Abstract: A solar cell includes a conductive substrate, and an insulating layer, a conducting layer and a semiconductor layer that are disposed on the substrate. A through hole is formed so as to penetrate the insulating layer and the conducting layer, and the through hole is filled with a semiconductor that composes the semiconductor layer. At least one element selected from the elements composing the conductive substrate diffuses into the semiconductor with which the through hole is filled.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: A semiconductor film has a composition in which a Group Ia element and a Group Vb element are added to a compound semiconductor with a chalcopyrite structure containing a Group Ib element, a Group IIIb element and a Group VIb element. This allows the provision of a semiconductor film whose carrier density can be controlled effectively. A solar cell of the present invention includes: a substrate and the semiconductor film of the present invention that is provided as a light-absorption layer on the substrate. With this configuration, a light-absorption layer whose carrier density can be controlled effectively can be provided, so that a solar cell having a high energy conversion efficiency can be provided.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: A head gimbal assembly, which is a component of a hard disk drive, has a bending portion that has elasticity and is bent at a predetermined angle under an unloaded condition, and a slider is bonded to a holding portion thereof by mounting the head gimbal assembly on a bonding jig in a state in which the bending portion is stretched. When the head gimbal assembly is separated from the bonding jig after bonding, the bending portion is not restored freely, so that the head gimbal assembly is caught by the bonding jig during the separating process and a locked state is sometimes established.

Abstract: It is an object of the present invention to provide a solar cell, and a method for manufacturing the same, that includes a layer having Zn, Mg, and O, and with which an increase in efficiency can be achieved. The solar cell includes a first electrode layer, a second electrode layer, a p-type semiconductor layer disposed between the first electrode layer and the second electrode layer, and a layer A disposed between the second electrode layer and the p-type semiconductor layer, the layer A includes Zn, Mg, O, and at least one element M selected from Ca, Sr, Ba, Al, In, and Ga, and photoelectromotive force is generated due to light that is incident from the second electrode layer side.

Abstract: A cooling water pump device for drawing cooling water from bottom of a pump case and pumping it toward an engine located above includes: a multiple number of annular seal elements surrounding the driveshaft for keeping the interface between the inner peripheral surface of a resin pump case and a metal sleeve watertight, arranged between the inner peripheral surface of the resin pump case and the metal sleeve, at plural positions vertically apart with respect to the axial direction of the driveshaft.

Abstract: A damping composition contains a base material in the form of a mixture of ethylene-methacrylate copolymer and rosin resin, and an active ingredient contained in the base material for increasing the dipole moment of the base material. The weight ratio of ethylene-methacrylate copolymer and rosin resin (EM:rosin) is 70:30 to 30:70.

Abstract: An apparatus joins bonding pads of a slider and lead pads of lead wires in a head gimbals assembly to improve efficiency, downsizing, and maintenance of solder-ball disposing devices, and solder-ball reflow devices for reflowing solder balls. The solder-ball disposing apparatus discharges solder balls from solder-ball discharging holes of a solder-ball feeder unit which are evacuated by a suction pad. An environmental space and an inert-gas supply portion for forming inactive atmosphere are formed on a table to eliminate an inert-gas supply unit from an optical unit, so that converged laser beams are directly radiated onto the solder balls.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: In devices for solder-ball bonding of a bonding pad of a slider of a head gimbal assembly to a lead pad of a lead, although a device that can perform (1) the supply of solder balls, (2) the positioning of a solder ball, (3) the blowing of nitrogen gas N2, and (4) the melting of the solder ball by laser radiation in one device is available, there are various problems that cannot improve the efficiency of laser radiation, maintenance, or operation efficiency, due to spatial restriction, difficulty of weight reduction, or fixed operation procedures. A solder-ball holder and an optical device are configured separately, and a vacuum pad is provided. A solder ball held in a solder-ball holding hole of the solder-ball holder is transported by the vacuum pad to a connecting portion of a head gimbal assembly, and solder reflow is carried out by the optical device.

Abstract: A solar cell includes a first semiconductor layer that is p-type, and a second semiconductor layer that is n-type formed over the first semiconductor layer. The solar cell includes a layer A made of a semiconductor different from the first semiconductor layer and the second semiconductor layer or an insulator between the first semiconductor layer and the second semiconductor layer. The band gap Eg1 of the first semiconductor layer and the band gap Eg2 of the second semiconductor layer satisfy the relationship Eg1<Eg2. The electron affinity &khgr;1 (eV) of the first semiconductor layer and the electron affinity &khgr;2 (eV) of the second semiconductor layer satisfy the relationship 0≦(&khgr;1−&khgr;2)<0.5, and the average layer thickness of the layer A is 1 nm or more and 20 nm or less.

Abstract: A method and an apparatus for manufacturing a highly-versatile solar cell with excellent yields and productivity are provided. The method includes forming a belt-like first electrode layer on a substrate, forming a belt-like semiconductor layer on the first electrode layer, and forming a belt-like second electrode layer on the semiconductor layer. At least one electrode layer selected from the first electrode layer and the second electrode layer is divided by (a) applying a liquid resist so as to form a striped resist pattern, (b) forming the at least one electrode layer so as to cover the resist pattern, and (c) removing both the resist pattern and the at least one electrode layer formed on the resist pattern.

Abstract: In devices for solder-ball bonding of a bonding pad of a slider of a head gimbal assembly to a lead pad of a lead, although a device that can perform (1) the supply of solder balls, (2) the positioning of a solder ball, (3) the blowing of nitrogen gas N2, and (4) the melting of the solder ball by laser radiation in one device is available, there are various problems that cannot improve the efficiency of laser radiation, maintenance, or operation efficiency, due to spatial restriction, difficulty of weight reduction, or fixed operation procedures. A solder-ball holder and an optical device are configured separately, and a vacuum pad is provided. A solder ball held in a solder-ball holding hole of the solder-ball holder is transported by the vacuum pad to a connecting portion of a head gimbal assembly, and solder reflow is carried out by the optical device.