, and the lower electrode may be composed of an n-type thermoelectric material, and the upper electrode may be composed of a p-type thermoelectric material, or they may be composed on the contrary to the above.

Abstract: A phase change memory device includes a substrate, a switching element formed in the substrate and a storage node connected to the switching element. The storage node may include a lower electrode connected to the switching element, a first phase change layer formed on the lower electrode, a magnetic resistance layer formed on the first phase change layer, a second phase change layer formed on the magnetic resistance layer and an upper electrode formed on the second phase change layer.

Abstract: The present invention discloses an art for eliminating the dependency of the optical modulator on the polarization degree by using an orthogonal mode light which is a mixture of two lights that are perpendicular to each other in polarization direction as a light source. An optical communication system of the present invention comprises: a first optical generator and a second optical generator for generating a first single mode light and a second single mode light, respectively, wherein the first single mode light and the second single mode light are orthogonal and non-interfering with each other, and have the same wavelength; a mixing means for mixing the first single mode light and the second single mode light to output an orthogonal mode light; and an optical modulator for amplifying and modulating the orthogonal mode light after receiving the orthogonal mode light through an optical fiber so as to produce a constantly amplified optical signal regardless of a deflection degree of the orthogonal mode light.

Abstract: In a startup method for fuel cell systems, and more particularly, a startup method which makes the fuel cell systems rapidly reach a steady state operation by significantly decreasing the time taken to increase the temperature of the shift reactor catalyst, gas discharged from a burner that heats a reformer is supplied into the shift reactor. In the startup method of the fuel cell system, the fuel cell systems rapidly reach a steady state operation thereby significantly improving the utility of the fuel cell system. In addition, the fuel cell system is economical in that gases discharged from burners included in the fuel cell system and waste heat are used.

Abstract: A shift reactor for fuel cells, a fuel cell system employing the same, and an operating method of the same are provided. More particularly, a shift reactor for fuel cells is filled with a shift catalyst and includes an inlet through which reactants flow into the shift reactor and an outlet through which products flow out of the shift reactor. An oxygen supply duct and a valve capable of regulating the oxygen supply are positioned at the outlet side of the shift reactor. The oxygen supply allows for the temperature of the shift catalyst to be increased rapidly at startup, thereby significantly shortening the startup time of the shift reactor and thereby contributing to an improved practical operation of the fuel cell system.

Abstract: Provided are phase change random access memory (PRAM) devices and methods of operating the same. The PRAM device may include a switching device, a lower electrode, a lower electrode contact layer, a phase change layer and/or an upper electrode. The lower electrode may be connected to a switching device. The lower electrode contact layer may be formed on the lower electrode. The phase change layer, which may include a bottom surface that contacts an upper surface of the lower electrode contact layer, may be formed on the lower electrode contact layer. The upper electrode may be formed on the phase change layer. The lower electrode contact layer may be formed of a material layer having an absolute value of a Seebeck coefficient higher than TiAlN. The Seebeck coefficient of the lower electrode contact layer may be negative. The material layer may have lower heat conductivity and/or approximately equivalent electrical resistance as TiAlN.

Abstract: A wafer bake apparatus includes an air flow control unit of pneumatic cylinder structure operating interlockingly with a wafer lift unit and induces the air flow between a wafer and a hot plate. Therefore, when a wafer is placed in a baking position the air between the wafer and the hot plate descends. As a result, the wafer is no longer under the influence of air resistance, and can be more accurately placed in the baking position. In addition, when the baked wafer is lifted to an unloading position, the air between the hot plate and the wafer ascends, which in turn supports the wafer and prevents the distortion of the wafer.

Abstract: An apparatus for heating a wafer includes a hot plate, formed of, for example, ceramic, which heats the wafer mounted thereon, a case supporting the hot plate, and a fixing unit fixing the hot plate to the case that is located under the hot plate. The fixing unit may include a ball for contacting and pressing the hot plate, and an elastic spring which presses the ball and which compresses when the hot plate expands thermally.

Abstract: A semiconductor wafer baking apparatus includes a hot plate, a container of which an upper part is open, and a cover that covers the upper part of the container. The cover includes an upper plate, a lower plate and a side wall that form a gas circulating space therebetween. At least one gas inlet is formed in the side wall, a plurality of gas supply holes are formed in a central region of the lower plate, and a skirt on which is formed a gas exhaust unit is coupled to a lower edge of the cover.

Abstract: A test unit usable with a board having, an electronic component includes at least one testing point provided in each electronic component to test electric properties and a connection state of the plurality of electronic components connected to the board. The test unit usable with a PCB having the electronic component includes a testing point formed on the electronic component, thereby an enhancing high integration of the board.

Abstract: A wafer bake apparatus includes an air flow control unit of pneumatic cylinder structure operating interlockingly with a wafer lift unit and induces the air flow between a wafer and a hot plate. Therefore, when a wafer is placed in a baking position the air between the wafer and the hot plate descends. As a result, the wafer is no longer under the influence of air resistance, and can be more accurately placed in the baking position. In addition, when the baked wafer is lifted to an unloading position, the air between the hot plate and the wafer ascends, which in turn supports the wafer and prevents the distortion of the wafer.

Abstract: A substrate surface processing apparatus is provided. In the substrate surface processing apparatus, a spin chuck holds a substrate thereon by suction, spins the substrate, and moves up and down the substrate. An upper bowl and a lower bowl surround the spin chuck for receiving a processing solution by which the surface of the substrate is processed. An air outlet is positioned under the lower bowl for exhausting air from the upper and lower bowls. A flow separation protrusion is formed within the upper bowl. It separates an air flow around the substrate into an upward air flow and a downward air flow and exhausts the downward air flow through the air outlet.

Abstract: Provided is a heat treatment apparatus. The heat treatment apparatus includes a heating plate including a heater; a chamber case including a cooling chamber, and coupled to a lower portion of the heating plate; and at least one atomizing unit installed on the chamber case to generate liquid droplet aerosol by mixing a cooling liquid and a gas, and at the same time, to inject the liquid droplet aerosol into the cooling chamber.

Abstract: A disk recording device to manufacture hard disk drives. This disk recording device includes a spindle to detachably hold a disk of a hard disk drive. A spindle motor rotates the spindle. A recording unit records data on a surface of the disk while moving over the surface of the disk held on the spindle. A disk protecting unit covers the surfaces of the disk to protect the disk from an external environment when the disk is rotated. In the disc recording device, the disk protecting unit approaches or moves away from the disk through a reciprocating motion within a predetermined range.