Abstract: A method for connecting an electronic part, which contains: mixing a dispersing solvent, an adhesive resin which is dissolved in the dispersing solvent, conductive particles, and insulating particles which have smaller particle diameters than those of the conductive particles so as to prepare an anisotropic conductive adhesive; placing a terminal of a substrate and a terminal of an electronic part so as to face each other via the anisotropic conductive adhesive, and applying heat and pressure to the substrate and the electronic part so as to sandwich the conductive particles between the terminal of the substrate and the terminal of the electronic part to thereby deform the conductive particles, in which the pressure is smaller than pressure at which the conductive particles are destroyed, and smaller than pressure at which the particle diameters of the conductive particles become equal to the particle diameters of the insulating particles.

Abstract: Provided is an anisotropic conductive film having enhanced adhesion strength to a circuit member and attaining high conduction reliability; a joined structure; and a method for producing the joined structure An anisotropic conductive film which electrically connects a first circuit member with a second circuit member having a nitrogen atom-containing film on a surface thereof facing the first circuit member, the anisotropic conductive film including a first layer which is to be located at a first circuit member side, and a second layer which is to be located at a second circuit member side, wherein the first layer comprises a cationic curing agent and a first thermosetting resin, and the second layer comprises a radical curing agent and a second thermosetting resin, and wherein at least one of the first and second layers comprises conductive particles, and the difference in maximum exothermic peak temperature between the first and second layers is within the range up to 20° C.

Abstract: An anisotropic conductive adhesive includes the following components (a) to (d): (a) radical polymerizable compound with bridged hydrocarbon residue, (b) an organic peroxide, (c) a thermoplastic resin, and (d) conductive particles for anisotropic conductive connection. In the radical polymerizable compound of component (a), it is desirable that the bridged hydrocarbon residue may be a tricyclodecane residue, and that it contain two or more unsaturated bonds.

Abstract: The adhesive material contains a radical-polymerizable compound, a curing agent, and a thermoplastic resin; gives a negative result of the Ames test; and has a PII, or skin irritation, value of 2 or less. In particular, all the starting ingredients should preferably give a negative result of the Ames test and have a PII, or skin irritation, value of 2 or less.

Abstract: A low temperature-curable connecting material for anisotropically electroconductive connection, which can be cured at lower temperature with reduction of shrinkage of the material upon curing, whereby an accumulation of internal stresses is avoided to thereby increase the bonding strength and the reliability of electric continuity in the connection while securing an electrically insulating separation between the neighboring electrodes, the connection material comprising an adhesive mass for bonding and connecting elements having electrodes thereon in a correspondingly confronting relationship, wherein the adhesive mass comprises a polymerizable component subject to radical polymerization and to cross-linking, a polymerization initiator and a block copolymer having a segment compatible with the polymerizable component and a segment incompatible with the polymerizable component.

Abstract: Insulating adhesives or adhesive films which ensure both of sufficient repairability and continuity reliability and connection methods with the use of the same are provided.

Abstract: The anisotropic conductive adhesive includes the following components (a) to (d):

Abstract: An anisotropic conductive adhesive film capable of maintaining a high connection reliability on connection electrodes with a fine pitch on which an oxide film is formed.

Abstract: An anisotropic conductive adhesive film capable of maintaining a high connection reliability on connection electrodes with a fine pitch on which an oxide film is formed. The anisotropic conductive adhesive film 1 comprises conductive particles 7 dispersed in an insulating binder 6. Each conductive particle 7 consists of a styrene resin particle 71 and a thin metal film 72 formed on the surface thereof by gold-plating, etc. Projections 72a are formed on the surface of the thin metal film 72 of the conductive particle 7.

Abstract: The adhesive material contains a radical-polymerizable compound, a curing agent, and a thermoplastic resin; gives a negative result of the Ames test; and has a PII, or skin irritation, value of 2 or less. In particular, all the starting ingredients should preferably give a negative result of the Ames test and have a PII, or skin irritation, value of 2 or less.