Abstract: A mounting apparatus capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In the apparatus, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.

Abstract: The invention provides a mounting method capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In this method, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.

Abstract: A mounting apparatus capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In the apparatus, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.

Abstract: A solder bonding method and a solder bonding device are provided, in which solder is melted, and heating of electrode portions is performed by irradiating laser light to an inner side of a region where electrodes portions are provided, making the temperature difference between the electrode portions and the melted solder smaller to improve the wettability of the solder and increase bonding reliability. The solder bonding method and the solder bonding device perform bonding of the electrode portions that are formed on an object to be bonded by melting the solder. After supplying the solder onto the electrode portions before melting, a laser is irradiated to the solder and to the electrode portions in the periphery of the solder. The solder melts, and the electrode portions are heated. The wettability of the solder with respect to the electrode portions thus improves, and the reliability of an electrical connection between the electrode portions can be increased.

Abstract: Provided are a solder ball bonding method and a solder ball bonding device for performing bonding of a plurality of electrode portions formed on objects to be bonded by melting solder balls. The solder balls are suctioned by using a plurality of suction nozzles that follow the electrode portions of the objects to be bonded, and conveyed onto the electrode portions. A laser irradiation portion that is positioned above the suction nozzles is then moved in a direction along which the suction nozzles are arranged, while the solder balls are irradiated with laser light passing through suction openings of the suction nozzles by using the laser irradiation portion. Accordingly, it is possible to melt the plurality of solder balls on the electrode portions by using only a single laser irradiation portion.

Abstract: After introducing a solder ball from a hopper into a receiving hole of a ball separator, the ball separator is slid between blocks, and the solder ball is sent out to a portion outside of the blocks. By suctioning the solder ball from within a projected region on a lower block which is situated inside of the receiving hole at a time when the solder ball is taken into the receiving hole and surrounds a rolling trajectory of the solder ball that has been taken into the receiving hole, the solder ball is forcibly introduced into the receiving hole.

Abstract: The present invention provides a quartz glass single hole nozzle for feeding fluid capable of performing high-precision control of a flow rate, a burner for heat processing equipped with the quartz glass single hole nozzle, a quartz glass multihole burner head for feeding fluid preferably used in flame processing or the like, and a quartz glass burner for heat processing equipped with the multihole burner. By using the nozzle, even if a distal end portion of the quartz glass burner, namely the nozzle is broken by contact with a workpiece or the like, it is enough to only replace the broken nozzle with a new one without a necessity for replacing the entire expensive quartz glass burner. When applying the nozzle to a metal burner, there can be given usefulness of the quartz glass such as heat resistance and contamination resistance or the like.

Abstract: In a maintenance method of an inkjet printer comprising an air discharge device which discharges air accumulated in ink supply paths with pressurized air and an ink vacuum device which vacuums ink from an inkjet head, the pressurized air is in a high pressure mode when the air discharge device is used. The pressurized air is in a low pressure mode when the ink vacuum device is used. The driving time and the rotational speed of a drive motor which drives an air pump are controlled according to the capability and the ambient temperature of the air pump which generates the pressurized air.

Abstract: The present invention provides a magnetic head construction, a connection method and a connecting device by which excellent electrical connection can be carried out between a core electrode and a substrate land face on a flexure in a magnetic head employing the piggy back system. In order to attain the object of interest, in the present invention, a fine adjustment actuator is arranged between a core and a flexure; a projection portion which is projected from the fine adjustment actuator when viewed from the flexure is provided in the core; a hole is provided in the position, on the flexure, corresponding to the projection portion; only the core is fixed by a support portion provided through the hole portion and a clamp pin without applying any load to the fine adjustment actuator; and while maintaining this fixing state, an electrode and a substrate land are bonded to each other with a wire.

Abstract: The present invention provides a magnetic head construction, a connection method and a connecting device by which excellent electrical connection can be carried out between a core electrode and a substrate land face on a flexure in a magnetic head employing the piggy back system. In order to attain the object of interest, in the present invention, a fine adjustment actuator is arranged between a core and a flexure; a projection portion which is projected from the fine adjustment actuator when viewed from the flexure is provided in the core; a hole is provided in the position, on the flexure, corresponding to the projection portion; only the core is fixed by a support portion provided through the hole portion and a clamp pin without applying any load to the fine adjustment actuator; and while maintaining this fixing state, an electrode and a substrate land are bonded to each other with a wire.

Abstract: The present invention provides a magnetic head construction, a connection method and a connecting device by which excellent electrical connection can be carried out between a core electrode and a substrate land face on a flexure in a magnetic head employing the piggy back system. In order to attain the object of interest, in the present invention, a fine adjustment actuator is arranged between a core and a flexure; a projection portion which is projected from the fine adjustment actuator when viewed from the flexure is provided in the core; a hole is provided in the position, on the flexure, corresponding to the projection portion; only the core is fixed by a support portion provided through the hole portion and a clamp pin without applying any load to the fine adjustment actuator; and while maintaining this fixing state, an electrode and a substrate land are bonded to each other with a wire.

Abstract: The present invention provides a magnetic head construction, a connection method and a connecting device by which excellent electrical connection can be carried out between a core electrode and a substrate land face on a flexure in a magnetic head employing the piggy back system. In order to attain the object of interest, in the present invention, a fine adjustment actuator is arranged between a core and a flexure; a projection portion which is projected from the fine adjustment actuator when viewed from the flexure is provided in the core; a hole is provided in the position, on the flexure, corresponding to the projection portion; only the core is fixed by a support portion provided through the hole portion and a clamp pin without applying any load to the fine adjustment actuator; and while maintaining this fixing state, an electrode and a substrate land are bonded to each other with a wire.

Abstract: A core drill having a shank and a cup shaped base metal section constructed of a disk shaped top wall and a cylindrical side wall provided on a fore-end of the shank. A grinding stone portion is mounted on an outer end part of the base metal section, with abrasive grains fixed to the outer end part of the base metal section. Abrasive grain layers are formed in a spiral pattern on inner and outer side surfaces of the cylindrical side wall of the base metal section, with abrasive grains fixed to the inner and outer side surfaces of the cylindrical side wall thereof. When the grinding stone portion is put into rotational contact with a workpiece, the workpiece is ground through to form a circle hole in section leaving a cylindrical core therein.

Abstract: The present invention relates to an outer-diameter blade, an inner-diameter blade and cutting machines which respectively use the outer-diameter blade and the inner-diameter blade for cutting hard material, such as metal, ceramics, semiconductor single crystal, glass, quartz crystal, stone, asphalt or concrete, and a core drill and a core-drill processing machine which drives the core drill for forming a hole in the hard material.

Abstract: A controller for a machine capable of performing acceleration/deceleration control to which an optimal tangential acceleration within an allowable maximum acceleration for each axis is applied. A first interpolation section receives data obtained by analysis of a program by a command analysis section, an makes interpolating calculation in every first sampling period to output it into an intermediate memory. A tangential acceleration calculating section determines a tangential acceleration based on each segment and the allowable maximum acceleration for each axis to output it into the intermediate memory. A deceleration target velocity calculating section prepares an acceleration/deceleration pattern for a plurality of segments stored in the intermediate memory, to output it to the intermediate memory.

Abstract: When a system is activated, a host computer reads modules from an external nonvolatile memory, reconstructs control software for a machine in accordance with a system configuration information storage file, and transfers the control software to a volatile memory of each numerical control device. Various types of modules are stored collectively in the external nonvolatile memory without duplication. In updating the control software, it is necessary only that data be updated for the software modules in the external nonvolatile memory alone.

Abstract: A chip junction nozzle in that opposite slant planes 43 which come into contact with edges of 2 sides of the chip in parallel centering around a nozzle center, and a vacuum suction hole 42 opened in the nozzle center are provided, and the slant plane 43 is formed into a mirror surface having the surface hardness more than HrC40. Further, when the surface roughness of the mirror surface is expressed by the average roughness of the center line, the average roughness of the center line is not more than 1.6 &mgr;m.

Abstract: When a system is activated, a host computer (2) reads modules from an external nonvolatile memory (3), reconstructs control software for a machine in accordance with a system configuration information storage file (CR), and transfers the control software to a volatile memory (b) of each numerical control device. Various types of modules are stored collectively in the external nonvolatile memory (3) without duplication. In updating the control software, it is necessary only that data be updated for the software modules in the external nonvolatile memory (3) alone.

Abstract: The present invention provides a magnetic head construction, a connection method and a connecting device by which excellent electrical connection can be carried out between a core electrode and a substrate land face on a flexure in a magnetic head employing the piggy back system. In order to attain the object of interest, in the present invention, a fine adjustment actuator is arranged between a core and a flexure; a projection portion which is projected from the fine adjustment actuator when viewed from the flexure is provided in the core; a hole is provided in the position, on the flexure, corresponding to the projection portion; only the core is fixed by a support portion provided through the hole portion and a clamp pin without applying any load to the fine adjustment actuator; and while maintaining this fixing state, an electrode and a substrate land are bonded to each other with a wire.

Abstract: A chip junction nozzle in that opposite slant planes 43 which come into contact with edges of 2 sides of the chip in parallel centering around a nozzle center, and a vacuum suction hole 42 opened in the nozzle center are provided, and the slant plane 43 is formed into a mirror surface having the surface hardness more than HrC40. Further, when the surface roughness of the mirror surface is expressed by the average roughness of the center line, the average roughness of the center line is not more than 1.6 &mgr;m.