Abstract: A nozzle unit for use in an adjoining apparatus which places a heat fused electrically conductive member in an adjoining position for adjoining a first member and a second member, thereby electrically adjoining the first member and the second member, the nozzle unit including: a tubular nozzle assembly having a containing space which contains the conductive member and an aperture which communicates with the containing space, through which the conductive member, contained in the containing space, is ejected to the adjoining position, and which has a diameter larger than a diameter of the conductive member; and a hold member for releasably holding the conductive member in the containing space; wherein the nozzle assembly includes a tubular guide area of an internal diameter same as the diameter of the aperture, in a region from the position of the conductive member, supported by the support member, to the aperture.

Abstract: A solder bonding method and a solder bonding device are provided, in which solder is melted, and heating of electrode portions is performed by irradiating laser light to an inner side of a region where electrodes portions are provided, making the temperature difference between the electrode portions and the melted solder smaller to improve the wettability of the solder and increase bonding reliability. The solder bonding method and the solder bonding device perform bonding of the electrode portions that are formed on an object to be bonded by melting the solder. After supplying the solder onto the electrode portions before melting, a laser is irradiated to the solder and to the electrode portions in the periphery of the solder. The solder melts, and the electrode portions are heated. The wettability of the solder with respect to the electrode portions thus improves, and the reliability of an electrical connection between the electrode portions can be increased.

Abstract: A method and a system for stabilizing the sight line of a chip component being carried on two discs, for stabilizing delivery of the chip component between the two discs, and improving and stabilizing the inspection accuracy in the visual check of the chip component. This is achieved by employing a mechanism for carrying the chip component while supporting it on the horizontal plane of the first rotary disc and then carrying the chip component while suction-holding it on the vertical plane of the second rotary disc. When the chip component is carried on the first rotary disc, the upper surface and one side face of the chip component are imaged by first and second cameras. When the chip component is carried on the second rotary disc, the lower surface and the other side face of the chip component are imaged by third and fourth cameras.

Abstract: A horn that can suppress oscillation components other than the component in the horizontal direction, a horn unit, and a bonding apparatus using same are provided. In the horn 50 in accordance with the present invention, oscillations are applied by an oscillator 42. The horn 50 has a cross-section variable section 54 in which a cross section perpendicular to the lengthwise direction (X direction) of the horn 50 has a first region A1 extending in the Z direction and a pair of second regions A2 sandwiching the first region A1 from the direction (Y direction) perpendicular to the Z direction. In the position P3 corresponding to an anti-node of a standing wave of oscillations excited in the horn 50, a sectional area S1 of the first region A1 assumes a maximum and a sectional area S2 of the second region A2 assumes a minimum.

Abstract: Provided is a mounting apparatus which enables high levels of both maintenance/improvement of product quality and reduction of product cost by reliably preventing accidental contact of a mounting part with a mounting target part while enhancing the productivity.

Abstract: Provided is a method for adjusting static attitude of a magnetic head attached to a flexure that is disposed near a free end of a head support. The free end is a distal end in a longitudinal direction of the head support. The method includes generating an adjustment condition by analyzing an image signal obtained from images of the magnetic head, the images being picked up with at least two image pickup units; bending the flexure for static attitude adjustment based on the adjustment condition; and irradiating a laser beam to a bent area of the flexure.

Abstract: Provided is a method for adjusting static attitude of a thin film magnetic head attached to a flexure of a head arm assembly. The method includes: previously ranking and memorizing adjustment conditions corresponding to static attitude angles of the thin film magnetic head; measuring a static attitude angle of the thin film magnetic head; bending the flexure for static attitude adjustment based on a particular adjustment condition corresponding to a measured angle; and irradiating a laser beam to a bent area of the flexure.

Abstract: The invention provides a mounting method capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In this method, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.

Abstract: Provided are a solder ball bonding method and a solder ball bonding device for performing bonding of a plurality of electrode portions formed on objects to be bonded by melting solder balls. The solder balls are suctioned by using a plurality of suction nozzles that follow the electrode portions of the objects to be bonded, and conveyed onto the electrode portions. A laser irradiation portion that is positioned above the suction nozzles is then moved in a direction along which the suction nozzles are arranged, while the solder balls are irradiated with laser light passing through suction openings of the suction nozzles by using the laser irradiation portion. Accordingly, it is possible to melt the plurality of solder balls on the electrode portions by using only a single laser irradiation portion.

Abstract: In a maintenance method of an inkjet printer comprising an air discharge device which discharges air accumulated in ink supply paths with pressurized air and an ink vacuum device which vacuums ink from an inkjet head, the pressurized air is in a high pressure mode when the air discharge device is used. The pressurized air is in a low pressure mode when the ink vacuum device is used. The driving time and the rotational speed of a drive motor which drives an air pump are controlled according to the capability and the ambient temperature of the air pump which generates the pressurized air.

Abstract: The present invention provides a magnetic head construction, a connection method and a connecting device by which excellent electrical connection can be carried out between a core electrode and a substrate land face on a flexure in a magnetic head employing the piggy back system. In order to attain the object of interest, in the present invention, a fine adjustment actuator is arranged between a core and a flexure; a projection portion which is projected from the fine adjustment actuator when viewed from the flexure is provided in the core; a hole is provided in the position, on the flexure, corresponding to the projection portion; only the core is fixed by a support portion provided through the hole portion and a clamp pin without applying any load to the fine adjustment actuator; and while maintaining this fixing state, an electrode and a substrate land are bonded to each other with a wire.

Abstract: A solder dispenser provides a cylindrical dispensing container which has a solder inlet for introducing the above-mentioned solder member, and an opening portion for discharging the above-mentioned solder member to the external, and forms an internal space where the solder member can fall between the above-mentioned solder inlet and the above-mentioned opening portion, and a solder supply portion which is detachably mounted in the dispensing container and holds the solder member, wherein, in a state that the above-mentioned lid member is mounted in the above-mentioned dispensing container, the above-mentioned solder supply portion holds the above-mentioned solder member in the opening region of the above-mentioned solder inlet and the above-mentioned internal space becomes a closed space except the above-mentioned opening portion, and wherein, when holding of the solder member is released, the solder member falls inside a closed space to arrive at the opening portion.

Abstract: Provided is a nozzle unit for use in a bonding device in which bonding between a first member and a second member is effected by providing a bonding member that has been melted by heating at a bonding position where the first member and the second member are to be bonded to each other. The nozzle unit includes: a cylindrical nozzle assembly having an accommodating space accommodating the bonding member, and an opening which allows ejection of the bonding member accommodated in the accommodating space onto the bonding position, which has a diameter larger than the diameter of the bonding member, and which communicates with the accommodating space; and a holding/releasing member for releasably holding the bonding member within the accommodating space.

Abstract: The present invention provides a quartz glass single hole nozzle for feeding fluid capable of performing high-precision control of a flow rate, a burner for heat processing equipped with the quartz glass single hole nozzle, a quartz glass multihole burner head for feeding fluid preferably used in flame processing or the like, and a quartz glass burner for heat processing equipped with the multihole burner. By using the nozzle, even if a distal end portion of the quartz glass burner, namely the nozzle is broken by contact with a workpiece or the like, it is enough to only replace the broken nozzle with a new one without a necessity for replacing the entire expensive quartz glass burner. When applying the nozzle to a metal burner, there can be given usefulness of the quartz glass such as heat resistance and contamination resistance or the like.

Abstract: The present invention provides a quartz glass single hole nozzle for feeding fluid capable of performing high-precision control of a flow rate, a burner for heat processing equipped with the quartz glass single hole nozzle, a quartz glass multihole burner head for feeding fluid preferably used in flame processing or the like, and a quartz glass burner for heat processing equipped with the multihole burner. By using the nozzle, even if a distal end portion of the quartz glass burner, namely the nozzle is broken by contact with a workpiece or the like, it is enough to only replace the broken nozzle with a new one without a necessity for replacing the entire expensive quartz glass burner. When applying the nozzle to a metal burner, there can be given usefulness of the quartz glass such as heat resistance and contamination resistance or the like.

Abstract: An ink-jet recording apparatus, including: a recording head including ink chambers each provided for each of inks of mutually different colors and nozzles each communicating with either of the ink chambers, the recording head performing recording by ejecting, from each of the nozzles, a corresponding one of the inks which corresponds to said each of the nozzles; an ink suction device including a cap arranged to fluid-tightly cover a nozzle surface of the recording head in which the nozzles are formed, the ink suction device sucking the inks from the nozzles utilizing the cap; and a control device for controlling the ink-jet recording apparatus, the control device including an initial-cleaning-operation executing portion which executes, upon initial working of the apparatus, an initial cleaning operation including: controlling the ink suction device to execute an initial ink sucking action wherein the inks are sucked from the nozzles; and controlling the recording head to execute (a) an all-nozzle-ink-ejecting

Abstract: The present invention provides a solder ball bonding method and a solder ball bonding apparatus, which can enhance efficiency of bonding processing and in which plural electrodes formed on objects to be bonded are bonded to each other by melting a solder ball. In the present invention, the solder balls are picked up by a pick-up nozzle having a plurality of pick-up openings corresponding to electrode areas on the objects to be bonded and the solder balls are conveyed on the electrode areas. A laser radiating unit disposed independently above the pick-up nozzle is shifted along an arrangement direction of the pick-up openings and a laser beam from the laser radiating unit is irradiated onto the solder ball through a transparent member of the pick-up nozzle and through the pick-up opening of the pick-up nozzle, thereby melting the solder ball on the electrode area.

Abstract: A cleaning apparatus according to the invention is used for an electronic component mounting machine, includes a abrading unit for abrading the suction surface of the mounting nozzle; and a drive unit for moving the abrading unit in a predetermined direction, the abrading unit being formed by a ceramics structure, and a grain size of a contact surface of the abrading unit ranges from P1000 to P5000, the contact surface of the abrading unit coming into contact with the suction surface of the mounting nozzle.

Abstract: An ink jet printer is provided with an ink jet head, a recovery device, a timer, and a controller. The ink jet head discharges ink. The recovery device executes a recovery action to recover an ink discharging ability of the ink jet head. The timer measures time since a last recovery action of the recovery device. The controller selects an interval based on a printing history of the ink jet printer and controls the recovery device to execute the recovery action when the time measured by the timer becomes equal to the selected interval. The recovery action is performed at an appropriate timing.

Abstract: Provided is a mounting apparatus which enables high levels of both maintenance/improvement of product quality and reduction of product cost by reliably preventing accidental contact of a mounting part with a mounting target part while enhancing the productivity. In S1, a contact detection start position Hs0 is set. In S2, a chip holding tool chucks an electronic part. In S3, S4, the tool is moved to a transfer position A, and then the tool is lowered to the Hs0 from the transfer position A. In S5, after the tool is lowered to the Hs0, the lowering speed is changed to a contact detection speed. In S6, it is determined whether or not the electronic part has come into contact with a substrate. If the result of the determination is YES, in S7, the lowering of the tool is stopped. In S8, the actual contact position Hc is measured. In S9, the next contact detection start position Hs1 is set, and Hs1 is set to Hs0 (Hs0-Hs1) so that the later steps reflect this setting.