Abstract: A solder-jet nozzle for laser-soldering head-connection pads of a head-stack assembly (HSA) for a hard-disk drive (HDD). The solder-jet nozzle includes a body, a central duct, and an outer surface of the body. The body includes a tip configured to deliver a solder ball in proximity to head-connection pads of a head-gimbal assembly (HGA) of the HSA. The central duct is configured to convey the solder ball to the tip. The outer surface of the body includes a first portion, and at least a first flat. The first portion substantially coincides with a conical surface of a cone with axis disposed about along the central axis of the body. The first flat, which is parallel to the central axis, is contiguous with the first portion, and intersects the conical surface of the cone. A laser-soldering tool and a method, for laser-soldering head-connection pads of the HSA are also provided.

Abstract: An apparatus for detaching a head slider bonded onto a mounting plate of a suspension includes a platform on which a head gimbal assembly is mounted; a heating device for heating a joint section between the head slider and the suspension to decrease the bonding force; a latching part for latching the mounting plate at a position on a center line of the mounting plate in the lengthwise direction and/or at positions symmetric about the center line; and a clamp device for moving the head slider in a direction along the center line with the heating to detach the head slider from the mounting plate.

Abstract: A rail manufacturing method is provided, in which a billet is hot-rolled into a rail form and the rail is cooled to ambient temperature. The foot part of the rail can be mechanically restrained to improve the straightness of the rail during at least the period of cooling where the surface temperature is between 800° C. and 400° C. In the subsequent cooling process, at least while the surface temperature of the foot of the rail is between 400° C. and 250° C., the rail is kept in an upright state, and cooled naturally without using insulation or accelerated cooling.

Abstract: It is an object of the present invention to provide a solar cell, and a method for manufacturing the same, that includes a layer having Zn, Mg, and O, and with which an increase in efficiency can be achieved. The solar cell includes a first electrode layer, a second electrode layer, a p-type semiconductor layer disposed between the first electrode layer and the second electrode layer, and a layer A disposed between the second electrode layer and the p-type semiconductor layer, the layer A includes Zn, Mg, O, and at least one element M selected from Ca, Sr, Ba, Al, In, and Ga, and photoelectromotive force is generated due to light that is incident from the second electrode layer side.

Abstract: Embodiments of the present invention help to prevent deformation of a gimbal in detaching a head slider from a suspension. In an embodiment of the present invention, after a head slider has been mounted on a suspension, a test on the assembly is conducted. If a defect head slider is found in the test, the head slider is detached from the suspension. The head slider is discarded but the suspension is reused and a new head slider is mounted on the suspension. In detaching the head slider, a pin inserted in a through-hole on the center line of a gimbal tongue latches the gimbal tongue.

Abstract: Embodiments of the invention relate to making reconnection when a soldered connection fails in a head/slider used in a magnetic disk drive. In one embodiment, a solder mass deposited on a slider pad of a head/slider is separated from a lead pad and a solder ball connection is yet to be made between the slider pad and the lead pad. A shaping tip is heated to a temperature near a melting point of a solder. The shaping tip is moved in parallel with a surface of the slider pad toward the side of the lead pad to soften the solder mass. The solder mass is thereafter irradiated with a laser beam so as to form a solder fillet, thereby making a soldered connection between the lead pad and the slider pad.

Abstract: It is an object of the present invention to provide a solar cell, and a method for manufacturing the same, that includes a layer having Zn, Mg, and O, and with which an increase in efficiency can be achieved. The solar cell includes a first electrode layer, a second electrode layer, a p-type semiconductor layer disposed between the first electrode layer and the second electrode layer, and a layer A disposed between the second electrode layer and the p-type semiconductor layer, the layer A includes Zn, Mg, O, and at least one element M selected from Ca, Sr, Ba, Al, In, and Ga, and photoelectromotive force is generated due to light that is incident from the second electrode layer side.

Abstract: A rail manufacturing method is provided, in which a billet is hot-rolled into a rail form and the rail is cooled to ambient temperature. The foot part of the rail can be mechanically restrained to improve the straightness of the rail during at least the period of cooling where the surface temperature is between 800° C. and 400° C. In the subsequent cooling process, at least while the surface temperature of the foot of the rail is between 400° C. and 250° C., the rail is kept in an upright state, and cooled naturally without using insulation or accelerated cooling.

Abstract: A method for removing a lead-free solder from a slider pad is provided to permit re-utilization of a head/slider used in a magnetic disk drive. In one embodiment, a slider pad formed on a head/slider and a lead pad are connected to each other through a lead-free solder fillet. A cutting tool is heated beforehand to a temperature near the melting point of the lead-free solder. The cutting tool is moved in parallel with a surface of the slider pad to cut the solder fillet while softening the solder fillet. The solder fillet is removed so as not to impose a stress on the slider pad and in a state in which the head/slider can be re-utilized.

Abstract: Disclosed are methods of producing steel rails having a high carbon content and being excellent in wear resistance and ductility from the slabs for rails. One method involves producing a steel rail having a high content of carbon, comprising finish rolling the rail in two consecutive passes, with a reduction rate per pass of a cross-section of the rail of 2-30%, wherein the conditions of the finish rolling satisfy the following relationship: S?800/(C×T), wherein S is the maximum rolling interval time (seconds), C is the carbon content of the steel, wherein the carbon content is 0.85-1.40 mass %, and T is the maximum surface temperature (° C.) of the rail head.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: A compound semiconductor film is formed with a compound containing: A. at least one element selected from zinc, tin, cadmium, indium, and gallium; B. at least one element selected from oxygen and sulfur; and C. an element of Group IIa. A solar cell is configured to include: a substrate (11); a conductive layer (12) formed on the substrate (11); a light-absorption layer (13) that is formed on the conductive layer (12) with a compound semiconductor containing an element of Group Ib, an element of Group IIIa, and an element of Group VIa; the above-described compound semiconductor film (14) formed on the light-absorption layer (13); and a transparent conductive layer (16) formed on the compound semiconductor film (14). Such a configuration provides a compound semiconductor film having a low electric resistivity. Further by employing the compound semiconductor film having a low electric resistivity as a buffer layer of a solar cell, the energy conversion efficiency of the solar cell is improved.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: A solar cell including a light-absorption layer of a compound semiconductor with a chalcopyrite crystal structure and having excellent characteristics such as conversion efficiency is provided. The solar cell includes a first electrode layer, a second electrode layer, a p-type semiconductor layer interposed between the first electrode layer and the second electrode layer, and an n-type semiconductor layer interposed between the p-type semiconductor layer and the second electrode layer. The p-type semiconductor layer includes a compound semiconductor containing a group Ib element, a group IIIb element and a group VI element and having a chalcopyrite structure. The bandgap of the p-type semiconductor layer increases from the n-type semiconductor layer side to the first electrode layer side monotonically. The bandgap of the p-type semiconductor layer on the main surface at the n-type semiconductor layer side is at least 1.

Abstract: Embodiments of the invention relate to making reconnection when a soldered connection fails in a head/slider used in a magnetic disk drive. In one embodiment, a solder mass deposited on a slider pad of a head/slider is separated from a lead pad and a solder ball connection is yet to be made between the slider pad and the lead pad. A shaping tip is heated to a temperature near a melting point of a solder. The shaping tip is moved in parallel with a surface of the slider pad toward the side of the lead pad to soften the solder mass. The solder mass is thereafter irradiated with a laser beam so as to form a solder fillet, thereby making a soldered connection between the lead pad and the slider pad.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: A method for removing a lead-free solder from a slider pad is provided to permit re-utilization of a head/slider used in a magnetic disk drive. In one embodiment, a slider pad formed on a head/slider and a lead pad are connected to each other through a lead-free solder fillet. A cutting tool is heated beforehand to a temperature near the melting point of the lead-free solder. The cutting tool is moved in parallel with a surface of the slider pad to cut the solder fillet while softening the solder fillet. The solder fillet is removed so as not to impose a stress on the slider pad and in a state in which the head/slider can be re-utilized.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: A cooling water pump device for drawing cooling water from bottom of a pump case and pumping it toward an engine located above includes: a multiple number of annular seal elements surrounding the driveshaft for keeping the interface between the inner peripheral surface of a resin pump case and a metal sleeve watertight, arranged between the inner peripheral surface of the resin pump case and the metal sleeve, at plural positions vertically apart with respect to the axial direction of the driveshaft.