Patents by Inventor Ting Liu

Ting Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11922027
    Abstract: A memory access speed adjustment method, control device and memory module are provided. The method is for use in controlling a controller of a memory and includes steps of: obtaining a current temperature value of the memory; determining an access speed threshold of the memory according to a continuous variation relation with respect to a difference between the current temperature value and a target temperature value; and adjusting, by the controller, an access speed of the memory according to the access speed threshold.
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: March 5, 2024
    Assignee: INNODISK CORPORATION
    Inventors: Chung-Ting Huang, Chung-Yi Lai, Ting-Chiang Liu
  • Publication number: 20240069604
    Abstract: The electronic device includes a folding apparatus and a flexible display. The folding apparatus is configured to bear the flexible display. An elastic component of the folding apparatus may transfer an elastic force to the flexible display by using a housing of the folding apparatus. A force that is away from a main shaft and that is applied to the flexible display when the electronic device is in a flattened state is greater than a force that is away from the main shaft and that is applied to the flexible display when the electronic device is in a closed state.
    Type: Application
    Filed: August 10, 2021
    Publication date: February 29, 2024
    Inventors: Zhengyi Xu, Chunjun Ma, Linhui Niu, Ting Liu, Yunyong Li, Gangchao Wang, Chenghao Guan
  • Publication number: 20240067746
    Abstract: Disclosed herein are humanized antibodies, antigen-binding fragments thereof, and antibody conjugates, that are capable of specifically binding to certain biantennary Lewis antigens, which antigens are expressed in a variety of cancers. The presently disclosed antibodies are useful to target antigen-expressing cells for treatment or detection of disease, including various cancers. Also provided are polynucleotides, vectors, and host cells for producing the disclosed antibodies and antigen-binding fragments thereof. Pharmaceutical compositions, methods of treatment and detection, and uses of the antibodies, antigen-binding fragments, antibody conjugates, and compositions are also provided.
    Type: Application
    Filed: February 28, 2023
    Publication date: February 29, 2024
    Inventors: Tong-Hsuan CHANG, Mei-Chun YANG, Liahng-Yirn LIU, Jerry TING, Shu-Yen CHANG, Yen-Ying CHEN, Yu-Yu LIN, Shu-Lun TANG
  • Publication number: 20240074322
    Abstract: In one aspect, a method includes depositing magnetoresistance (MR) layers of a MR element on a semiconductor structure; depositing a first hard mask on the MR layers; depositing and patterning a first photoresist on the first hard mask using photolithography to expose portions of the first hard mask; etching the exposed portions of the first hard mask; etching a portion of the MR layers using the first hard mask; depositing a second hard mask on a first capping layer; depositing and patterning a second photoresist on the second hard mask using photolithography to expose portions of the second hard mask; etching the exposed portions of the second hard mask; etching the MR element using the second hard mask; etching portions of the first hard mask down to a top MR layer of the MR element; and depositing a conducting material on the top MR layer to form an electroconductive contact.
    Type: Application
    Filed: August 30, 2022
    Publication date: February 29, 2024
    Applicant: Allegro MicroSystems, LLC
    Inventors: Maxim Klebanov, Yen Ting Liu, Sundar Chetlur, Paolo Campiglio, Samridh Jaiswal
  • Patent number: 11915977
    Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang, Sheng-Chau Chen, Shih Pei Chou, Chia-Chieh Lin
  • Patent number: 11917650
    Abstract: A system and method for allocating network resources are disclosed herein. In one embodiment, the system and method are configured to perform: transmitting a message to a wireless communication device for the wireless communication device to select either a first cell where the wireless communication device currently stays, or a second cell to stay. In some embodiments, the message indicates information about the first cell in which a first radio access technology (RAT) is used and the second cell in which a second RAT, different from the first RAT, is used.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: February 27, 2024
    Assignee: ZTE CORPORATION
    Inventors: Xiubin Sha, Bo Dai, Ting Lu, Xu Liu
  • Patent number: 11916077
    Abstract: The present disclosure describes an apparatus with a local interconnect structure. The apparatus can include a first transistor, a second transistor, a first interconnect structure, a second interconnect structure, and a third interconnect structure. The local interconnect structure can be coupled to gate terminals of the first and second transistors and routed at a same interconnect level as reference metal lines coupled to ground and a power supply voltage. The first interconnect structure can be coupled to a source/drain terminal of the first transistor and routed above the local interconnect structure. The second interconnect structure can be coupled to a source/drain terminal of the second transistor and routed above the local interconnect structure. The third interconnect structure can be routed above the local interconnect structure and at a same interconnect level as the first and second interconnect structures.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang, Jiann-Tyng Tzeng, Ru-Gun Liu, Wei-Cheng Lin, Lei-Chun Chou, Wei-An Lai
  • Publication number: 20240063163
    Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.
    Type: Application
    Filed: October 31, 2023
    Publication date: February 22, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Pin TSAI, Ming-Chi LIU, Yu-Ting LU, Kai-Chiang HSU, Che-Ting LIU
  • Patent number: 11904633
    Abstract: A freehub of a bicycle contains: a body fitted and rotating on a rotary shaft. A receiving sleeve is connected with the body and fitted on the rotary shaft, and the receiving sleeve includes an accommodation holder configured to accommodate a freewheel. A ratchet assembly is mounted between the body and the receiving sleeve, the ratchet assembly includes multiple chutes, and a central axis of a respective chute is not parallel to a central axis of the rotary shaft. A toothed ring is fitted between the fixing element and the body. The ratchet assembly includes multiple teeth, multiple engagement elements, and multiple resilient elements. A respective resilient element abuts against the respective chute and a respective engagement element, such that the respective engagement element is urged by the respective resilient element to linearly move toward the respective tooth so as to engage with the respective tooth.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: February 20, 2024
    Inventor: Wei-Ting Liu
  • Patent number: 11881022
    Abstract: Systems and methods for a weakly supervised action localization model are provided. Example models according to example aspects of the present disclosure can localize and/or classify actions in untrimmed videos using machine-learned models, such as convolutional neural networks. The example models can predict temporal intervals of human actions given video-level class labels with no requirement of temporal localization information of actions. The example models can recognize actions and identify a sparse set of keyframes associated with actions through adaptive temporal pooling of video frames, wherein the loss function of the model is composed of a classification error and a sparsity of frame selection. Following action recognition with sparse keyframe attention, temporal proposals for action can be extracted using temporal class activation mappings, and final time intervals can be estimated corresponding to target actions.
    Type: Grant
    Filed: March 10, 2023
    Date of Patent: January 23, 2024
    Assignee: GOOGLE LLC
    Inventors: Ting Liu, Gautam Prasad, Phuc Xuan Nguyen, Bohyung Han
  • Publication number: 20240023289
    Abstract: An electronic device includes a storage array, a row fan, a distance sensor, and a controller. The storage array includes a plurality of storage units. The row fan cools the storage array. The distance sensor senses the distance between the storage array and the row fan and outputs a corresponding distance signal. The controller receives the distance signal and sets the distance threshold of each of the storage units. When the distance is longer than the distance threshold, the controller outputs a control signal to the row fan to increase the rotation speed of the row fan.
    Type: Application
    Filed: October 18, 2022
    Publication date: January 18, 2024
    Inventors: Cyuan LEE, Geng-Ting LIU, Ming-Feng HSIEH, I Wei CHIU, Chia Ming TSAI
  • Publication number: 20240023235
    Abstract: The present disclosure provides a package device including a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.
    Type: Application
    Filed: September 27, 2023
    Publication date: January 18, 2024
    Applicant: InnoLux Corporation
    Inventors: Yeong-E CHEN, Cheng-En CHENG, Yu-Ting LIU
  • Publication number: 20240017788
    Abstract: A quick-release includes axle having a head and an outer threaded end formed to two ends thereof. The axle is threadedly connected to the chain stay of a bicycle. The axle includes a passage defined axially therethrough. A groove is formed radially through the head, and two recesses are respectively formed in two insides of the groove. A knob is fitted in the groove of the head. A rod is movably located in the passage and has an engaging end which is connected to the knob. A ball is formed to the rod. A non-circular hole is formed in the ball. When the rod is pulled and the ball is rotatably engaged with the two recesses, the rod is pivoted and partially engaged with the groove so as to rotate the axle to esparto the wheels from the chain stay.
    Type: Application
    Filed: November 10, 2022
    Publication date: January 18, 2024
    Inventor: WEI-TING LIU
  • Publication number: 20240015919
    Abstract: An airflow guiding mechanism includes a casing and an airflow guiding member. The airflow guiding member is rotatably disposed in the casing. The airflow guiding member is able to rotate between a first position and a second position. When the airflow guiding member is located at the first position, the airflow guiding member separates two airflow passages at opposite sides of the airflow guiding member from each other. When the airflow guiding member is located at the second position, the two airflow passages communicate with each other.
    Type: Application
    Filed: August 1, 2022
    Publication date: January 11, 2024
    Applicant: Wiwynn Corporation
    Inventors: Yuan-Shiang Ding, Geng-Ting Liu
  • Patent number: 11868839
    Abstract: A device detecting system is provided. The device detecting system includes a bar code scanner, a plurality of device accommodating spaces, a screen, and a server. The server obtains bar code information via the bar code scanner and opens one of the device accommodating spaces based on the bar code information to accommodate an electronic device. The server performs a test procedure on the electronic device to generate a test result, and displays the test result and operation information corresponding to the test result on the screen.
    Type: Grant
    Filed: May 5, 2022
    Date of Patent: January 9, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Chien-Chih Chang, Pei-Yin Chen, Wei-Han Lin, Bo-Rong Chu, Yen-Ting Liu, Yu-Shen Mai, Kuan-Yu Hsiao, Chia-Hsien Lin, Pei-Yu Liao, Chun-Yen Lai, Sheng-Yi Chen
  • Patent number: 11867595
    Abstract: This disclosure relates to an apparatus and methods for applying X-ray reflectometry (XRR) in characterizing three dimensional nanostructures supported on a flat substrate with a miniscule sampling area and a thickness in nanometers. In particular, this disclosure is targeted for addressing the difficulties encountered when XRR is applied to samples with intricate nanostructures along all three directions, e.g. arrays of nanostructured poles or shafts. Convergent X-ray with long wavelength, greater than that from a copper anode of 0.154 nm and less than twice of the characteristic dimensions along the film thickness direction, is preferably used with appropriate collimations on both incident and detection arms to enable the XRR for measurements of samples with limited sample area and scattering volumes. In one embodiment, the incident angle of the long-wavelength focused X-ray is ?24°, and the sample area is ?25 ?m×25 ?m.
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: January 9, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chun-Ting Liu, Wen-Li Wu, Bo-Ching He, Guo-Dung Chen, Sheng-Hsun Wu, Wei-En Fu
  • Publication number: 20240006249
    Abstract: The present disclosure provides an electronic device including a redistribution layer, a plurality of passive components, and an electronic component. The redistribution layer includes a first insulating layer, a second insulating layer, and a plurality of traces electrically connected to each other through a first opening of the first insulating layer and a second opening of the second insulating layer, wherein the first insulating layer has a first side away from the second insulating layer, and the second insulating layer has a second side away from the first insulating layer. The passive components are disposed on the first side. The electronic component is disposed on the second side. The plurality of passive components are electrically connected to the electronic component through the plurality of traces.
    Type: Application
    Filed: September 19, 2023
    Publication date: January 4, 2024
    Applicant: InnoLux Corporation
    Inventors: Yeong-E CHEN, Kuang-Chiang HUANG, Yu-Ting LIU, Yi-Hung LIN, Cheng-En CHENG
  • Publication number: 20240007435
    Abstract: A firewall processing card from a plurality of firewall processing cards coupled to a chassis, is selected by a load balancing engine (or other mechanism) and receives the data packet over the fabric channel. First, if the session match exists to management-type data packets the data packet is returned to the I/O board and if a match exists to user data packets the data packet is sent to a firewall service of the firewall processing card. If no session match exists, the firewall processing card checks for a policy match to the data packet for creating a new session or drops the data packet. The I/O board receives the data packet returned from the processing blade over the base channel and checks for a session matching to the data packet. If a session match exists and the data packet is a management data packet, the data packet is sent to a management service at a user level of the I/O board and if not a management data packet the data packet is dropped.
    Type: Application
    Filed: June 30, 2022
    Publication date: January 4, 2024
    Inventors: Sen Yang, Zicheng Wang, Ting Liu
  • Patent number: 11864351
    Abstract: A heat dissipation structure has a heat dissipation base and at least one heat conduction assembly mounted in a through hole of the heat dissipation base. Each of the at least one heat conduction assembly includes a resilient clamp and a heat pipe. When a transceiver is inserted in the through hole of the heat dissipation base, two heat conducting sections of the heat pipe are pushed by the resilient clamp to abut against the transceiver and the heat dissipation base respectively. Heat generated while the transceiver is operating can be quickly and efficiently conducted through the heat pipe to the heat dissipation base and then dissipated. Temperature increase of the transceiver can be effectively avoided and performance and reliability of the transceiver during operation can be ensured.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: January 2, 2024
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Ting Liu, Xiao-Yao Li, Yu-Ka Feng
  • Patent number: D1015278
    Type: Grant
    Filed: July 17, 2021
    Date of Patent: February 20, 2024
    Assignee: Shenzhen Lithtech Energy Co., Ltd.
    Inventor: Ting Liu