Patents by Inventor Takuya Satoh
Takuya Satoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240097013Abstract: Provided is a semiconductor device capable of reducing switching loss at turn-off while suppressing conduction loss. An emitter p? layer 11, a collector p layer 23, a drift layer 10, an emitter electrode 18, a collector electrode 28, an emitter-side gate electrode 17, an emitter n layer 12, a collector p? layer 23a, a collector-side gate electrode 27, and a collector n layer 22 configure a semiconductor device 1, and a total length of a first facing region of the emitter-side gate electrode 17 in a gate width direction facing an emitter layer p? 11 via a gate insulating film 15 is longer than the total length in the gate width direction of a second facing region of a collector-side gate electrode 27 facing an impurity layer 23a via a collector-side gate insulating film 25.Type: ApplicationFiled: November 16, 2021Publication date: March 21, 2024Inventors: Toshiro Hiramoto, Takuya Saraya, Kiyoshi Takeuchi, Kazuo Itou, Toshihiko Takakura, Munetoshi Fukui, Shinichi Suzuki, Katsumi Satoh, Tomoko Matsudai
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Patent number: 11062731Abstract: Approaches to pre-forming solder bumps, such as for use in electrically connecting a head slider and a suspension assembly for a hard disk drive, involves applying a height stabilizer plate over a shared solder paste applied over a substrate housing electrode pads, and reflowing the solder paste with the plate applied to create solder bumps electrically coupled to the pads. Use of such a plate functions to stabilize and contain the solder paste and create uniform solder bumps across the series of pads, where the plate may be composed of a heat-resistant and anti-solder-wetting material. The solder bump pre-forming techniques generally enable solder bonding of extremely small electrical interconnection pads.Type: GrantFiled: May 11, 2020Date of Patent: July 13, 2021Assignee: Western Digital Technologies, Inc.Inventors: Takuya Satoh, Yuhsuke Matsumoto, Hiroyasu Tsuchida, Kouji Takei
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Patent number: 10062741Abstract: A method of manufacturing joined body including: firstly, putting sheet material in intimate contact with first substrate to cover, with resin layer of sheet material, areas of first substrate including first area, boundary area surrounding first area, and second area located across from first area with respect to boundary area, sheet material being laminate including resin layer and separable layer, resin layer containing uncured sealing resin; secondly, curing sealing resin in part of resin layer covering boundary area; thirdly, removing, along with separable layer, part of resin layer covering second area in one direction from one end towards the other of two ends of second area; and fourthly, joining first substrate and second substrate together by arranging second substrate to face first substrate and curing sealing resin with parts of resin layer covering boundary area and first area located between second substrate and first substrate.Type: GrantFiled: August 2, 2013Date of Patent: August 28, 2018Assignee: JOLED INC.Inventors: Hiroko Okumura, Takuya Satoh
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Publication number: 20170094413Abstract: To provide a soundboard speaker of a digital piano that displays more favorable acoustics by devising the arrangement of the vibration unit and ribs. In a soundboard speaker of a digital piano which transmits vibration generated by a vibration unit mounted at one face side of a diaphragm by ribs Ka to Kd mounted at the other face side of the diaphragm so that sound is produced from the whole of the diaphragm, the vibration unit disposed at a position to overlap the rib Kb when the soundboard speaker is viewed head on. The diaphragm in a horizontally long rectangular shape, and the ribs Ka to Kd consisting of prismatic members are disposed on the surface of the diaphragm parallel to each other and in an inclined manner with respect to the vertical direction.Type: ApplicationFiled: August 18, 2016Publication date: March 30, 2017Inventor: Takuya Satoh
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Patent number: 9356253Abstract: An organic electroluminescent element including: a lower electrode; an organic functional layer on the lower electrode; and an upper electrode on the organic functional layer, wherein profile of an upper surface of the upper electrode has a skewness of between ?0.5 and 0.7 inclusive.Type: GrantFiled: March 8, 2013Date of Patent: May 31, 2016Assignee: JOLED INC.Inventors: Masaki Aonuma, Takuya Satoh
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Patent number: 9312488Abstract: A method of forming an upper electrode in an organic electroluminescent element is provided. A first film made of a material for the upper electrode is formed on an organic functional layer by magnetron sputtering under a first condition. Thereafter, a second film made of the material for the upper electrode is formed on the first film by magnetron sputtering under a second condition different from the first condition. The second film has a lower film stress than the first film.Type: GrantFiled: March 8, 2013Date of Patent: April 12, 2016Assignee: JOLED INC.Inventors: Masaki Aonuma, Takuya Satoh, Akira Takiguchi, Yoichiro Yashiro
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Patent number: 9305524Abstract: An electronic musical instrument capable of suppressing resonance of a soundboard and reducing a peak dip of the frequency characteristic of a musical tone to enable excellent musical sound to be obtained. The soundboard has first and second ends which extend parallel to each other. The first and second ends are secured to a predetermined part of the instrument by first screws and second screws. A vibration exciter is provided on the soundboard and driven according to a musical tone signal to vibrate the soundboard to cause the soundboard to generate a musical tone. The first and second screws are arranged along the respective first and second ends in a staggered manner such that each first screw and each first screw are not opposed to each other in symmetrical relation in a direction orthogonal to the first and second ends.Type: GrantFiled: August 25, 2015Date of Patent: April 5, 2016Assignee: Kabushiki Kaisha Kawai Gakki SeisakushoInventor: Takuya Satoh
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Publication number: 20160071497Abstract: An electronic musical instrument capable of suppressing resonance of a soundboard and reducing a peak dip of the frequency characteristic of a musical tone to enable excellent musical sound to be obtained. The soundboard has first and second ends which extend parallel to each other. The first and second ends are secured to a predetermined part of the instrument by first screws and second screws. A vibration exciter is provided on the soundboard and driven according to a musical tone signal to vibrate the soundboard to cause the soundboard to generate a musical tone. The first and second screws are arranged along the respective first and second ends in a staggered manner such that each first screw and each first screw are not opposed to each other in symmetrical relation in a direction orthogonal to the first and second ends.Type: ApplicationFiled: August 25, 2015Publication date: March 10, 2016Inventor: Takuya Satoh
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Patent number: 9240171Abstract: An electronic musical instrument capable of providing spatially spread and dynamic musical tones by causing mutual resonance of first and second vibration exciters for vibrating an opposition board and a soundboard opposed to each other, respectively. A first vibration exciter provided on a surface, opposed to a soundboard, of a opposition board, and driven according to a musical tone signal, for vibrating the opposition board to generate a musical tone, and a second vibration exciter provided on a surface, opposed to the opposition board, of the soundboard and driven according to the musical tone signal for vibrating the soundboard to generate a musical tone is connected by a connecting member for causes the first and second vibration exciters to resonate with each other.Type: GrantFiled: August 25, 2015Date of Patent: January 19, 2016Assignee: Kabushiki Kaisha Kawai Gakki SeisakushoInventor: Takuya Satoh
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Patent number: 9218798Abstract: Provided is a voice assist device in an electronic musical instrument in which tone selection or a sound setting corresponding to a key is performed in advance by pressing the operation button 1 while pressing one of the keys in the keyboard 2, including a changed state recognizing unit 3 that recognizes from a pressed key a changed state of tone selection or a sound setting determined corresponding to the key in advance, a setting item name storing unit 4 that stores a setting item name of the tone selection or sound setting as voice data, and a sound emitting unit 5 that emits a setting item name corresponding to the changed state, and the changed state recognizing unit 3 includes a voice assist recognizing unit 6 that detects a depression for a preset time or more of the operation button 1 prior to a depression of the key.Type: GrantFiled: August 5, 2015Date of Patent: December 22, 2015Assignee: KAWAI MUSICAL INSTRUMENTS MANUFACTURING CO., LTD.Inventors: Takuya Satoh, Kohtaro Ilimura, Sachie Ilimura
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Patent number: 9196861Abstract: An organic EL element is provided having a pair of electrodes and an organic functional layer disposed therebetween, the pair of electrodes consisting of an upper electrode and a lower electrode. In the pair of electrodes, the upper electrode includes a first layer and a second layer, the first layer being in contact with the organic functional layer and the second layer being in contact with the first layer. Additionally, the first layer has a higher membrane stress than the organic functional layer and the second layer. Furthermore, the first layer has a crystalline structure and the second layer has a non-crystalline structure.Type: GrantFiled: May 8, 2015Date of Patent: November 24, 2015Assignee: JOLED INC.Inventors: Masaki Aonuma, Takuya Satoh, Yoichiro Yashiro
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Publication number: 20150243924Abstract: An organic EL element is provided having a pair of electrodes and an organic functional layer disposed therebetween, the pair of electrodes consisting of an upper electrode and a lower electrode. In the pair of electrodes, the upper electrode includes a first layer and a second layer, the first layer being in contact with the organic functional layer and the second layer being in contact with the first layer. Additionally, the first layer has a higher membrane stress than the organic functional layer and the second layer. Furthermore, the first layer has a crystalline structure and the second layer has a non-crystalline structure.Type: ApplicationFiled: May 8, 2015Publication date: August 27, 2015Applicant: JOLED INC.Inventors: Masaki AONUMA, Takuya SATOH, Yoichiro YASHIRO
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Patent number: 9089036Abstract: A light-emitting device comprises a substrate, a light-emitting layer, a wire formed on the substrate and supplying electric power to the light-emitting layer; a transition metal oxide layer formed on the substrate and over the wire; a bank formed on the transition metal oxide layer defining an opening over the wire; an interception layer formed on a portion of the transition metal oxide layer that is exposed through the opening and intercepting migrating fluorine; an organic layer formed on the interception layer and doped with an alkali metal; and an electrode formed on the organic layer, electrically connected to the wire via the organic layer, the interception layer, and the transition metal oxide layer, and providing the electric power supplied by the wire to the organic layer.Type: GrantFiled: November 8, 2012Date of Patent: July 21, 2015Assignee: JOLED INCInventors: Takuya Satoh, Kenichi Nendai
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Patent number: 9054316Abstract: A method of manufacturing an organic EL element includes: a first step of forming a lower electrode on a substrate; a second step of forming an organic functional layer on the lower electrode; and a third step of forming an upper electrode on the organic functional layer, wherein the third step includes: a first film-forming step of forming a thin film on the organic functional layer by magnetron sputtering, the thin film being formed of material of the upper electrode; and a second film-forming step of forming, after the first film-forming step, another thin film by a film-forming process different from the magnetron sputtering on the thin film formed in the first film-forming step, said another thin film being formed of the material of the upper electrode.Type: GrantFiled: November 8, 2012Date of Patent: June 9, 2015Assignee: JOLED INC.Inventors: Masaki Aonuma, Takuya Satoh, Yoichiro Yashiro
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Publication number: 20150054006Abstract: A method of manufacturing joined body including: firstly, putting sheet material in intimate contact with first substrate to cover, with resin layer of sheet material, areas of first substrate including first area, boundary area surrounding first area, and second area located across from first area with respect to boundary area, sheet material being laminate including resin layer and separable layer, resin layer containing uncured sealing resin; secondly, curing sealing resin in part of resin layer covering boundary area; thirdly, removing, along with separable layer, part of resin layer covering second area in one direction from one end towards the other of two ends of second area; and fourthly, joining first substrate and second substrate together by arranging second substrate to face first substrate and curing sealing resin with parts of resin layer covering boundary area and first area located between second substrate and first substrate.Type: ApplicationFiled: August 2, 2013Publication date: February 26, 2015Applicant: PANASONIC CORPORATIONInventors: Hiroko Okumura, Takuya Satoh
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Publication number: 20140374725Abstract: An organic electroluminescent element including: a lower electrode; an organic functional layer on the lower electrode; and an upper electrode on the organic functional layer, wherein profile of an upper surface of the upper electrode has a skewness of between ?0.5 and 0.7 inclusive.Type: ApplicationFiled: March 8, 2013Publication date: December 25, 2014Inventors: Masaki Aonuma, Takuya Satoh
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Publication number: 20140349432Abstract: Forming an upper electrode included in an organic electroluminescent element includes: forming a first film made of a material for the upper electrode on an organic functional layer by magnetron sputtering under a first condition; and forming a second film made of the material for the upper electrode on the first film by magnetron sputtering under a second condition different from the first condition, the second film having a lower film stress than the first film.Type: ApplicationFiled: March 8, 2013Publication date: November 27, 2014Inventors: Masaki Aonuma, Takuya Satoh, Akira Takiguchi, Yoichiro Yashiro
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Publication number: 20140077188Abstract: A method of manufacturing an organic EL element includes: a first step of forming a lower electrode on a substrate; a second step of forming an organic functional layer on the lower electrode; and a third step of forming an upper electrode on the organic functional layer, wherein the third step includes: a first film-forming step of forming a thin film on the organic functional layer by magnetron sputtering, the thin film being formed of material of the upper electrode; and a second film-forming step of forming, after the first film-forming step, another thin film by a film-forming process different from the magnetron sputtering on the thin film formed in the first film-forming step, said another thin film being formed of the material of the upper electrode.Type: ApplicationFiled: November 8, 2012Publication date: March 20, 2014Applicant: PANASONIC CORPORATIONInventors: Masaki Aonuma, Takuya Satoh, Yoichiro Yashiro
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Publication number: 20130256281Abstract: A solder-jet nozzle for laser-soldering head-connection pads of a head-stack assembly (HSA) for a hard-disk drive (HDD). The solder-jet nozzle includes a body, a central duct, and an outer surface of the body. The body includes a tip configured to deliver a solder ball in proximity to head-connection pads of a head-gimbal assembly (HGA) of the HSA. The central duct is configured to convey the solder ball to the tip. The outer surface of the body includes a first portion, and at least a first flat. The first portion substantially coincides with a conical surface of a cone with axis disposed about along the central axis of the body. The first flat, which is parallel to the central axis, is contiguous with the first portion, and intersects the conical surface of the cone. A laser-soldering tool and a method, for laser-soldering head-connection pads of the HSA are also provided.Type: ApplicationFiled: March 30, 2012Publication date: October 3, 2013Inventors: Tatsumi Tsuchiya, Nobuyuki Hashi, Yusuke Matsumoto, Takuya Satoh
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Patent number: 8099862Abstract: An apparatus for detaching a head slider bonded onto a mounting plate of a suspension includes a platform on which a head gimbal assembly is mounted; a heating device for heating a joint section between the head slider and the suspension to decrease the bonding force; a latching part for latching the mounting plate at a position on a center line of the mounting plate in the lengthwise direction and/or at positions symmetric about the center line; and a clamp device for moving the head slider in a direction along the center line with the heating to detach the head slider from the mounting plate.Type: GrantFiled: September 25, 2008Date of Patent: January 24, 2012Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Yoshio Uematsu, Kenjirou Watanabe, Takuya Satoh