Patents by Inventor Torayuki Tsukada
Torayuki Tsukada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090096570Abstract: A variable chip resistor (1) of the present invention includes a resistor element (2) made of a metal plate which is in the form of a chip and has a predetermined specific resistance. Terminal electrodes (3, 4) for soldering are provided at both ends of the resistor element (2), and at least one adjustment hole (9) is formed in the resistor element (2) at a portion between the terminal electrodes (3, 4). An adjustment rod (10) is inserted into the adjustment hole (9) in close contact with the inner surface of the adjustment hole. The adjustment rod (10) is made of an electroconductive material, and its insertion depth is adjustable in the axial direction of the adjustment hole (9).Type: ApplicationFiled: September 4, 2006Publication date: April 16, 2009Applicant: ROHM CO., LTDInventor: Torayuki Tsukada
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Publication number: 20080272879Abstract: A chip resistor includes a resistive element (1), an insulation layer (4) formed in a back surface of the flat surface, and two electrodes (3) spaced from each other via the insulation layer. Each electrode (3) makes contact with the insulation layer (4). Each electrode (3) has a lower surface formed with a solder layer (39).Type: ApplicationFiled: December 18, 2007Publication date: November 6, 2008Applicant: ROHM CO., LTD.Inventor: Torayuki Tsukada
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Publication number: 20080224818Abstract: A chip resistor (A1) includes a chip-like resistor element (1), two electrodes (31) spaced from each other on the bottom surface (1a) of the resistor element, and an insulation film (21) between the two electrodes. Each electrode (31) has an overlapping portion (31c) which overlaps the insulation film (21) as viewed in the vertical direction.Type: ApplicationFiled: March 23, 2005Publication date: September 18, 2008Applicant: ROHM CO., LTDInventors: Masanori Tanimura, Torayuki Tsukada, Kousaku Tanaka
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Publication number: 20080129443Abstract: The chip resistor (1) includes an insulating substrate (2) and a main upper electrode (4) formed on a main surface of the insulating substrate (2). On the main surface of the insulating substrate (2) , a resistor film (5) including an end (5a) overlapping the upper surface of main upper electrode (4) is formed. The resistor film (5) is covered by a protective coat (7, 8). An auxiliary upper electrode (6) is formed on the upper surface of the main upper electrode (4). The auxiliary upper electrode (6) includes an inner end (6a) overlapping the upper surface of the end (5a) of the resistor film (5). The protective coat (7, 8) overlaps the inner end (6a) of the auxiliary upper electrode (6).Type: ApplicationFiled: February 28, 2006Publication date: June 5, 2008Applicant: ROHM CO., LTD.Inventors: Torayuki Tsukada, Masaki Yoneda
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Patent number: 7380333Abstract: A method of making a chip resistor is provided. The method includes the following steps. First, a resistive element is provided on a substrate. Then, a resin layer is formed on the substrate to enclose the resistive element. Then, the substrate and the resin layer are cut in this order. To prevent the breakage of the substrate during the cutting, the resin layer has better machinability than the substrate.Type: GrantFiled: April 15, 2002Date of Patent: June 3, 2008Assignee: Rohm Co., Ltd.Inventors: Torayuki Tsukada, Takahiro Kuriyama
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Patent number: 7378937Abstract: A chip resistor includes a resistor element in the form of a chip, and at least two electrodes formed on the resistor element. The resistor element includes an upper surface, a lower surface, and two end surfaces extending between the upper and the lower surfaces and spaced from each other. The two electrodes are provided on the lower surface of the resistor element. Each of the end surfaces of the resistor element is formed with a conductor film integrally connected to a corresponding one of the electrodes. The conductor film is made of copper, for example, and is higher in solder-wettability than the resistor element.Type: GrantFiled: February 8, 2007Date of Patent: May 27, 2008Assignee: Rohm Co., Ltd.Inventor: Torayuki Tsukada
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Patent number: 7342480Abstract: A chip resistor includes a resistor element of a rectangular solid made of an alloy composed of high-resistant metal and low-resistant metal. The resistor has connection terminal electrodes disposed at the ends of the resistor element that are spaced longitudinally of the rectangular solid. The resistance of the chip resistor is lowered without incurring an increase in the temperature coefficient of resistance and the weight. A plating layer is formed on the resistor element, where the plating element is made of pure metal having a lower resistance that that of the alloy constituting the resistor element.Type: GrantFiled: June 12, 2003Date of Patent: March 11, 2008Assignee: Rohm Co., Ltd.Inventor: Torayuki Tsukada
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Patent number: 7330099Abstract: A chip resistor includes a resistive element (1), an insulation layer (4) formed in a back surface of the flat surface, and two electrodes (3) spaced from each other via the insulation layer. Each electrode (3) makes contact with the insulation layer (4). Each electrode (3) has a lower surface formed with a solder layer (39).Type: GrantFiled: July 22, 2003Date of Patent: February 12, 2008Assignee: Rohm Co., Ltd.Inventor: Torayuki Tsukada
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Patent number: 7326999Abstract: A chip resistor (R1) includes a resistor element (1) having a first surface (1a) and a second surface (1b) opposite to the first surface. Two main electrodes (21), spaced from each other, are provided on the first surface (1a), while two auxiliary electrodes (22), spaced from each other, are provided on the second surface (1b). The auxiliary electrodes face the main electrodes (21) via the resistor element (1). The main electrodes (21) and the auxiliary electrodes (22) are made of the same material.Type: GrantFiled: April 16, 2004Date of Patent: February 5, 2008Assignee: Rohm Co., Ltd.Inventor: Torayuki Tsukada
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Patent number: 7327214Abstract: A chip resistor includes a metal resistor element having a flat lower surface. The lower surface is formed with two electrodes spaced from each other, and an insulating resin film is formed between these electrodes. Each of the electrodes partially overlaps the insulating film so that a portion of the insulating film is inserted between each of the electrodes and the lower surface of the resistor element.Type: GrantFiled: September 26, 2006Date of Patent: February 5, 2008Assignee: Rohm Co., Ltd.Inventor: Torayuki Tsukada
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Publication number: 20070132545Abstract: A chip resistor includes a resistor element in the form of a chip, and at least two electrodes formed on the resistor element. The resistor element includes an upper surface, a lower surface, and two end surfaces extending between the upper and the lower surfaces and spaced from each other. The two electrodes are provided on the lower surface of the resistor element. Each of the end surfaces of the resistor element is formed with a conductor film integrally connected to a corresponding one of the electrodes. The conductor film is made of copper, for example, and is higher in solder-wettability than the resistor element.Type: ApplicationFiled: February 8, 2007Publication date: June 14, 2007Applicant: ROHM CO., LTD.Inventor: Torayuki Tsukada
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Patent number: 7221254Abstract: A resistor, including a resistive element made of a metal plate, has a low resistance resulting from connection terminal electrodes formed on both ends of the lower surface of the resistive element. The object thereof is to achieve weight reduction and lower costs by reducing the height of the resistor. To achieve the above object, the ends of the lower surface of the resistive element are provided with recesses for accommodating the connection terminal electrodes, while at least the intermediate area of the lower surface of the resistive element between the connection terminal electrodes is covered with an insulator. Alternatively, a recess may be formed in the middle of the lower surface of the resistive element for using the ends of the lower surface as a pair of connection terminal electrodes, the recess being internally covered with an insulator.Type: GrantFiled: June 12, 2003Date of Patent: May 22, 2007Assignee: Rohm Co., Ltd.Inventor: Torayuki Tsukada
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Patent number: 7193499Abstract: A chip resistor includes a resistor element in the form of a chip, and at least two electrodes formed on the resistor element. The resistor element includes an upper surface, a lower surface, and two end surfaces extending between the upper and the lower surfaces and spaced from each other. The two electrodes are provided on the lower surface of the resistor element. Each of the end surfaces of the resistor element is formed with a conductor film integrally connected to a corresponding one of the electrodes. The conductor film is made of copper, for example, and is higher in solder-wettability than the resistor element.Type: GrantFiled: April 27, 2004Date of Patent: March 20, 2007Assignee: Rohm Co., Ltd.Inventor: Torayuki Tsukada
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Publication number: 20070018782Abstract: A chip resistor includes a metal resistor element having a flat lower surface. The lower surface is formed with two electrodes spaced from each other, and an insulating resin film is formed between these electrodes. Each of the electrodes partially overlaps the insulating film so that a portion of the insulating film is inserted between each of the electrodes and the lower surface of the resistor element.Type: ApplicationFiled: September 26, 2006Publication date: January 25, 2007Applicant: ROHM CO., LTD.Inventor: Torayuki Tsukada
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Publication number: 20060273423Abstract: A chip resistor (A1) includes a resistor element (1) including an electrode forming surface (10b), two electrodes (3) provided at the electrode-forming surface (10b), and an insulating layer (2A) provided at the electrode-forming surface (10b). The electrode-forming surface (10b) includes an inter-electrode region positioned between the two electrodes (3) and covered by the insulating layer (2A). The insulating layer (2A) has a thickness (t2) which is equal or generally equal to the thickness (t1) of the electrodes (3).Type: ApplicationFiled: April 7, 2004Publication date: December 7, 2006Applicant: ROHM CO., LTD.Inventor: Torayuki Tsukada
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Patent number: 7129814Abstract: A chip resistor includes a metal resistor element having a flat lower surface. The lower surface is formed with two electrodes spaced from each other, and an insulating resin film is formed between these electrodes. Each of the electrodes partially overlaps the insulating film so that a portion of the insulating film is inserted between each of the electrodes and the lower surface of the resistor element.Type: GrantFiled: April 27, 2004Date of Patent: October 31, 2006Assignee: Rohm Co., Ltd.Inventor: Torayuki Tsukada
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Publication number: 20060205171Abstract: A chip resistor (R1) includes a resistor element (1) having a first surface (1a) and a second surface (1b) opposite to the first surface. Two main electrodes (21), spaced from each other, are provided on the first surface (1a), while two auxiliary electrodes (22), spaced from each other, are provided on the second surface (1b). The auxiliary electrodes face the main electrodes (21) via the resistor element (1). The main electrodes (21) and the auxiliary electrodes (22) are made of the same material.Type: ApplicationFiled: April 16, 2004Publication date: September 14, 2006Inventor: Torayuki Tsukada
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Publication number: 20050266615Abstract: A chip resistor includes a resistive element (1), an insulation layer (4) formed in a back surface of the flat surface, and two electrodes (3) spaced from each other via the insulation layer. Each electrode (3) makes contact with the insulation layer (4). Each electrode (3) has a lower surface formed with a solder layer (39).Type: ApplicationFiled: July 22, 2003Publication date: December 1, 2005Applicant: ROHM CO., LTD.Inventor: Torayuki Tsukada
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Publication number: 20050225424Abstract: A resistor, including a resistive element made of a metal plate, has a low resistance resulting from connection terminal electrodes formed on both ends of the lower surface of the resistive element. The object thereof is to achieve weight reduction by reducing the height and also to achieve lower costs. To attain the above object, the ends of the lower surface of the resistive element are provided with recesses for accommodating the connection terminal electrodes, while at least the intermediate area of the lower surface of the resistive element between the connection terminal electrodes is covered with an insulator. Alternatively, a recess may be formed in the middle of the lower surface of the resistive element for using the ends of the lower surface as a pair of connection terminal electrodes, the recess being internally covered with an insulator.Type: ApplicationFiled: June 12, 2003Publication date: October 13, 2005Applicant: ROHM CO., LTDInventor: Torayuki Tsukada
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Publication number: 20050200451Abstract: A chip resistor includes a resistor element of a rectangular solid made of an alloy composed of high-resistant metal and low-resistant metal, while also including connection terminal electrodes disposed at the ends of the resistor element that are spaced longitudinally of the rectangular solid. The resistance of the chip resistor is expected to be lowered without incurring an increase in the temperature coefficient of resistance and the weight. The above object is attained by forming a plating layer on the resistor element, where the plating layer is made of pure metal having a lower resistance than that of the alloy constituting the resistor element.Type: ApplicationFiled: June 12, 2003Publication date: September 15, 2005Applicant: ROHM CO., LTD.Inventor: Torayuki Tsukada