Abstract: According to one embodiment, a semiconductor memory device includes a first circuit configured to receive first bit data of an input signal, store, in a first latch circuit, first data based on the first bit data and a reference voltage, and output a first signal based on the first data, and a second circuit configured to receive second bit data of the input signal, store, in a second latch circuit, second data based on the second bit data and the reference voltage, and output a second signal based on the second data. The first circuit is configured to set the first latch circuit in a reset state based on the second signal. The second circuit is configured compare the second bit data and the reference voltage based on the first data and set the second latch circuit in a reset state based on the first signal.

Abstract: A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.

Abstract: A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.

Abstract: A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.

Abstract: A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.

Abstract: A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.

Abstract: A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.

Abstract: A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.

Abstract: A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.

Abstract: A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.

Abstract: According to one embodiment, M (M represents an integer of 2 or larger) semiconductor chips and through electrodes for N (N represents an integer of 2 or larger) channels are provided. The M semiconductor chips are stacked in sequence. The through electrodes are embedded in the semiconductor chips to connect electrically the semiconductor chips in the direction of stacking. The connection destination of the through electrodes are exchanged between one or more upper and lower layers of the semiconductor chips.

Abstract: A semiconductor device that writes, into respective memory spaces of a plurality of separate memories constituting a search memory mat, an entry address corresponding to key data to be written. In this semiconductor device, pieces of divided data are assigned respectively to the separate memories, and, by employing each divided data as an address, entry addresses corresponding to the divided data are written sequentially into memory spaces specified by memory addresses of the separate memories (first writing process). In this first writing process, if another entry address is already written in an accessed memory space, no entry address is written into that memory space. If an entry address corresponding to a single one of the plurality of pieces of divided data is successfully written into a memory space, the first writing process is ended. Second write processing to a verification memory may also be performed. Key data may be written to a backup memory when a whole collision occurs.

Abstract: A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.

Abstract: A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.

Abstract: A semiconductor device includes a first circuit configured to generate a current corresponding to the input signal, a second circuit configured to generate a voltage corresponding to the current generated by the first circuit, a constant current source, a transistor that includes a drain terminal receiving a current from the constant current source and a gate terminal to which the voltage corresponding to the current generated by the first circuit is applied, and an amplification circuit configured to amplify a difference voltage between a drain voltage of the transistor and a reference voltage and output the amplified difference voltage as an output signal corresponding to the input signal.

Abstract: A semiconductor device of one embodiment includes semiconductor chips. While the semiconductor device is receiving a power supply and a chip enable signal which is negated, all external terminals of the semiconductor chips are at the same logic level.

Abstract: A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.

Abstract: A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.

Abstract: Disclosed is a semiconductor device that writes, into respective memory spaces of a plurality of divisional memories constituting a search memory mat, an entry address corresponding to key data to be written. In this semiconductor device, pieces of divisional data are assigned respectively to the divisional memories, and, by employing each divisional data as an address, an entry address corresponding to said divisional data is written sequentially into a memory space specified by a memory address of each said divisional memory (first writing process). In this first writing process, if another entry address is already written in an accessed memory space, no entry address is written into that memory space. If an entry address corresponding to one of the plurality of pieces of divisional data is successfully written into a memory space, the first writing process is ended.

Abstract: A semiconductor device includes a first circuit configured to generate a current corresponding to the input signal, a second circuit configured to generate a voltage corresponding to the current generated by the first circuit, a constant current source, a transistor that includes a drain terminal receiving a current from the constant current source and a gate terminal to which the voltage corresponding to the current generated by the first circuit is applied, and an amplification circuit configured to amplify a difference voltage between a drain voltage of the transistor and a reference voltage and output the amplified difference voltage as an output signal corresponding to the input signal.