Abstract: The present invention provides an anisotropic conductive material in which lower continuity resistance and higher adhesive strength are obtained, and a method for manufacturing the same. When a glass substrate and a metal wiring material are thermally compressed and bonded, in an interface between the glass substrate and an anisotropic conductive material, Si on a surface of the glass substrate reacts on an alkoxyl group (OR) at an end of disulfide silane modified by hydrophobic silica, and chemically binds thereto. Furthermore, at an interface between the metal wiring material and the anisotropic conductive material, a part of S—S bonds (disulfide bonds) in disulfide silane dissociates due to the heat at the time of thermocompression bonding, and the dissociated sulfide silane chemically binds to metal Me.

Abstract: A connection method and a connection structure of electronic components by which high connection reliability can be obtained. An anisotropic conductive film is temporarily disposed, and thermally compressed and bonded, in such manner that a boundary of a circuit protection area and a terminal area of a second electronic component is positioned on a single layer area of the anisotropic conductive film; and the terminal area of the second electronic component is positioned on a double-layer area of the anisotropic conductive film.

Abstract: The present invention aims to provide conductive particles which can reduce the stress while maintaining high hardness (hardly causing cracks even in a state of being crushed in connection process) by improving rolling properties and can ensure adequate conductive reliability not only with respect to ITO substrates, but also with respect to IZO substrates, an anisotropic conductive film provided with the conductive particles, a joined structure provided with the anisotropic conductive film, and a joining method using the anisotropic conductive film. The conductive particles of the present invention include polymer fine particles, and a conductive layer formed on surfaces of the polymer fine particles, wherein an outermost surface shell of the conductive layer is a nickel-palladium alloy layer.

Abstract: A method for producing a joined structure involving pressure-bonding a first circuit member and a second circuit member together via a connecting film while the circuit members are being heated, to thereby join the circuit members with each other, wherein the connecting film is defined and includes first and second layers wherein one of the first layer and the second layer is a conductive particle-containing organic resin layer, and the other layer is an insulating organic resin layer containing no conductive particles, and wherein the minimum melt viscosity of the conductive particle-containing organic resin layer is ten times or more greater than the minimum melt viscosity of the insulating organic resin layer.

Abstract: A method for producing a joined structure, containing: after placing an anisotropic conductive film in the predetermined manner, placing a wiring member containing a wiring plate formed thereon, where the wiring plate has a resist region in which the wiring plate is covered with a resist layer, and a second electrode region in which the wiring plate is not covered with the resist layer, so that the edge of the resist region at a boundary with the second electrode region comes above the chamfer part of the substrate; and heating and compressing the anisotropic conductive film from the side of the wiring member to melt and make the anisotropic conductive film flow into the side of the resist region to thereby cover the second electrode region with the anisotropic conductive film, so as to electrically connect the first electrode region and the second electrode region.

Abstract: A method for producing a joined structure, the method involving pressure-bonding first and second circuit members together via an anisotropic conductive film while the circuit members are being heated, to thereby join the circuit members with each other. The anisotropic conductive film electrically connects the first circuit member with the second circuit member having a nitrogen atom-containing film on a surface facing the first circuit member, wherein the anisotropic conductive film, the first layer and the second layer are further defined including the provisions that at least one of the first and second layers includes conductive particles, and the difference in maximum exothermic peak temperature between the first and second layers is within the range up to 20° C.

Abstract: To provide a connecting film including an organic resin layer which contains a color-erasing pigment, a curable organic resin, a curing agent and a conductive particle.

Abstract: To provide a conductive particle, which contains a core particle, and a conductive layer formed on a surface of the core particle, where the core particle is formed of a resin, or a metal, or both thereof, and the conductive layer contains a phosphorus-containing hydrophobic group at a surface thereof.

Abstract: A method for connecting an electronic part, which contains: mixing a dispersing solvent, an adhesive resin which is dissolved in the dispersing solvent, conductive particles, and insulating particles which have smaller particle diameters than those of the conductive particles so as to prepare an anisotropic conductive adhesive; placing a terminal of a substrate and a terminal of an electronic part so as to face each other via the anisotropic conductive adhesive, and applying heat and pressure to the substrate and the electronic part so as to sandwich the conductive particles between the terminal of the substrate and the terminal of the electronic part to thereby deform the conductive particles, in which the pressure is smaller than pressure at which the conductive particles are destroyed, and smaller than pressure at which the particle diameters of the conductive particles become equal to the particle diameters of the insulating particles.

Abstract: Provided is an anisotropic conductive film having enhanced adhesion strength to a circuit member and attaining high conduction reliability; a joined structure; and a method for producing the joined structure. The conductive film electrically connects a first circuit member with a second circuit member having a nitrogen atom containing film on a surface thereof facing the first circuit member, the conductive film including a first layer which is to be located at a first circuit member side, and a second layer which is to be located at a second circuit member side, wherein the first layer comprises a cationic curing agent and a first thermosetting resin, and the second layer comprises a radical curing agent and a second thermosetting resin, and wherein at least one of the first and second layers comprises conductive particles, and the difference in maximum exothermic peak temperature between the first and second layers is within the range up to 20° C.

Abstract: To provide a conductive particle, containing: a core particle; and a conductive layer formed on a surface of the core particle, wherein the core particle is a nickel particle, and wherein the conductive layer is a nickel plating layer a surface of which has a phosphorous concentration of 10% by mass or lower, and the conductive layer has an average thickness of 1 nm to 10 nm.

Abstract: An adhesive film including a first adhesive layer containing a first main resin component and dispersed conductive particles, and a second adhesive layer containing a second main resin component and adhering to the first adhesive layer, each of the adhesive layers containing a secondary resin component, wherein the first main resin component has a glass transition temperature higher than that of the secondary resin component, and the second main resin component has a glass transition temperature higher than that of the secondary resin component and lower than that of the first main resin component, and a reaction peak temperature of each of the adhesive layers is lower than the glass transition temperature of the first main resin component and higher than the glass transition temperature of the second main resin component, and is a temperature at which a calorific value of the adhesive layer is maximum during temperature rise.

Abstract: A method for producing a joined structure, containing: after placing an anisotropic conductive film in the predetermined manner, placing a wiring member containing a wiring plate formed thereon, where the wiring plate has a resist region in which the wiring plate is covered with a resist layer, and a second electrode region in which the wiring plate is not covered with the resist layer, so that the edge of the resist region at a boundary with the second electrode region comes above the chamfer part of the substrate; and heating and compressing the anisotropic conductive film from the side of the wiring member to melt and make the anisotropic conductive film flow into the side of the resist region to thereby cover the second electrode region with the anisotropic conductive film, so as to electrically connect the first electrode region and the second electrode region.

Abstract: To provide a connecting film including an organic resin layer which contains a color-erasing pigment, a curable organic resin, a curing agent and a conductive particle.

Abstract: An anisotropic conductive film that may give rise to high connection reliability, and a method for manufacturing a connection assembly with the use of the anisotropic conductive film, are disclosed. An anisotropic conductive film (2) is composes of an insulating adhesive resin containing polybutadiene particles, a cationic polymerizable resin and a cationic curing agent, and conductive particles dispersed in the insulating adhesive resin, with the lowest melt viscosity of the anisotropic conductive film being 300 to 1000 Pa·s. This anisotropic conductive film is placed in contact with terminal electrodes of a glass substrate (1). A flexible printed circuit board (3) is placed on top of the anisotropic conductive film so that terminal electrodes of the flexible printed circuit board (3) are in contact with the anisotropic conductive film (2). A heating tool is thrust onto the flexible printed circuit board side for electrically interconnecting the terminal electrodes.

Abstract: The present invention aims to provide conductive particles which can reduce the stress while maintaining high hardness (hardly causing cracks even in a state of being crushed in connection process) by improving rolling properties and can ensure adequate conductive reliability not only with respect to ITO substrates, but also with respect to IZO substrates, an anisotropic conductive film provided with the conductive particles, a joined structure provided with the anisotropic conductive film, and a joining method using the anisotropic conductive film. The conductive particles of the present invention include polymer fine particles, and a conductive layer formed on surfaces of the polymer fine particles, wherein an outermost surface shell of the conductive layer is a nickel-palladium alloy layer.

Abstract: A connecting film which electrically connects a first circuit member with a second circuit member having a nitrogen atom-containing film on a surface thereof facing the first circuit member, the connecting film including a first layer which is to be located at the first circuit member side, and a second layer which is to be located at the second circuit member side, wherein the first layer contains a cationic curing agent and an epoxy resin, and the second layer contains a radical curing agent, an acrylic resin and an epoxy compound, wherein one of the first layer and the second layer is a conductive particle-containing organic resin layer, and the other layer is an insulating organic resin layer containing no conductive particles, and wherein the minimum melt viscosity of the conductive particle-containing organic resin layer is ten times or more greater than that of the insulating organic resin layer.

Abstract: An adhesive film including a first adhesive layer containing a first main resin component and dispersed conductive particles, and a second adhesive layer containing a second main resin component and adhering to the first adhesive layer, each of the adhesive layers containing a secondary resin component, wherein the first main resin component has a glass transition temperature higher than that of the secondary resin component, and the second main resin component has a glass transition temperature higher than that of the secondary resin component and lower than that of the first main resin component, and a reaction peak temperature of each of the adhesive layers is lower than the glass transition temperature of the first main resin component and higher than the glass transition temperature of the second main resin component, and is a temperature at which a calorific value of the adhesive layer is maximum during temperature rise.

Abstract: An adhesive film, containing a first adhesive layer in which conductive particles are dispersed, and a second adhesive layer adhered to the first adhesive layer, wherein the lowest viscosity of the first adhesive layer attained at or below the curing temperature is higher than that of the second adhesive layer attained at or below the curing temperature, where the curing temperature is a temperature at which the adhesive layer starts to cure, wherein the first and second adhesive layers are respectively disposed to a substrate side and an electronic part side, and the adhesive film is configured to join the electronic part and the substrate by heating and pressurizing the substrate and the electronic part with the adhesive layer being therebetween, and wherein the first adhesive layer has a thickness which is less than two times of an average particle diameter of the conductive particles.

Abstract: The adhesive material contains a radical-polymerizable compound, a curing agent, and a thermoplastic resin; gives a negative result of the Ames test; and has a PII, or skin irritation, value of 2 or less. In particular, all the starting ingredients should preferably give a negative result of the Ames test and have a PII, or skin irritation, value of 2 or less.