Abstract: According to one embodiment of the present invention, a computer-implemented method for autocorrelation based security monitoring and detection is disclosed. The computer-implemented method includes determining that input signal data transmitted to a white noise generator autocorrelates with itself at one or more time lags. The computer-implemented method further includes, responsive to determining that the input signal data transmitted to the white noise generator autocorrelates with itself at one or more time lags, determining whether an autocorrelation in the input signal data transmitted to the white noise generator matches one or more predetermined input signal data patterns associated with a known event or individual.

Abstract: In an example, an article of manufacture includes a composite material. The composite material includes hollow glass filaments that are encapsulated within a polymeric matrix material. The hollow glass filaments are at least partially filled with the polymeric matrix material.

Abstract: An electrical apparatus that includes: an electronic substrate having a plurality of pads for connecting to an electronic component placed on the electronic substrate; a shield placed on a surface of the electronic substrate, the shield having a plurality of openings with the plurality of openings aligned over the plurality of pads and at least a portion of each of the plurality of openings being conductive; connection means to connect the conductive portions of each of the plurality of openings to a fault detect and error handling circuit; and the fault detect and error handling circuit to detect a short circuit between at least one of the conductive portions and the pad aligned with the opening containing the at least one of the conductive portions.

Abstract: Provided is an apparatus comprising a conductive particle interconnect (CPI) and an electroactive polymer (EAP) structure. The CPI includes an elastomeric carrier and a plurality of conductive particles dispersed therein. The EAP structure is disposed around at least a portion of the CPI. The EAP structure is configured to move between a first position and a second position in response to an electrical field. The CPI is configured to exhibit a first electrical resistance when the EAP structure is in the first position and a second, different electrical resistance when the EAP structure is in the second position.

Abstract: Provided is an apparatus comprising a conductive particle interconnect (CPI). The CPI includes an elastomeric carrier and a plurality of conductive particles dispersed therein. The elastomeric carrier includes an electroactive polymer (EAP) configured to move between a first position and a second position in response to an electrical field. The CPI is configured to exhibit a first electrical resistance when the EAP is in the first position and a second electrical resistance when the EAP is in the second position. The apparatus further comprises one or more electrodes electrically coupled to the CPI. The electrodes are configured to generate the electrical field within the CPI. The apparatus further comprises one or more insulators coupled to the CPI. The one or more insulators are configured to constrain expansion of the CPI in at least one direction.

Abstract: A process of utilizing a water-sensitive fluorophore for moisture content evaluation in a hygroscopic polymer includes forming a blend that includes a hygroscopic polymer resin and a water-sensitive fluorophore. The process includes forming pellets having a particular geometry from the blend, determining fluorescence properties of at least one of the pellets, and determining moisture content of at least one of the pellets. The process also includes generating a calibration curve for the particular pellet geometry by correlating the fluorescence properties with the moisture content. The process further includes providing the calibration curve for non-destructive moisture content evaluation of a material derived from the pellets.

Abstract: Provided is an apparatus comprising a conductive particle interconnect (CPI). The CPI includes an elastomeric carrier and a plurality of conductive particles dispersed therein. The elastomeric carrier includes an electroactive polymer (EAP) configured to move between a first position and a second position in response to an electrical field. The CPI is configured to exhibit a first electrical resistance when the EAP is in the first position and a second electrical resistance when the EAP is in the second position. The apparatus further comprises one or more electrodes electrically coupled to the CPI. The electrodes are configured to generate the electrical field within the CPI. The apparatus further comprises one or more insulators coupled to the CPI. The one or more insulators are configured to constrain expansion of the CPI in at least one direction.

Abstract: Provided is an apparatus comprising a conductive particle interconnect (CPI) and an electroactive polymer (EAP) structure. The CPI includes an elastomeric carrier and a plurality of conductive particles dispersed therein. The EAP structure is disposed around at least a portion of the CPI. The EAP structure is configured to move between a first position and a second position in response to an electrical field. The CPI is configured to exhibit a first electrical resistance when the EAP structure is in the first position and a second, different electrical resistance when the EAP structure is in the second position.

Abstract: Method, apparatus, and computer program product are provided for determining a maximum temperature to which a perishable good or other temperature sensitive item was exposed. In some embodiments, a capacitance of a circuit provided on a substrate is measured. The circuit includes capacitor(s) each having first and second plates separated from each other by an ionic liquid (IL) in a solid state. The IL melts at a predetermined temperature and flows away from the first and second plates into a void. In some embodiments, the predetermined temperature at which the IL melts is different for each capacitor. For example, each capacitor in the circuit may employ a different N-alkyl bezothiazolium salt. A maximum temperature of exposure is determined based on the measured capacitance. In some embodiments, a decision of whether to discard the perishable good or other temperature sensitive item may be based on the determined maximum temperature.

Abstract: A multilayer component is coated with a fluorogenic probe designed to give off florescence when in contact with one or more metals in the multilayer component. The fluorogenic probe is exposed to radiation. The intensity and wavelength of the florescence is measured to determine a porosity of the one or more layers of the multilayer component.

Abstract: A device, method, and article of manufacture for corrosion monitoring are disclosed. The device includes a corrodible component and a silicone layer positioned over the corrodible component. The method includes providing a corrosion monitoring assembly having a corrodible component and a silicone layer positioned over the corrodible component. The article of manufacture includes a corrosion monitoring assembly having a corrodible component and a silicone layer positioned over the corrodible component.

Abstract: A composite material incorporates multi-compartment microcapsules that produce heat when subject to a stimulus such as a compressive force or a magnetic field. The stimulus ruptures an isolating structure within the multi-compartment microcapsule, allowing reactants within the multi-compartment microcapsule to produce heat from an exothermic reaction. In some embodiments, the composite material is a laminate used in the manufacture of multi-layer printed circuit boards (PCBs) and provides heat during the curing process of the multi-layer PCBs to ensure a consistent thermal gradient in the multi-layer product.

Abstract: A self-heating thermal interface material (TIM) may be formed using heating components dispersed within the TIM. The heating components may produce heat when the TIM is compressed. The heating components may be formed from microcapsules and the microcapsules may contain exothermic reactants. The reactants may be isolated from contact within the microcapsule until a compressive force is applied.

Abstract: A security matrix layer between a first and second conductive shorting layers are located within a printed circuit board (PCB). The security matrix layer includes at least two types of microcapsules with each type of microcapsule containing a different reactant. When the security matrix layer is accessed, drilled, or otherwise damaged, the microcapsules rupture and the reactants react to form at least an electrically conductive material. The electrically conductive material may contact and short the first and second conductive shorting layers.

Abstract: An electrical apparatus that includes: an electronic substrate having a plurality of pads for connecting to an electronic component placed on the electronic substrate; a shield placed on a surface of the electronic substrate, the shield having a plurality of openings with the plurality of openings aligned over the plurality of pads and at least a portion of each of the plurality of openings being conductive; connection means to connect the conductive portions of each of the plurality of openings to a fault detect and error handling circuit; and the fault detect and error handling circuit to detect a short circuit between at least one of the conductive portions and the pad aligned with the opening containing the at least one of the conductive portions.

Abstract: A chain-reactive, heat-generating microcapsule comprises a first compartment including a first component and a second compartment including a second component. An isolating structure separates the first and second compartments. The isolating structure may rupture when heated above a normal ambient temperature and/or in response to a compressive force. The first component reacts with the second component to produce heat. The microcapsule may further incorporate a blowing agent that responds to heating. In some embodiments, a core within the first compartment comprises a blowing agent material that responds to the heat produced when the first and second components react. The microcapsules can be incorporated into a material comprising a heat-curable resin precursor such that heat generated by the microcapsules can be used to cure the resin precursor.

Abstract: A multilayer printed circuit board (PCB) includes a laminate between a first core and a second core. The first core is located in a middle position of the multi-layer PCB and includes a resistive heating element directly upon a first core substrate. A portion of the resistive heating element protrudes from the multi-layer PCB perimeter. A laminator that fabricates the PCB includes a platen, a power supply, a processor, and memory that has program instructions embodied therewith which are readable by the processor to cause the laminator to position the platen against a surface of the multi-layer PCB and cure the laminate by heating the multi-layer PCB with the platen and cure the laminate by heating the multi-layer PCB with the resistive heating element.

Abstract: In an embodiment, a method of forming a stub-less via is provided. The method includes depositing a plurality of microcapsules containing a metal material in a via of a printed circuit board (PCB); rupturing the microcapsules and releasing the metal material; and sintering the metal material. In another embodiment, a method of forming a stub-less via is provided. The method includes forming a via in a printed circuit board (PCB); installing a plug in a portion of the via; depositing in the via a plurality of nanoparticles containing a metal material; and sintering the metal material.

Abstract: A process of curing a photo-curable material includes dispersing a microcapsule in a material that includes a photo-initiator and a photo-curable material. The process also includes applying a stimulus to the microcapsule to trigger a chemiluminescent reaction within the microcapsule. The chemiluminescent reaction generating a photon having a wavelength within a particular emission range that is consistent with an absorption range of the photo-initiator. The photon exits the microcapsule to trigger the photo-initiator to initiate or catalyze curing of the photo-curable material.

Abstract: A secured device includes an electronic component and a protective cover surrounding the electronic component. The secured device also includes one or more chemiluminescent reactant layers and a light sensor that is electrically connected to the electronic component. The one or more chemiluminescent reactant layers are disposed between the protective cover and the electronic component and include multiple reactants that undergo a chemiluminescent reaction. The light sensor is configured to trigger one or more tamper response operations responsive to detection of a photon generated by the chemiluminescent reaction.