Abstract: A multi-layer printed circuit board (PCB) includes a laminate between a PCB heating core and a PCB signal core. The PCB heating core includes an electrically conductive resistive heating element upon a first core substrate. During a lamination cure PCB fabrication stage, a platen contacts the PCB and a power supply is electrically connected to the resistive heating element. The laminate is cured with heat transferred by the platen and heat from the resistive heating element. The PCB heating core may be located within an inner layer of the multi-layer PCB to normalize a thermal gradient across the multi-layer PCB that may otherwise occur during the laminate cure fabrication stage. As a result of the normalized thermal gradient, the degree of laminate cure and material characteristics of the cured laminate material are more consistent throughout the multi-layer PCB thickness.

Abstract: A composite material incorporates multi-compartment microcapsules that produce heat when subject to a stimulus such as a compressive force or a magnetic field. The stimulus ruptures an isolating structure within the multi-compartment microcapsule, allowing reactants within the multi-compartment microcapsule to produce heat from an exothermic reaction. In some embodiments, the composite material is a laminate used in the manufacture of multi-layer printed circuit boards (PCBs) and provides heat during the curing process of the multi-layer PCBs to ensure a consistent thermal gradient in the multi-layer product.

Abstract: Disclosed is a shape memory polymer (SMP) thermal interface material. The shape memory polymer may include a SMP matrix. The SMP matrix may include a liquid crystal elastomer. The SMP material may also include a thermally conductive filler embedded within the SMP matrix. The thermally conductive filler may include one or more substantially aligned subcomponents.

Abstract: Devices and methods for resisting or preventing physical tampering of electronic components are described. A tamper resistant apparatus comprises a tampering sensor having a surface at which a first and second conductive portion are disposed. A core-shell particle (or a plurality of particles) is disposed on the surface of the tampering sensor. The core-shell particle has a liquid metallic core and a shell surrounding the core. When tampering occurs, forces associated with the tampering cause the core-shell particle to rupture. The released metallic core material can form a conductive pathway between the first and second conductive portions of the tampering sensor. The tampering sensor triggers a security response when the first and second conductive portions are electrically connected to each other by the metallic material from the ruptured core-shell particle(s).

Abstract: A tamper resistant device comprises a matrix material and a microcapsule in the matrix material. The microcapsule has a first compartment, a second compartment, and an isolating structure separating the first and second compartments. The isolating structure is rupturable in response to a stimulus, such as temperature increases or compressive forces. The first compartment contains a first component, and the second compartment contains a second component. The first and second components react exothermically (produce heat) when in contact with each other. Thus, in some examples, a temperature change in the device resulting from the rupture of the isolating structure in the microcapsule due to physical tampering efforts can be used to trigger a security response.

Abstract: In an example, an article of manufacture includes a composite material. The composite material includes hollow glass filaments that are encapsulated within a polymeric matrix material. The hollow glass filaments are at least partially filled with the polymeric matrix material.

Abstract: A process includes utilizing a pin array that includes multiple segmented pins for forming selectively plated through holes. The process includes forming a PCB laminate structure that includes multiple spinel-doped core layers and multiple through holes. Each spinel-doped core layer includes a heat-activated spinel material incorporated into a dielectric material. The process includes aligning individual segmented pins of a pin array with corresponding through holes of the PCB laminate structure, where each segmented pin includes heated segment(s) and insulating segment(s). The process includes inserting the segmented pins of the pin array into the corresponding through holes and generating heat within each heated pin segment that is sufficient to form metal nuclei sites in selected regions of the spinel-doped core layers adjacent to portions of the through holes that contain the heated pin segments. The metal nuclei sites function as seed layers to enable formation of selectively plated through holes.

Abstract: A security matrix layer between a first and second conductive shorting layers are located within a printed circuit board (PCB) that carries out cryptographic data handling functions. The security matrix layer includes at least two microcapsules each containing one or more reactants. When the security matrix layer is accessed, drilled, or otherwise damaged, the microcapsules rupture and the reactants react to form at least an electrically conductive material. The electrically conductive material contacts and shorts the first and second conductive shorting layers. A monitoring device that monitors whether the first and second conductive shorting layers have shorted detects the short and passes a tamper signal that is received by one or more computer system devices to respond to the unauthorized physical access attempt.

Abstract: In an example, a method includes storing thermoset resin rheology data associated with a thermoset resin at a memory. The thermoset resin rheology data includes a plurality of sets of dynamic fluid flow properties that are measured for the thermoset resin. The method includes receiving, at a computing device, information associated with a printed circuit board (PCB) laminate design. The method also includes receiving, at the computing device, a first set of PCB lamination parameters. The method further includes storing, at the computing device, a first thermoset resin flow model. The first thermoset resin flow model is generated based on the thermoset resin rheology data, the information associated with the PCB laminate design, and the first set of PCB lamination parameters.

Abstract: Method and apparatus for determining a quality or characteristic of connectors in electronic components is provided. Methods include applying a UV-responsive indicator solution active for Pd, Ni, or Cu to a connector on an electrical component; irradiating the connector with UV radiation; detecting a response to the UV radiation; and determining a quality of the connector based on the response to the UV radiation. Apparatus includes an enclosure; a support; a dispenser oriented toward the substrate support; a source of UV-responsive indicator solution active for Pd, Ni, or Cu ions fluidly coupled to the dispenser; a UV source coupled to the enclosure; and a radiation sensor positioned to detect light inside the enclosure.

Abstract: A self-healing polymeric material includes a polymeric matrix material, a plurality of monomer mixture microcapsules dispersed in the polymeric matrix material, and a plurality of light generating microcapsules dispersed in the polymeric matrix material. Each monomer mixture microcapsule encapsulates a mixture of materials that includes monomers and a photoinitiator. Each light generating microcapsule encapsulates multiple reactants that undergo a chemiluminescent reaction. The chemiluminescent reaction generates a photon having a wavelength within a particular emission range that is consistent with an absorption range of the photoinitiator.

Abstract: A self-healing polymeric material includes a polymeric matrix material, a plurality of monomer mixture microcapsules dispersed in the polymeric matrix material, and a plurality of light generating microcapsules dispersed in the polymeric matrix material. Each monomer mixture microcapsule encapsulates a mixture of materials that includes monomers and a photoinitiator. Each light generating microcapsule encapsulates multiple reactants that undergo a chemiluminescent reaction. The chemiluminescent reaction generates a photon having a wavelength within a particular emission range that is consistent with an absorption range of the photoinitiator.

Abstract: A flexible electronic circuit includes a shape memory material disposed within a flexible dielectric material.

Abstract: A self-healing polymeric material includes a polymeric matrix material, a plurality of monomer mixture microcapsules dispersed in the polymeric matrix material, and a plurality of heat generating microcapsules dispersed in the polymeric matrix material. Each monomer mixture microcapsule of the plurality of monomer mixture microcapsules encapsulates a mixture of materials that includes a monomer and a heat-triggered initiator. Each heat generating microcapsule of the plurality of heat generating microcapsules encapsulates multiple reactants that undergo an exothermic chemical reaction. The exothermic chemical reaction generates sufficient heat to cause the heat-triggered initiator to initiate a polymerization reaction.

Abstract: A process of utilizing a heat-activated conductive spinel material for PCB via overcurrent protection includes forming a PCB laminate structure that includes a spinel-doped insulator layer having a heat-activated conductive spinel material incorporated into a dielectric material as a spinel-based electrically non-conductive metal oxide. A sensing via is formed in the PCB laminate structure at a location that is proximate to a power via in the PCB laminate structure. The sensing via is electrically isolated from the power via by a region of the spinel-doped insulator layer and is electrically connected to a monitoring component configured to detect current flow through the sensing via that results from an overcurrent event in the power via that generates sufficient heat to cause the spinel-based electrically conductive metal oxide to release metal nuclei into the region to provide a conductive pathway through the region from the power via to the sensing via.

Abstract: A secured device includes an electronic component and a protective cover surrounding the electronic component. The secured device also includes one or more chemiluminescent reactant layers and a light sensor that is electrically connected to the electronic component. The one or more chemiluminescent reactant layers are disposed between the protective cover and the electronic component and include multiple reactants that undergo a chemiluminescent reaction. The light sensor is configured to trigger one or more tamper response operations responsive to detection of a photon generated by the chemiluminescent reaction.

Abstract: A process of utilizing a light generating microcapsule to cure a photo-curable material includes dispersing a microcapsule in an interface material that includes a photo-initiator and a photo-curable material. The process also includes applying a stimulus to the microcapsule to trigger a chemiluminescent reaction within the microcapsule. The chemiluminescent reaction generating a photon having a wavelength within a particular emission range that is consistent with an absorption range of the photo-initiator. The photon generated within the microcapsule exits the microcapsule into the interface material to trigger the photo-initiator to initiate or catalyze curing of the photo-curable material.

Abstract: A multi-compartment microcapsule emits photons when subjected to a stimulus. In some embodiments, the multi-compartment microcapsules have first and second compartments separated by an isolating structure adapted to rupture in response to the stimulus, wherein the first and second compartments contain reactants that come in contact and react to produce photons when the isolating structure ruptures.

Abstract: Sulfur contaminants, such as elemental sulfur (S8), hydrogen sulfide and other sulfur components in water are removed using a silicone-based chemical filter. In one embodiment, a silicone-based chemical filter includes a membrane having a cross-linked silicone that is a reaction product of an olefin and a polyhydrosiloxane.

Abstract: Embodiments of the disclosure generally provide compositions and methods involving textiles that repel insects by vibrations and oscillations. The random and chaotic oscillations are caused by molecular bond isomerizations in the textile material driven by visible light, such as sunlight.