Abstract: The preset invention has as its object the provision of a laminate free of hexavalent chromium and excellent in corrosion resistance and wear resistance, and a manufacturing process of the laminate. To solve the above-described problems, a laminate according to the present invention includes a substrate, and a laminated film portion with metal films laminated in two or more layers. The laminate has an interface layer between each two adjacent ones of the metal films. The laminated film portion contains a first metal element as a principal component, the first metal element being at least one element of Ni, Cr, Co, and W, and a second metal element that is a metal element of smaller cohesive energy than that of the first metal element. The second metal element contained in the interface layer is at a content ratio higher than that of the second metal element contained in each of the adjacent metal films.

Abstract: There is provided a gas trapping material and vacuum heat insulation equipment where the gas trapping material can be activated in a sealing step of the vacuum heat insulation equipment, and production efficiency can be enhanced by maintaining a high gas trapping characteristic even when a gas is released in a baking step or in a sealing step under an air atmosphere. The gas trapping material contains porous metal oxide and silver particles having an average particle size of 0.5 nm to 100 nm inclusive.

Abstract: A metallic laminate shaped flow path member has both a surface roughness of a flow path inner surface and corrosion resistance at such a level as to be utilizable as a flow path member for use in a supply line for a corrosive fluid in a semiconductor device manufacturing apparatus. A metallic substrate constituting the metallic laminate shaped flow path member has surface irregularities, the inner surface of the flow path of the metallic laminate shaped flow path member is formed with a glass coating layer in such a manner as to fill at least recessed regions of the surface irregularities of the metallic substrate, and the glass coating layer includes at least one of a layer of a P2O5—ZnO—Al2O3 based glass, a layer of a Bi2O3—ZnO—B2O3 based glass, and a layer of an SiO2—B2O3—Na2O based glass.

Abstract: A lead-free low-melting glass composition containing vanadium oxide, tellurium oxide, silver oxide and lithium oxide, said composition satisfying the following two relational expressions (1) and (2) in terms of oxides. [Ag2O]?[TeO2]?[V2O5]?[Li2O]??(1) 2[V2O5]?[Ag2O]+[Li2O]?40??(2) (In the formula, [X] represents a content of component X, and the unit thereof is “mol %”; the same applies hereinafter.) Thus, it is possible to provide a lead-free low-melting glass composition which enables sealing and adhesion at around the melting point (232° C.) of tin and which has high adhesiveness and stickiness.

Abstract: A noise resistance of a pressure sensor is improved while avoiding a hetero metal bonding. A pressure detection device includes a metal case having the diaphragm which is deformed due to a pressure received from a pressure medium, a sensor element which detects a pressure by detecting the deformation of the diaphragm, a lead frame which is electrically connected to the sensor element, and a connection member which holds the lead frame. A first surface of the lead frame, that is, the surface on a side near the metal case in the parallel plate region, and a second surface of the metal case, that is, the upper surface of the base member interpose at least one of the resin of the connection member being an insulator and the insulating adhesive and are disposed to face each other with a predetermined gap therebetween.

Abstract: Provided is a sensor element that can be manufactured without using hydrofluoric acid or hot phosphoric acid solution. A sensor element 100 includes a base material 10 and a semiconductor chip 20 bonded to the base material 10. The semiconductor chip 20 includes a semiconductor substrate 21, a support film 22 provided on a surface 21a of the semiconductor substrate 21, and a substrate chamber 23 provided in a concave shape on the semiconductor substrate 21 to form a cavity facing an element region 22A of the support film 22, an insulating layer 24 provided on a rear surface 21b of the semiconductor substrate 21, and a bonding layer 25 provided between the insulating layer 14 and the base material 10. The insulating layer 24 includes at least one of a silicon oxynitride film and a silicon oxide film. The bonding layer 25 includes a low-melting point glass.

Abstract: The purpose of the present invention is to provide a lead-free glass composition in which crystallization is suppressed and which has a low softening point. This lead-free glass composition is characterized by containing silver oxide, tellurium oxide and vanadium oxide, and further containing at least one compound selected from among yttrium oxide, lanthanum oxide, cerium oxide, erbium oxide, ytterbium oxide, aluminum oxide, gallium oxide, indium oxide, iron oxide, tungsten oxide and molybdenum oxide as an additional component, and in that the content values (mol %) of silver oxide, tellurium oxide and vanadium oxide satisfy the relationships Ag2O>TeO2?V2O5 and Ag5O?2V2O5 when calculated in terms of the oxides, and in that the content of TeO2 is 25-37 mol. %.

Abstract: Provided is a physical quantity measurement device in which a bonding temperature of a bonding layer is lowered to a temperature not affecting an operation of a semiconductor chip and an insulating property of the semiconductor chip and a base is secured. The physical quantity measurement device includes a base (diaphragm), a semiconductor chip (strain detection element) to measure a physical quantity on the basis of stress acting on the base, and a bonding layer to bond the semiconductor chip to the base. The bonding layer has a first bonding layer bonded to the semiconductor chip, a second bonding layer bonded to the base, and an insulating base material disposed between the first bonding layer and the second bonding layer. The first and second bonding layers and contain glass.

Abstract: The purpose of the present invention is to provide a neutron-absorbing material which has high neutron absorption performance, is less apt to suffer structural degradation caused by irradiation with neutrons or ? rays, and has satisfactory water resistance. The glass composition according to the present invention is characterized by containing Gd2O3, B2O3, CeO2, and Bi2O3 when the components are expressed in terms of oxide, the total amount of Gd2O3 and B2O3 being 65 mol % or greater in terms of oxide amount.

Abstract: There is provided a gas trapping material and vacuum heat insulation equipment where the gas trapping material can be activated in a sealing step of the vacuum heat insulation equipment, and production efficiency can be enhanced by maintaining a high gas trapping characteristic even when a gas is released in a baking step or in a sealing step under an air atmosphere. The gas trapping material contains porous metal oxide and silver particles having an average particle size of 0.5 nm to 100 nm inclusive.

Abstract: There is provided a pressure detecting device whose number of connection points and number of parts are small. A pressure detecting device 100 includes a sensor unit 30 which includes a strain detecting element which detects a strain amount of a pressure receiving surface 11p strained when receiving a pressure, and a processing circuit which processes a signal from the strain detecting element, and includes a housing 10 which houses the sensor unit 30, and terminals 20a and 20c which are connected to the sensor unit 30 and part of which is exposed retractably from the housing 10, and the terminals 20a and 20c include spring mechanisms 22a and 22c which are provided in the housing 10 and can elastically deform.

Abstract: It is an object to provide a highly reliable physical-quantity measurement device which can relax thermal stress at a time of bonding and suppress creep or drift of a sensor output. To attain the above-described object, a physical-quantity measurement device according to the present invention includes a semiconductor element, and a base board connected to the semiconductor element with a plurality of layers being interposed. In the plurality of layers, a stress relaxing layer including at least metal as a main ingredient and a glass layer including glass as a main ingredient are formed each in a layered form including one or more layers. At least one of the stress relaxing layer and the glass layer includes low-melting-point glass, and a softening point of the low-melting-point glass is equal to or lower than the highest heat temperature that the semiconductor element can resist.

Abstract: A noise resistance of a pressure sensor is improved while avoiding a hetero metal bonding. A pressure detection device includes a metal case having the diaphragm which is deformed due to a pressure received from a pressure medium, a sensor element which detects a pressure by detecting the deformation of the diaphragm, a lead frame which is electrically connected to the sensor element, and a connection member which holds the lead frame. A first surface of the lead frame, that is, the surface on a side near the metal case in the parallel plate region, and a second surface of the metal case, that is, the upper surface of the base member interpose at least one of the resin of the connection member being an insulator and the insulating adhesive and are disposed to face each other with a predetermined gap therebetween.

Abstract: It is an objective of the invention to provide a conductive joint article exhibiting electrical joinability comparable to that of solder joining of easy-to-solder joinable metals even when a joined member of the conductive joint article is made of a hard-to-solder joinable metal. There is provided a conductive joint article with conductive joined members electrically joined via a joining layer, at least one of the joined members being made of a hard-to-solder joinable metal. The joining layer comprises an oxide glass phase and a conductive metal phase. The oxide glass phase includes vanadium as a major constituent and at least one of phosphorus, barium and tungsten as an accessory constituent, and has a glass transition point of 390° C. or less. And, connection resistance between the joined members exhibits less than 1×10?5 ?/mm2.

Abstract: The purpose of the present invention is to provide a joining material that can easily join materials to be joined even when characteristics and physical properties thereof differ greatly. To solve the above problem, the joining material according to the present invention is characterized by including a base material, a first layer that is disposed on one surface of the base material, and a second layer that is disposed on the other surface of the base material and includes a phase having a different coefficient of thermal expansion to that of the phase configuring the first layer, at least one of the first and second layers including glass having a softening point of 600° C. or lower.

Abstract: A sealed structural body has an internal space and is made of glass, wherein at least a part of a boundary between the internal space of the sealed structural body and the outside is separated by a sealing material containing a metal material and a lead-free oxide glass. The lead-free oxide glass contains at least one of element Ag or P, Te, and V.

Abstract: There is disclosed a heat-insulating member including a pair of substrates and an airtight sealing part, in which the airtight sealing part is formed in an outer peripheral part between the pair of substrates to form a space between the pair of substrates, the space being in a vacuum or reduced pressure state, a sealing material that forms the airtight sealing part includes a low-melting glass, and the low-melting glass contains a vanadium oxide, barium oxide, phosphorus oxide, and tungsten oxide, in which the following two relational expressions are satisfied in terms of oxide contents: V2O5+BaO+P2O5+WO3?90 and V2O5>BaO>P2O5>WO3 (wherein unit: mol %). Thereby, influence on environmental impact can be reduced and maintenance of airtightness and an improvement in acid resistance can be achieved.

Abstract: Provided is a physical quantity measurement device in which a bonding temperature of a bonding layer is lowered to a temperature not affecting an operation of a semiconductor chip and an insulating property of the semiconductor chip and a base is secured. The physical quantity measurement device includes a base (diaphragm), a semiconductor chip (strain detection element) to measure a physical quantity on the basis of stress acting on the base, and a bonding layer to bond the semiconductor chip to the base. The bonding layer has a first bonding layer bonded to the semiconductor chip, a second bonding layer bonded to the base, and an insulating base material disposed between the first bonding layer and the second bonding layer. The first and second bonding layers and contain glass.

Abstract: An object of the present invention is to provide a multi-layer glass with high degree of vacuum and high mass productivity. In order to achieve the object, the multi-layer glass according to the present invention includes a first glass substrate, a second glass substrate disposed facing the first glass substrate with a space therebetween, a sealing portion, which contains a glass composition and is disposed in a peripheral edge portion of the space between the first glass substrate and the second glass substrate, and column members disposed between the first glass substrate and the second glass substrate, wherein the column member is made of a metal or alloy, and a melting point of the metal or alloy is higher than a softening point of the glass composition and is lower than or equal to a temperature 20° C. higher than a flow point of the glass composition.

Abstract: The present invention aims at providing a lead-free glass composition that can be soften and flowed at a firing temperature that is equal to or lower than that of conventional low melting point lead glass. Furthermore, the present invention aims at providing a lead-free glass composition having fine thermal stability and fine chemical stability in addition to that property. The lead-free glass composition according to the present invention is characterized by comprising at least Ag2O, V2O5 and TeO2 when the components are represented by oxides, wherein the total content ratio of Ag2O, V2O5 and TeO2 is 75 mass % or more. Preferably, the lead-free glass composition comprises 10 to 60 mass % of Ag2O, 5 to 65 mass % of V2O5, and 15 to 50 mass % of TeO2.