Patents by Inventor Torayuki Tsukada
Torayuki Tsukada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9384876Abstract: A chip resistor includes a first electrode 1, a second electrode 2, a resistor portion 3, a first intermediate layer 4 connected to the first electrode 1 and the resistor portion 3, a second intermediate layer 5 connected to the second electrode 2 and the resistor portion 3, a coating film 61 covering the first electrode 1, and oxides existing in the first intermediate layer 4. The coating film 61 is made of a material having a higher absorptance of a laser beam of a predetermined wavelength than that of the material forming the first electrode 1. The oxides are oxides of the material forming the coating film 61.Type: GrantFiled: October 12, 2012Date of Patent: July 5, 2016Assignee: ROHM CO., LTD.Inventors: Torayuki Tsukada, Kentaro Naka
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Patent number: 9343208Abstract: A method of manufacturing a chip resistor includes forming a resistor assembly in which a conductive member including portions separated from each other in a first direction is provided in a resistance body member; and dividing the resistor assembly into chip resistors, each including a chip-shaped resistance body formed by a part of the resistance body member, a pair of main electrodes formed by a part of the conductive member and separated from each other in the first direction, and a pair of sub-electrodes formed by a part of the conductive member, separated from each other in the first direction, and adjacent to the main electrodes in a second direction perpendicular to the first direction with concave portions recessed in the first direction interposed therebetween, by punching.Type: GrantFiled: February 6, 2015Date of Patent: May 17, 2016Assignee: Rohm Co., Ltd.Inventors: Torayuki Tsukada, Kentaro Naka
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Publication number: 20150155081Abstract: A method of manufacturing a chip resistor includes forming a resistor assembly in which a conductive member including portions separated from each other in a first direction is provided in a resistance body member; and dividing the resistor assembly into chip resistors, each including a chip-shaped resistance body formed by a part of the resistance body member, a pair of main electrodes formed by a part of the conductive member and separated from each other in the first direction, and a pair of sub-electrodes formed by a part of the conductive member, separated from each other in the first direction, and adjacent to the main electrodes in a second direction perpendicular to the first direction with concave portions recessed in the first direction interposed therebetween, by punching.Type: ApplicationFiled: February 6, 2015Publication date: June 4, 2015Inventors: Torayuki TSUKADA, Kentaro NAKA
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Patent number: 8970340Abstract: A method of manufacturing a chip resistor includes forming a resistor assembly in which a conductive member including portions separated from each other in a first direction is provided in a resistance body member; and dividing the resistor assembly into chip resistors, each including a chip-shaped resistance body formed by a part of the resistance body member, a pair of main electrodes formed by a part of the conductive member and separated from each other in the first direction, and a pair of sub-electrodes formed by a part of the conductive member, separated from each other in the first direction, and adjacent to the main electrodes in a second direction perpendicular to the first direction with concave portions recessed in the first direction interposed therebetween, by punching.Type: GrantFiled: January 3, 2013Date of Patent: March 3, 2015Assignee: Rohm Co., Ltd.Inventors: Torayuki Tsukada, Kentaro Naka
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Publication number: 20140247108Abstract: [Object] A chip resistor suitable for enhancing manufacturing efficiency is provided. [Means] A chip resistor includes a first electrode 1, a second electrode 2, a resistor portion 3, a first intermediate layer 4 connected to the first electrode 1 and the resistor portion 3, a second intermediate layer 5 connected to the second electrode 2 and the resistor portion 3, a coating film 61 covering the first electrode 1, and oxides existing in the first intermediate layer 4. The coating film 61 is made of a material having a higher absorptance of a laser beam of a predetermined wavelength than that of the material forming the first electrode 1. The oxides are oxides of the material forming the coating film 61.Type: ApplicationFiled: October 12, 2012Publication date: September 4, 2014Applicant: ROHM CO., LTDInventors: Torayuki Tsukada, Kentaro Naka
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Patent number: 8111130Abstract: A chip resistor includes a resistor element, a reinforcing member, and a pair of electrodes. The resistor element includes a first surface and a second surface opposite to the first surface. The reinforcing member is bonded to the first surface of the resistor element. The pair of electrodes are formed on the second surface of the resistor element. The resistor element is formed with a slit located between the pair of electrodes.Type: GrantFiled: May 13, 2009Date of Patent: February 7, 2012Assignee: Rohm Co., Ltd.Inventor: Torayuki Tsukada
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Patent number: 8081059Abstract: A chip resistor (A1) includes a chip-like resistor element (1), two electrodes (31) spaced from each other on the bottom surface (1a) of the resistor element, and an insulation film (21) between the two electrodes. Each electrode (31) has an overlapping portion (31c) which overlaps the insulation film (21) as viewed in the vertical direction.Type: GrantFiled: January 25, 2010Date of Patent: December 20, 2011Assignee: Rohm Co., Ltd.Inventors: Masanori Tanimura, Torayuki Tsukada, Kousaku Tanaka
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Patent number: 8044765Abstract: A chip resistor includes a metal resistor element made in the form of a chip that includes an upper surface, a lower surface, two end surfaces, and two side surfaces. Two electrodes are formed on the resistor element to be spaced from each other in a longitudinal direction of the resistor element. Each of the electrodes is formed directly on the resistor element and extends continuously from the lower surface onto the upper surface via a corresponding one of the two end surfaces.Type: GrantFiled: December 4, 2008Date of Patent: October 25, 2011Assignee: Rohm Co., Ltd.Inventor: Torayuki Tsukada
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Patent number: 7907046Abstract: The chip resistor (1) of the present invention includes an insulating substrate (2) in the form of a chip, a pair of terminal electrodes (3, 4) formed on both ends of the insulating substrate (2), a plurality of resistor films (5) formed on an obverse surface of the insulating substrate (2) in parallel with each other between the paired terminal electrodes (3, 4), and a cover coat formed on the obverse surface of the insulating substrate (2) to cover the resistor films (5). In the chip resistor (1), one of the terminal electrodes (3) includes individual upper electrodes (8) each formed on the obverse surface of the insulating substrate (3, 4) to be independently connected to a respective one of the resistor films (5) and a side electrode (9) formed on a side surface of the insulating substrate (2) to be connected to all the individual upper electrodes (8).Type: GrantFiled: September 4, 2006Date of Patent: March 15, 2011Assignee: Rohm Co., Ltd.Inventor: Torayuki Tsukada
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Patent number: 7786842Abstract: The chip resistor (1) includes an insulating substrate (2) and a main upper electrode (4) formed on a main surface of the insulating substrate (2). On the main surface of the insulating substrate (2), a resistor film (5) including an end (5a) overlapping the upper surface of main upper electrode (4) is formed. The resistor film (5) is covered by a protective coat (7, 8). An auxiliary upper electrode (6) is formed on the upper surface of the main upper electrode (4). The auxiliary upper electrode (6) includes an inner end (6a) overlapping the upper surface of the end (5a) of the resistor film (5). The protective coat (7, 8) overlaps the inner end (6a) of the auxiliary upper electrode (6).Type: GrantFiled: February 28, 2006Date of Patent: August 31, 2010Assignee: Rohm Co., Ltd.Inventors: Torayuki Tsukada, Masaki Yoneda
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Patent number: 7782172Abstract: A variable chip resistor (1) of the present invention includes a resistor element (2) made of a metal plate which is in the form of a chip and has a predetermined specific resistance. Terminal electrodes (3, 4) for soldering are provided at both ends of the resistor element (2), and at least one adjustment hole (9) is formed in the resistor element (2) at a portion between the terminal electrodes (3, 4). An adjustment rod (10) is inserted into the adjustment hole (9) in close contact with the inner surface of the adjustment hole. The adjustment rod (10) is made of an electroconductive material, and its insertion depth is adjustable in the axial direction of the adjustment hole (9).Type: GrantFiled: September 4, 2006Date of Patent: August 24, 2010Assignee: Rohm Co., Ltd.Inventor: Torayuki Tsukada
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Patent number: 7755468Abstract: A chip resistor includes a resistive element (1), an insulation layer (4) formed in a back surface of the flat surface, and two electrodes (3) spaced from each other via the insulation layer. Each electrode (3) makes contact with the insulation layer (4). Each electrode (3) has a lower surface formed with a solder layer (39).Type: GrantFiled: December 18, 2007Date of Patent: July 13, 2010Assignee: Rohm Co., Ltd.Inventor: Torayuki Tsukada
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Patent number: 7755467Abstract: The chip resistor (1) of the present invention includes a pair of terminal electrodes (4, 5) provided at ends of an insulating substrate (2) in the form of a chip, and a resistor film (3) formed on the upper surface of the insulating substrate (2) for electrical connection to the paired terminal electrodes (4, 5) and formed with a trimming groove (3a) for setting the resistance. The paired terminal electrodes (4, 5) include a lower electrode (4b) formed on the lower surface of the insulating substrate (2). The lower electrode (4b) extends up to a position directly below a narrower portion (8) of the resistor film (3) which has a relatively small width due to the formation of the trimming groove (3a) in the resistor film (3).Type: GrantFiled: August 2, 2006Date of Patent: July 13, 2010Assignee: Rohm Co., Ltd.Inventor: Torayuki Tsukada
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Publication number: 20100117783Abstract: A chip resistor (A1) includes a chip-like resistor element (1), two electrodes (31) spaced from each other on the bottom surface (1a) of the resistor element, and an insulation film (21) between the two electrodes. Each electrode (31) has an overlapping portion (31c) which overlaps the insulation film (21) as viewed in the vertical direction.Type: ApplicationFiled: January 25, 2010Publication date: May 13, 2010Applicant: ROHM CO., LTD.Inventors: Masanori TANIMURA, Torayuki Tsukada, Kousaku Tanaka
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Patent number: 7667568Abstract: A chip resistor (A1) includes a chip-like resistor element (1), two electrodes (31) spaced from each other on the bottom surface (1a) of the resistor element, and an insulation film (21) between the two electrodes. Each electrode (31) has an overlapping portion (31c) which overlaps the insulation film (21) as viewed in the vertical direction.Type: GrantFiled: March 23, 2005Date of Patent: February 23, 2010Assignee: Rohm Co., Ltd.Inventors: Masanori Tanimura, Torayuki Tsukada, Kousaku Tanaka
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Publication number: 20090284342Abstract: A chip resistor includes a resistor element, a reinforcing member, and a pair of electrodes. The resistor element includes a first surface and a second surface opposite to the first surface. The reinforcing member is bonded to the first surface of the resistor element. The pair of electrodes are formed on the second surface of the resistor element. The resistor element is formed with a slit located between the pair of electrodes.Type: ApplicationFiled: May 13, 2009Publication date: November 19, 2009Applicant: ROHM CO., LTD.Inventor: Torayuki TSUKADA
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Patent number: 7612429Abstract: A chip resistor (A1) comprises a first insulation layer (2A) covering the regions between a plurality of electrodes (3) on a rear surface (10a) of a resistor (1), and a second insulation layer covering a pair of side faces of the resistor (1). Inadvertent adhesion of solder to an improper part of the resistor (1) can thereby be eliminated. A solder layer (4) is preferably formed on a pair of end faces (10d) of the resistor (1). In so doing, a solder fillet can be formed appropriately.Type: GrantFiled: October 30, 2003Date of Patent: November 3, 2009Assignee: Rohm Co., Ltd.Inventors: Torayuki Tsukada, Tadatoshi Miwa
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Publication number: 20090160602Abstract: The chip resistor (1) of the present invention includes a pair of terminal electrodes (4, 5) provided at ends of an insulating substrate (2) in the form of a chip, and a resistor film (3) formed on the upper surface of the insulating substrate (2) for electrical connection to the paired terminal electrodes (4, 5) and formed with a trimming groove (3a) for setting the resistance. The paired terminal electrodes (4, 5) include a lower electrode (4b) formed on the lower surface of the insulating substrate (2). The lower electrode (4b) extends up to a position directly below a narrower portion (8) of the resistor film (3) which has a relatively small width due to the formation of the trimming groove (3a) in the resistor film (3).Type: ApplicationFiled: August 2, 2006Publication date: June 25, 2009Applicant: ROHM CO., LTD.Inventor: Torayuki Tsukada
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Publication number: 20090153287Abstract: A chip resistor includes a metal resistor element made in the form of a chip that includes an upper surface, a lower surface, two end surfaces, and two side surfaces. Two electrodes are formed on the resistor element to be spaced from each other in a longitudinal direction of the resistor element. Each of the electrodes is formed directly on the resistor element and extends continuously from the lower surface onto the upper surface via a corresponding one of the two end surfaces.Type: ApplicationFiled: December 4, 2008Publication date: June 18, 2009Applicant: ROHM CO., LTD.Inventor: Torayuki TSUKADA
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Publication number: 20090115568Abstract: The chip resistor (1) of the present invention includes an insulating substrate (2) in the form of a chip, a pair of terminal electrodes (3, 4) formed on both ends of the insulating substrate (2), a plurality of resistor films (5) formed on an obverse surface of the insulating substrate (2) in parallel with each other between the paired terminal electrodes (3, 4), and a cover coat formed on the obverse surface of the insulating substrate (2) to cover the resistor films (5). In the chip resistor (1), one of the terminal electrodes (3) includes individual upper electrodes (8) each formed on the obverse surface of the insulating substrate (3, 4) to be independently connected to a respective one of the resistor films (5) and a side electrode (9) formed on a side surface of the insulating substrate (2) to be connected to all the individual upper electrodes (8).Type: ApplicationFiled: September 4, 2006Publication date: May 7, 2009Applicant: ROHM CO., LTD.Inventor: Torayuki Tsukada