Abstract: Sulfur contaminants, such as elemental sulfur (S8), hydrogen sulfide and other sulfur components in natural gas liquids (NGLs), diesel fuel and gasoline are removed using a silicone-based chemical filter. In one embodiment, a silicone-based chemical filter includes a membrane having a cross-linked silicone that is a reaction product of an olefin and a polyhydrosiloxane.

Abstract: An apparatus and system for measuring electromagnetic radiation emitted by one or more electronic components included on a first substrate, and an associated method of controlling the emitted radiation. The apparatus includes a cap member having an interior surface and an exterior surface, the interior surface defining an interior cavity and arranged to receive at least a portion of the one or more electronic components within the interior cavity. The apparatus further includes at least one sensor device coupled with the cap member and configured to detect electromagnetic radiation emitted by the one or more electronic components. The apparatus further includes at least one conductive pad disposed on the cap member and coupled with the at least one sensor device, wherein the conductive pad is configured to couple with external circuitry to transmit a sensor signal generated by the at least one sensor device responsive to the detected electromagnetic radiation.

Abstract: A flexible electronic circuit includes a shape memory material disposed within a flexible dielectric material.

Abstract: A chain-reactive, heat-generating microcapsule comprises a first compartment including a first component and a second compartment including a second component. An isolating structure separates the first and second compartments. The isolating structure may rupture when heated above a normal ambient temperature and/or in response to a compressive force. The first component reacts with the second component to produce heat. The microcapsule may further incorporate a blowing agent that responds to heating. In some embodiments, a core within the first compartment comprises a blowing agent material that responds to the heat produced when the first and second components react. The microcapsules can be incorporated into a material comprising a heat-curable resin precursor such that heat generated by the microcapsules can be used to cure the resin precursor.

Abstract: A self-heating sealant or adhesive may be formed using multi-compartment microcapsules dispersed within a sealant or adhesive. The multi-compartment microcapsules produce heat when subjected to a stimulus (e.g., a compressive force, a magnetic field, or combinations thereof). In some embodiments, the multi-compartment microcapsules have first and second compartments separated by an isolating structure adapted to rupture in response to the stimulus, wherein the first and second compartments contain reactants that come in contact and react to produce heat when the isolating structure ruptures. In some embodiments, the multi-compartment microcapsules are shell-in-shell microcapsules each having an inner shell contained within an outer shell, wherein the inner shell defines the isolating structure and the outer shell does not allow the heat-generating chemistry to escape the microcapsule upon rupture of the inner shell.

Abstract: A process of utilizing a water-sensitive fluorophore for moisture content evaluation in a hygroscopic polymer includes forming a blend that includes a hygroscopic polymer resin and a water-sensitive fluorophore. The process includes forming pellets having a particular geometry from the blend, determining fluorescence properties of at least one of the pellets, and determining moisture content of at least one of the pellets. The process also includes generating a calibration curve for the particular pellet geometry by correlating the fluorescence properties with the moisture content. The process further includes providing the calibration curve for non-destructive moisture content evaluation of a material derived from the pellets.

Abstract: A flexible electronic circuit includes a shape memory material disposed within a flexible dielectric material.

Abstract: Embodiments of the disclosure relate to an apparatus and method for mitigation of warping of assembly components when subject to a thermal event. An interface unit with a complementary coefficient of thermal expansion is embodied in the assembly. The interface unit is configured to be received by a connector joined to the assembly substrate. The interface unit has a coefficient of thermal expansion (CTE) that complements the CTE of the assembly components in order to maintain the connector in alignment with the substrate and enable the connector to expand or contract with the substrate when subject to the thermal event.

Abstract: Devices and methods for resisting or preventing physical tampering of electronic components are described. A tamper resistant apparatus comprises a tampering sensor having a surface at which a first and second conductive portion are disposed. A core-shell particle (or a plurality of particles) is disposed on the surface of the tampering sensor. The core-shell particle has a liquid metallic core and a shell surrounding the core. When tampering occurs, forces associated with the tampering cause the core-shell particle to rupture. The released metallic core material can form a conductive pathway between the first and second conductive portions of the tampering sensor. The tampering sensor triggers a security response when the first and second conductive portions are electrically connected to each other by the metallic material from the ruptured core-shell particle(s).

Abstract: A flexible electronic circuit includes a shape memory material disposed within a flexible dielectric material.

Abstract: A self-heating solder flux material includes a solder flux material and a multi-compartment microcapsule. The solder flux material includes a solvent carrier, and the multi-compartment microcapsule includes a first compartment, a second compartment, and an isolating structure. The first compartment contains a first reactant, and the second compartment contains a second reactant. The isolating structure separates the first compartment from the second compartment. The isolating structure is adapted to rupture in response to a stimulus. Rupture of the isolating structure results in an exothermic reaction between the first reactant and the second reactant.

Abstract: Embodiments of the disclosure relate to an apparatus and method for mitigation of warping of assembly components when subject to a thermal event. An interface unit with a complementary coefficient of thermal expansion is embodied in the assembly. The interface unit is configured to be received by a connector joined to the assembly substrate. The interface unit has a coefficient of thermal expansion (CTE) that complements the CTE of the assembly components in order to maintain the connector in alignment with the substrate and enable the connector to expand or contract with the substrate when subject to the thermal event.

Abstract: A tamper resistant device comprises an internal component, such as an electronic device, and a latent battery that is connected to the internal component. An activator material is separated from the latent battery by a rupturable barrier that is adapted to rupture, shatter, or otherwise degrade in response to a stimulus associated with a physical tampering event. The activator material is a material that causes the latent battery to output electrical power when in contact with the latent battery. In some examples, the electrical power provided when the activator material contacts the latent battery is used to trigger a security response which can include transmission of an alarm signal and/or erasure of data stored by the internal component.

Abstract: A tamper resistant device comprises a matrix material and a microcapsule in the matrix material. The microcapsule has a first compartment, a second compartment, and an isolating structure separating the first and second compartments. The isolating structure is rupturable in response to a stimulus, such as temperature increases or compressive forces. The first compartment contains a first component, and the second compartment contains a second component. The first and second components react exothermically (produce heat) when in contact with each other. Thus, in some examples, a temperature change in the device resulting from the rupture of the isolating structure in the microcapsule due to physical tampering efforts can be used to trigger a security response.

Abstract: A shape memory polymer thermal interface material (SMP TIM) pad may be deformed to a deformed SMP TIM pad. The deformed SMP TIM pad may be mated to a first surface of a computing chip. A heat dissipating structure may be mated to the deformed SMP TIM pad opposite of the first surface of the computing chip. A loading force may be applied to the SMP TIM pad. The deformed SMP TIM pad may be heated to a reformation temperature. The heat dissipating structure may be fastened to the computing chip using one or more fasteners.

Abstract: Disclosed aspects relate to managing a set of devices using a set of acoustic emission data which indicates device-health of the set of devices. The set of devices is coupled with a set of acoustic emission sensors. Based on the set of acoustic emission data, a triggering event related to a first device of the set of devices is detected. Using the set of acoustic emission data, an event response which includes a first modification with respect to operation of the first device is determined. Establishment of the event response which includes the first modification with respect to operation of the first device is initiated.

Abstract: Disclosed is a shape memory polymer (SMP) thermal interface material. The shape memory polymer may include a SMP matrix. The SMP matrix may include a liquid crystal elastomer. The SMP material may also include a thermally conductive filler embedded within the SMP matrix. The thermally conductive filler may include one or more substantially aligned subcomponents.

Abstract: Method and apparatus for determining a quality or characteristic of connectors in electronic components is provided. Methods include applying a UV-responsive indicator solution active for Pd, Ni, or Cu to a connector on an electrical component; irradiating the connector with UV radiation; detecting a response to the UV radiation; and determining a quality of the connector based on the response to the UV radiation. Apparatus includes an enclosure; a support; a dispenser oriented toward the substrate support; a source of UV-responsive indicator solution active for Pd, Ni, or Cu ions fluidly coupled to the dispenser; a UV source coupled to the enclosure; and a radiation sensor positioned to detect light inside the enclosure.

Abstract: A self-heating sealant or adhesive may be formed using multi-compartment microcapsules dispersed within a sealant or adhesive. The multi-compartment microcapsules produce heat when subjected to a stimulus (e.g., a compressive force, a magnetic field, or combinations thereof). In some embodiments, the multi-compartment microcapsules have first and second compartments separated by an isolating structure adapted to rupture in response to the stimulus, wherein the first and second compartments contain reactants that come in contact and react to produce heat when the isolating structure ruptures. In some embodiments, the multi-compartment microcapsules are shell-in-shell microcapsules each having an inner shell contained within an outer shell, wherein the inner shell defines the isolating structure and the outer shell does not allow the heat-generating chemistry to escape the microcapsule upon rupture of the inner shell.

Abstract: Certain embodiments of the present disclosure provide a method for soldering a chip onto a surface. The method generally includes forming a bonding pad on the surface on which the chip is to be soldered, wherein the bonding pad is surrounded, at least in part, by dielectric material. The method may also include treating the dielectric material to render the dielectric material superomniphobic, and soldering the chip onto the bonding pad.