Abstract: A chip resistor includes a metal resistor element having a flat lower surface. The lower surface is formed with two electrodes spaced from each other, and an insulating resin film is formed between these electrodes. Each of the electrodes partially overlaps the insulating film so that a portion of the insulating film is inserted between each of the electrodes and the lower surface of the resistor element.

Abstract: A chip resistor having a highly accurately adjusted low resistance value is obtained. The chip resistor having a vertically three-layered structure is obtained by forming a first electrode 1A by printing paste for an electrode on an insulating substrate 5 and drying it, a resistor layer 3 by printing paste for a resistor on the first electrode 1A and drying it, a second electrode 1B by printing paste for an electrode on the resistor layer 3 and the insulating substrate 5 and baking it. Trimming is applied to the thus fabricated chip resistor so as to adjust a resistance value to a given value.

Abstract: A chip resistor includes a resistor element in the form of a chip, and at least two electrodes formed on the resistor element. The resistor element includes an upper surface, a lower surface, and two end surfaces extending between the upper and the lower surfaces and spaced from each other. The two electrodes are provided on the lower surface of the resistor element. Each of the end surfaces of the resistor element is formed with a conductor film integrally connected to a corresponding one of the electrodes. The conductor film is made of copper, for example, and is higher in solder-wettability than the resistor element.

Abstract: A multi-element electronic chip device is manufactured which has a plurality of elements such as film resistors 2 or the like on one insulating substrate 1 by carrying out a step of performing primary division of a ceramic material plate A corresponding to a multiplicity of insulating substrates 1 into ceramic bars A′ each corresponding to a row of plural insulating substrates 1, a step of forming grooves 6 in lengthwise side faces of each ceramic bar A′ before forming side electrodes 5 for both ends of each film resistor 2 or forming grooves 6 after forming side electrodes 5, and a step of performing secondary division of the ceramic bar A′ into individual insulating substrates 1. This structure is a low cost solution for preventing the side electrodes 5 for different film resistors 2 from connecting with each other.

Abstract: A method of making a chip resistor is provided. According to this method, an aggregate board is first prepared which includes a first region and a second region which are spaced from each other via an excess portion. Then, a conductor pattern is formed which extends to bridge the first region and the second region. Subsequently, a resistor element is formed in each of the first region and the second region for connection to the conductor pattern. Then, the aggregate board is cut at the excess portion. The conductor pattern includes a thinner-walled portion extending across the excess portion and a thicker-walled portion connected to the thinner-walled portion and spaced from the excess portion.

Abstract: A multi-element electronic chip device is manufactured which has a plurality of elements such as film resistors 2 or the like on one insulating substrate 1 by carrying out a step of performing primary division of a ceramic material plate A corresponding to a multiplicity of insulating substrates 1 into ceramic bars A′ each corresponding to a row of plural insulating substrates 1, a step of forming grooves 6 in lengthwise side faces of each ceramic bar A′ before forming side electrodes 5 for both ends of each film resistor 2 or forming grooves 6 after forming side electrodes 5, and a step of performing secondary division of the ceramic bar A′ into individual insulating substrates 1. This structure is a low cost solution for preventing the side electrodes 5 for different film resistors 2 from connecting with each other.

Abstract: A method of making a chip resistor is provided. The method includes the following steps. First, a resistive element is provided on a substrate. Then, a resin layer is formed on the substrate to enclose the resistive element. Then, the substrate and the resin layer are cut in this order. To prevent the breakage of the substrate during the cutting, the resin layer has better machinability than the substrate.

Abstract: A method of making a chip resistor is provided. According to this method, an aggregate board is first prepared which includes a first region and a second region which are spaced from each other via an excess portion. Then, a conductor pattern is formed which extends to bridge the first region and the second region. Subsequently, a resistor element is formed in each of the first region and the second region for connection to the conductor pattern. Then, the aggregate board is cut at the excess portion. The conductor pattern includes a thinner-walled portion extending across the excess portion and a thicker-walled portion connected to the thinner-walled portion and spaced from the excess portion.

Abstract: A chip resistor having a highly accurately adjusted low resistance value is obtained. The chip resistor having a vertically three-layered structure is obtained by forming a first electrode 1A by printing paste for an electrode on an insulating substrate 5 and drying it, a resistor layer 3 by printing paste for a resistor on the first electrode 1A and drying it, a second electrode 1B by printing paste for an electrode on the resistor layer 3 and the insulating substrate 5 and baking it. Trimming is applied to the thus fabricated chip resistor so as to adjust a resistance value to a given value.