Patents by Inventor Ting Liu

Ting Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11855083
    Abstract: A gate structure includes a gate dielectric layer, a work function layer, a metal layer, and a barrier layer. The work function layer is surrounded by the gate dielectric layer. The metal layer is disposed over the work function layer. The barrier layer is surrounded by the work function layer and surrounds the metal layer. The barrier layer includes fluorine and silicon, or fluorine and aluminum. The barrier layer is a tri-layered structure.
    Type: Grant
    Filed: February 8, 2022
    Date of Patent: December 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ji-Cheng Chen, Ching-Hwanq Su, Kuan-Ting Liu, Shih-Hang Chiu
  • Patent number: 11854768
    Abstract: The present disclosure is directed to an in situ closed-loop radio frequency (RF) power management on RF processes such as a plasma etch process, a plasma chemical vapor deposition process, a plasma physical vapor deposition process, a plasma clean process, or the like. An RF power measurement device according to one or more embodiments of the present disclosure assists the in situ closed-loop RF power management on RF processes. In some embodiments, the RF power measurement device includes a coil-shaped current sensor that is wound around the path between an RF generator and a chamber. The coil-shaped current sensor senses the current flowing through this path so that the power of the RF generator may be calibrated without having to separate the RF generator for separate analysis and calibration. The RF power measurement device allows management of RF power in an in situ closed-loop manner.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: December 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei Ting Liu, Wen-Wei Fan
  • Publication number: 20230413679
    Abstract: In one aspect, a method includes depositing a capping layer on a semiconductor device structure. The semiconductor device includes a plurality of tunneling magnetoresistance (TMR) elements, a corresponding one hard mask on each TMR element, a metal layer, and a plurality of electroconductive vias directing connecting the TMR elements to the metal layer. The method further includes depositing an insulator on the capping layer, depositing a first photoresist on the insulator, patterning the first photoresist using photolithography to expose portions of the insulator, etching the exposed portions of the insulator and the hard masks to expose top surfaces of the TMR elements, stripping the first photoresist, and depositing a conducting material on the top surfaces of the TMR elements to form an electroconductive contact.
    Type: Application
    Filed: May 31, 2022
    Publication date: December 21, 2023
    Applicant: Allegro MicroSystems, LLC
    Inventors: Sundar Chetlur, Maxim Klebanov, Yen Ting Liu, Paolo Campiglio
  • Publication number: 20230403347
    Abstract: This application discloses a folding mechanism and an electronic device. The folding mechanism is applied to a housing apparatus of an electronic device, and is configured to connect two housings of the housing apparatus. The folding mechanism can form display accommodating space through automatic avoidance in a folding process, and a flexible display is accommodated in the display accommodating space, so that a folding action performed by the housing apparatus on the flexible display is stable, and a squeezing force is small. This helps reduce a risk that the flexible display is damaged due to excessive squeezing of the folding mechanism, and makes the flexible display more reliable.
    Type: Application
    Filed: October 27, 2021
    Publication date: December 14, 2023
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Ting Liu, Chunjun Ma, Linhui Niu, Zhengyi Xu, Yunyong Li
  • Publication number: 20230398995
    Abstract: The present disclosure provides a trust enhancement method and a trust enhancement apparatus for an intelligent driving system. The method comprises: acquiring at least one of vehicle operating status data, navigation route information, perception fusion and target tracking data, and high-precision map fusion information of the intelligent driving system of a vehicle; and determining a reliability of the intelligent driving system based on the at least one of the vehicle operating status data, the navigation route information, the perception fusion and target tracking data, and the high-precision map fusion information.
    Type: Application
    Filed: December 21, 2022
    Publication date: December 14, 2023
    Inventors: Ting LIU, Peng JI, Liyuan HUANG, Yongqiang CHU, Jinpeng HE
  • Publication number: 20230398998
    Abstract: The present disclosure provides a method and an apparatus for enhancing trust in an intelligent driving controller of a vehicle in curve control, The method comprises: acquiring a length of a road ahead, a radius of a curve ahead, and a current vehicle speed of the vehicle that are identified by the vehicle; and determining a reliability level of the intelligent driving controller of the vehicle in curve travelling control based on at least one of the length of the road ahead, the radius of the curve ahead, and the current vehicle speed of the vehicle identified.
    Type: Application
    Filed: December 21, 2022
    Publication date: December 14, 2023
    Inventors: Yongqiang CHU, Jinpeng HE, Peng JI, Ting LIU, Liyuan HUANG
  • Patent number: 11839456
    Abstract: The present invention discloses a method for determining a maximum value of a heart rate data of a user performing a physical activity. Acquire first heart rate data in a first duration of the physical activity performed by the user. Acquire motion data in the first duration of the physical activity performed by the user. Calculate second heart rate data based on the motion data in the first duration of the physical activity performed by the user by a mathematical model and estimate the maximum value of the heart rate data of the user based on a comparison between the first first heart rate data and the second heart rate data.
    Type: Grant
    Filed: July 14, 2021
    Date of Patent: December 12, 2023
    Assignee: BOMDIC INC.
    Inventors: Szu-Hong Chen, Pin-Yu Chen, Tai-Yu Huang, Yu-Ting Liu
  • Patent number: 11835103
    Abstract: A deformable body, wherein the body is constructed from a multiplicity of layers of a polymer construction material and in which a construction direction is defined perpendicular to the layers. The body preferably comprises layers with a multiplicity of curve pairs (10) which are formed by the construction material and which run in the same direction as one another, the curve pairs comprise in each case two periodic curves (20, 30) running oppositely with respect to one another, and the curve pairs comprise portions of maximum spacing to one another (40, 41, 60, 61) and portions of minimum spacing to one another (50, 51, 70, 71).
    Type: Grant
    Filed: November 23, 2018
    Date of Patent: December 5, 2023
    Assignee: STRATASYS, INC.
    Inventors: Dirk Achten, Thomas Buesgen, Nicolas Degiorgio, Jonas Kuenzel, Ting Liu, Maximilian Wolf
  • Patent number: 11823587
    Abstract: A virtual reality system with an inspecting function of assembling and disassembling and an inspection method of assembling and disassembling based on virtual reality are presented. A learning-end acquires an inspection data and a teaching assembling-disassembling record being set with a plurality of checkpoints, plays the teaching assembling-disassembling record, modifies a learning assembling-disassembling status of a plurality of virtual objects based on user's operations for assembling or disassembling. The learning-end issues an assembling-disassembling error reminder when the learning assembling-disassembling status is inconsistent with a teaching assembling-disassembling status at any of the checkpoints.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: November 21, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Yao-Han Yen, Wen-Hsin Lo, Yu-Ting Liu, Guan-Jhih Liou
  • Publication number: 20230369132
    Abstract: The present disclosure provides a semiconductor device with a profiled work-function metal gate electrode. The semiconductor structure includes a metal gate structure formed in an opening of an insulating layer. The metal gate structure includes a gate dielectric layer, a barrier layer, a work-function metal layer between the gate dielectric layer and the barrier layer and a work-function adjustment layer over the barrier layer, wherein the work-function metal has an ordered grain orientation. The present disclosure also provides a method of making a semiconductor device with a profiled work-function metal gate electrode.
    Type: Application
    Filed: July 25, 2023
    Publication date: November 16, 2023
    Inventors: Da-Yuan LEE, Hung-Chin CHUNG, Hsien-Ming LEE, Kuan-Ting LIU, Syun-Ming JANG, Weng CHANG, Wei-Jen LO
  • Patent number: 11816605
    Abstract: A packing method for a defective sheet based on branch-and-cut algorithm, including: acquiring sheet information, where the sheet information includes size information of the defect sheet, size information of a target block and position information of a defect; based on actual cutting requirements, establishing constraints; and establishing a primal problem model according to the constraints; converting the primal problem model into a relaxed problem model; checking and verifying the obtained solution by x-check method to determine whether the obtained solution meets the constraints of the primal problem model; outputting the optimal solution to obtain an optimal cutting plan that meets the actual cutting requirements; and cutting the defective sheet according to the optimal cutting plan. A system for implement the packing method is also provided.
    Type: Grant
    Filed: January 13, 2023
    Date of Patent: November 14, 2023
    Assignee: Guangdong University of Technology
    Inventors: Lijun Wei, Shaowen Yao, Qiang Liu, Ting Liu
  • Patent number: 11812549
    Abstract: A package device and a manufacturing method thereof are provided. The package device includes a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.
    Type: Grant
    Filed: January 10, 2023
    Date of Patent: November 7, 2023
    Assignee: InnoLux Corporation
    Inventors: Yeong-E Chen, Cheng-En Cheng, Yu-Ting Liu
  • Publication number: 20230351348
    Abstract: A method may include determining a combination of values of attributes represented by reference data associated with payment transaction by training a machine learning model based on an association between (i) respective values of the attributes and (ii) the payment transactions having a given result. The combination may be correlated with having the given result. The method may also include selecting a subset of the payment transactions that is associated with the combination of values. The method may additionally include determining a first rate at which payment transactions of the subset have the given result during a first time period and a second rate at which one or more payment transactions associated with the combination have the given result during a second time period, and generating an indication that the two rates differ.
    Type: Application
    Filed: June 22, 2023
    Publication date: November 2, 2023
    Inventors: Sayan Maity, Christopher Carl Underwood, Beth Teresa Logan, Sreeram Srinivasan, Shanshan Tuo, Pradeep Reddy, Vijay Anand Raghavan, Raviteja Gunda, Shih-Ting Liu, Thong Le Nguyen
  • Patent number: 11804409
    Abstract: The present disclosure provides a semiconductor device with a profiled work-function metal gate electrode. The semiconductor structure includes a metal gate structure formed in an opening of an insulating layer. The metal gate structure includes a gate dielectric layer, a barrier layer, a work-function metal layer between the gate dielectric layer and the barrier layer and a work-function adjustment layer over the barrier layer, wherein the work-function metal has an ordered grain orientation. The present disclosure also provides a method of making a semiconductor device with a profiled work-function metal gate electrode.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: October 31, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Da-Yuan Lee, Hung-Chin Chung, Hsien-Ming Lee, Kuan-Ting Liu, Syun-Ming Jang, Weng Chang, Wei-Jen Lo
  • Patent number: 11804461
    Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: October 31, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yu-Ping Tsai, Ming-Chi Liu, Yu-Ting Lu, Kai-Chiang Hsu, Che-Ting Liu
  • Patent number: 11804991
    Abstract: A sequence detection device includes a decision-feedback equalizer (DFE), a combining circuit, a decision circuit, and a sequence detection circuit. The DFE processes a symbol decision signal to generate a first equalized signal. The combining circuit combines a data signal and the first equalized signal to generate a sample signal. The decision circuit performs hard decision upon the sample signal to generate the symbol decision signal. The sequence detection circuit performs sequence detection upon the data signal to generate and output a symbol sequence. Regarding the sequence detection, the sequence detection circuit selects branches for branch metric calculation according to at least the symbol decision signal.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: October 31, 2023
    Assignee: MEDIATEK INC.
    Inventors: Yu-Ting Liu, Che-Yu Chiang, Deng-Fu Weng
  • Patent number: 11798009
    Abstract: Systems and methods for providing online content include evaluating a custom selection rule specified by a content provider. The custom selection rule may be used to control whether content from the provider is eligible for selection by a content selection service. The content selection rule may include one or more logical operators, a selected interest category and/or a selected list of one or more client identifiers.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: October 24, 2023
    Assignee: Google LLC
    Inventors: Ting Liu, Zhengzhu Feng, Zhongyi Lin
  • Patent number: 11798853
    Abstract: The present disclosure provides a manufacturing method of a package device, which includes providing a carrier substrate, a first conductive layer, and a release layer, where the carrier substrate has a device region and a peripheral region, and the first conductive layer and the release layer are disposed on the carrier substrate. The method further includes forming a second conductive layer on the release layer in the device region, where at least one of the first and second conductive layers includes a first pad in the peripheral region. The second conductive layer includes a second pad electrically connected to the first pad through the first conductive layer. The method also includes performing an inspection step to provide an input signal to one of the first and second pads, and to receive an output signal from another of the first and second pads.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: October 24, 2023
    Assignee: InnoLux Corporation
    Inventors: Yeong-E Chen, Kuang-Chiang Huang, Yu-Ting Liu, Yi-Hung Lin, Cheng-En Cheng
  • Publication number: 20230337406
    Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
    Type: Application
    Filed: December 23, 2020
    Publication date: October 19, 2023
    Inventors: Ritu BAWA, Ruander CARDENAS, Kathiravan D, Jia Yan GO, Chin Kung GOH, Jeff KU, Prakash Kurma RAJU, Baomin LIU, Twan Sing LOO, Mikko MAKINEN, Columbia MISHRA, Juha PAAVOLA, Prasanna PICHUMANI, Daniel RAGLAND, Kannan RAJA, Khai Ern SEE, Javed SHAIKH, Gokul SUBRAMANIAM, George Baoci SUN, Xiyong TIAN, Hua YANG, Mark CARBONE, Vivek PARANJAPE, Nehakausar PINJARI, Hari Shanker THAKUR, Christopher MOORE, Gustavo FRICKE, Justin HUTTULA, Gavin SUNG, Sammi WY LIU, Arnab SEN, Chun-Ting LIU, Jason Y. JIANG, Gerry JUAN, Shih Wei NIEN, Lance LIN, Evan KUKLINSKI
  • Publication number: 20230326146
    Abstract: An augmented reality implementing method applied to a server, which includes a plurality of augmented reality objects and a plurality of setting records corresponding to the augmented reality objects respectively is provided. Firstly, the server receives an augmented reality request from a mobile device, where the augmented reality request is related to a target device. Then, the server is communicated with the target device to access current information. Then, the server determines the current information corresponds to which one of the setting records, and selects one of the augmented reality objects based on the determined setting record as a virtual object provided to the mobile device.
    Type: Application
    Filed: October 4, 2022
    Publication date: October 12, 2023
    Inventors: Kuo-Chung CHIU, Hsuan-Wu WEI, Yen-Ting LIU, Shang-Chih LIANG, Shih-Hua MA, Yi-Hsuan TSAI, Jun-Ting CHEN, Kuan-Ling CHEN