Abstract: A manufacturing method for forming a dual damascene structure in which the effective permittivity of an inter-layer insulating film is lowered without an etching mask for forming a contact hole, which is otherwise formed in the inter-layer insulating film. The manufacturing method comprises the step of forming an inorganic film to serve as an etching mask, on the inter-layer insulating film; the step of forming a first opening pattern for forming a wiring groove, in an upper part of the inorganic film; and the step of forming a second opening pattern for forming a contact hole, so as to coincide with the first opening pattern at least partially.

Abstract: A semiconductor device includes an inorganic insulating film provided on a low-dielectric-constant film, a hole pattern which passes through at least the inorganic insulating film, and a dummy hole pattern which passes through the inorganic insulating film. The dummy hole pattern is preferably formed in a region in which the pattern density of the hole pattern is low. The dummy hole pattern may include a trench or a hole. A method for fabricating a semiconductor device includes the steps of forming an inorganic insulating film on a low-dielectric-constant film, forming a hole pattern which passes through at least the inorganic insulating film, and forming a dummy hole pattern which passes through the inorganic insulating film.

Abstract: Disclosed is a method of forming a cap insulating film at a high reliability prior to heat-treatment for removing an —OH group from a planarization insulating film (APL film) which is excellent in a gap fill ability and global planarization ability and which is formed by a liquid phase CVD process. The (lower) cap insulating film is formed by plasma CVD using a source gas containing an inorganic silane compound gas, O2 and a hydrocarbon; or an organic silane compound gas and O2. With this method, the cap insulating film can be formed without occurrence of harmful ammonia and particles in plasma.

Abstract: A high dielectric constant material containing tantalum expressed by chemical formula Ta.sub.x O.sub.y N.sub.z, where x, y, and z are each a value which in total yield 1, z is 0.1 or higher but 0.625 or lower, y is 0 or higher but 0.6 or lower, and 0.4y and 0.6z in total equals to the value of x or lower, and a process for depositing a film of the material by means of chemical vapor deposition using Cp.sub.m Ta(N.sub.3).sub.n, where Cp represents cyclopentane, and m+n=5, or using a gaseous tantalum-containing organometallic compound, or by a means comprising plasma treatment under a gas containing nitrogen. Also claimed are a semiconductor device and a MOS transistor using the high dielectric film containing tantalum.

Abstract: A charging connector device for an electric vehicle is provided which includes a power receiving connector mounted on a vehicle body and a power supplying connector coupled or engaged with the power receiving connector. The power supplying connector includes a main cable path and a cable connecting portion. In the main cable path, a plurality of lead wires are arranged to be connected to a grounding terminal, a charging terminal and other terminals, and at least two wire securing shafts are provided for reducing tension exerted on the lead wires. Thus, a cable, connected to the power supplying connector, can be surely prevented from becoming disconnected from the power supply connector.

Abstract: An object of the Invention is to provide a method of forming an insulating film capable of stably causing the insulating film (an organic insulating film) made of an organic material to stably adhere to the surface of a silicon oxide film for a long time without generation of any void The surface of the silicon oxide film is hydroxylated prior to forming the organic insulating film on the silicon oxide film, and the surface of the silicon oxide film is coated with a silane coupling agent. In a case where fluororesin is employed to form the organic insulating film, a compound containing a fluorine atom is preferably employed as the silane coupling agent.

Abstract: A shield wire's terminal treatment structure including a housing into which a shield wire is inserted and which is secured to a mounting portion, and a shield connection ring which is capped on the housing and through which the shield wire is extended. In the structure, a braid of the shield wire which is protruded from the housing is folded over an outer peripheral surface of the housing, and the shield connection ring is mounted on the housing with the braid thus folded pushed against the outer peripheral surface of the housing.

Abstract: According to the present invention, gas which contains no impurities and has a high temperature of approximately 700 to 1400.degree. C. can be supplied for a long period with a short preparation time, and fluctuation in the temperature during supply can be reduced.

Abstract: Disclosed is an interlayer insulating film using low dielectric constant films, which can be improved in rigidity without any effect exerted on the reliability of a semiconductor device. The interlayer insulating film, which is formed in such a manner as to cover surroundings of interconnections formed on the semiconductor device, includes low dielectric constant films, each having a dielectric constant of from 1 to 3.5, which are formed in surroundings of the interconnections and between the interconnections; and a supporting layer formed in or through at least one of the low dielectric constant films formed on the upper and lower sides of the interconnections.

Abstract: In a charging connector device for an electric vehicle composed of a power supplying connector and a power receiving connector, an indicator lamp of a two color type is set in an illumination chamber within a case body of the power supplying connector. One color of the two colors is used for illumination. The power supplying connector includes a locking lever and a microswitch. When both connectors are provisionally coupled with each other, a securing piece at the one end of the locking lever runs over a securing protrusion of the power receiving connector so that the pressing potion at the other end of the locking lever presses a switch spring of the microswitch to be turned off, thereby giving rise to no energization of the charging connector device. When both connectors are completely coupled with each other, the lever is elastically restored by the action of a coil spring, thus energizing the connector device.

Abstract: A connector includes a first connector and a second connector which are fitted to each other to be electrically connected. One of the first and second connectors is provided with shutters each of which is pivotally moved outwardly upon application of an external force to a front surface portion of the respective shutters. The other connector is provided with front end portions, and during the time when the two connectors are fitted together, each of the front end portions urges the front surface portion of the associated shutter.

Abstract: Two separate lids are openably provided at two power receiving portions, respectively. A lid fixing unit is provided for sliding movement in a direction of the juxtaposition of the two power receiving portions. The lid fixing unit overlaps both of the two lids to prevent the two lids from being opened when the lid fixing unit is disposed in an intermediate position between the two power receiving portions. The lid fixing unit is movable away from one of the two lids to face the other lid, thereby allowing the opening of the one lid, and the lid fixing unit is movable away from the other lid to face the one lid, thereby allowing the opening of the other lid.

Abstract: A connector in which the sliding movement of a movable contact member is stabilized, thereby securing a positive electrical connection. In the connector of the invention, a hollow connection terminal is fitted in a connector housing, and a coil spring and the slidable, movable contact member are received in this connection terminal. When the two connectors are fitted together, the coil spring urges the movable contact member toward a front end of the connector, thereby providing a sufficient contact load. A resilient, electrically-conductive contact band is provided in a gap between an outer peripheral surface of the movable contact member and an inner peripheral surface of the connection terminal. The connection terminal and the movable contact member are electrically connected together through this contact band, and this contact band prevents the movable contact member from being displaced in a direction perpendicular to the direction of fitting of the connection (that is, the axial direction).

Abstract: A high dielectric constant material containing tantalum expressed by chemical formula Ta.sub.x O.sub.y N.sub.z, where x, y, and z are each a value which in total yield 1, z is 0.1 or higher but 0.625 or lower, y is 0 or higher but 0.6 or lower, and 0.4y and 0.6z in total equals to the value of x or lower, and a process for depositing a film of the material by means of chemical vapor deposition using Cp.sub.m Ta(N.sub.3).sub.n, where Cp represents cyclopentane, and m+n=5, or using a gaseous tantalum-containing organometallic compound, or by a means comprising plasma treatment under a gas containing nitrogen. Also claimed are a semiconductor device and a MOS transistor using the high dielectric film containing tantalum.

Abstract: A power feed connector device includes an electromagnetic moving device for moving at least one of a pair of female and male connectors forward and backward along a fitting axis so as to fit the two connectors together and to disengage the two connectors from each other.

Abstract: An electrical connector comprises a feeding connector half and a receiving connector half, wherein the feeding connector half comprising: a case; a connector main body slidably accommodated in a front half portion of the case for accommodating a plurality of terminals; a handle attached to a rear half portion of the case; a slider for causing the connector main body in the case to slide; a rotatable lever of which intermediate portion is supported in the case, a working portion of the lever rotatably attached to the handle and an operating portion of the lever projecting out of the case; a locking means for locking the lever at a portion where the connector main body is locked to a connector main body of the receiving connector half due to a rotation of the rotatable lever; and a means for unlocking the lever.

Abstract: A semiconductor device having a base or main body on which conductive interconnects are formed. At least the surface of the base is insulative. A first dielectric film is formed so as to cover the conductive interconnects. A second dielectric film having a relative dielectric constant smaller than that of the first dielectric film is formed at least between the conductive interconnects. The thickness of the second dielectric film between the conductive interconnects is greater than the height of the conductive interconnects by 10-100% in the directions of the height and depth. Films made of a material of a low dielectric constant are formed over and under the conductive interconnects via the first dielectric film or equivalent films.

Abstract: A waterproof cap is pivotally mounted for opening and closing at a position near to a connection open portion of a charging connector. The waterproof cap is provided with a stopper member for preventing the opening/closing movement of the waterproof cap at an intermediate stop position during an opening stroke of the cap. At least one of the stopper member and a portion against which the stopper member can abut is resiliently deformable. The stopper member can be contacted with the stopper member-abutting portion in such a condition that the waterproof cap can be held at the intermediate stop position and that because of the above resilient deformation, the stopper member can move into a position beyond the intermediate stop position.