Abstract: An immersion treatment method with which a vehicle body horizontally immersed in liquid is taken out in a tilted position. The vehicle body is taken out of the liquid at high speed in a tilted position. Foreign matter is separated from the vehicle body and removed together with the liquid.

Abstract: A polybenzoxazole precursor is represented by the following formula (1): wherein R1a to R4a, R1b to R4b, X1, Y1 and m are defined in the specification.

Abstract: A polybenzoxazole precursor is represented by the following formula (1): wherein R1a to R4a, R1b to R4b, X1, Y1 and m are defined in the specification.

Abstract: An immersion treatment method with which a vehicle body horizontally immersed in liquid is taken out in a tilted position. The vehicle body is taken out of the liquid at high speed in a tilted position. Foreign matter is separated from the vehicle body and removed together with the liquid.

Abstract: A photosensitive composition comprising (A) a resin that is decomposed by the action of an acid to increase solubility in an alkali developing solution, (B) a compound that generates an acid upon irradiation of an actinic ray or radiation, and (C1) a compound having a molecular weight of 1,000 or less and containing an aliphatic ring and an aromatic ring, and a photosensitive composition comprising (A) a resin that is decomposed by the action of an acid to increase solubility in an alkali developing solution, (B) a compound that generates an acid upon irradiation of an actinic ray or radiation, and (C2) a resin containing a hydroxystyrene unit; and a pattern forming method using these photosensitive composition.

Abstract: A photosensitive resin composition contains: a polymer represented by the formula (I) as defined herein, in which 0.5 mol % or more of A in the polymer represented by the formula (I) is a protective group; a photosensitizing agent; a compound containing a methacryloyl or acryloyl group within a molecule of the compound; and a solvent.

Abstract: A photosensitive resin composition comprises: a polybenzoxazole precursor (A); a naphthoquinone diazide photosensitizer (B); and a specific phenolic hydroxyl group-containing compound (C).

Abstract: A positive photosensitive resin composition, which contains a polybenzoxazole precursor, a quinonediazide photosensitizer and a carbonate solvent, and a method of manufacturing a semiconductor device using the composition.

Abstract: A photosensitive resin composition contains: a polymer represented by the formula (I) as defined herein, in which 0.5 mol % or more of A in the polymer represented by the formula (I) is a protective group; a photosensitizing agent; a compound containing a methacryloyl or acryloyl group within a molecule of the compound; and a solvent.

Abstract: A polybenzoxazole precursor is represented by the following formula (1): wherein R1a to R4a, R1b to R4b, X1, Y1 and m are defined in the specification.

Abstract: A photosensitive resin composition comprising: a quinone diazide sulfonic acid ester of a phenol compound represented by formula (I) as defined in the specification; and a polybenzoxazole precursor, and a method for manufacturing a semiconductor device using the same

Abstract: A method for manufacturing a positive photosensitive resin composition, the method comprising: filtering a composition having a concentration of solids content of 30 mass % or more through a hollow fiber filter having a pore size of 0.1 ?m or less, wherein the composition comprises: (A) resin; (B) a photosensitizer; and (C) a solvent, and a relief pattern formed with the photosensitive resin composition.

Abstract: A photosensitive resin composition comprises: a polybenzoxazole precursor (A); a naphthoquinone diazide photosensitizer (B); and a specific phenolic hydroxyl group-containing compound (C).

Abstract: A positive resist composition comprising: at least two resins which differ in glass transition temperature by at least 5° C.; and a compound which generates an acid upon irradiation with actinic rays or radiation, wherein each of the two resins comprises at least either of a repeating unit derived from an acrylic acid derivative monomer and a repeating unit derived from an methacrylic acid derivative monomer and further comprises an alicyclic structure and at least one group that increases a solubility of the resin in alkaline developer by the action of an acid.

Abstract: A positive photosensitive resin composition, which contains a polybenzoxazole precursor, a quinonediazide photosensitizer and a carbonate solvent, and a method of manufacturing a semiconductor device using the composition.

Abstract: A positive photosensitive resin composition, which contains a polybenzoxazole precursor capable of increasing alkali solubility by an action of an acid, a triarylsulfonium salt and a sensitizer; and a method of manufacturing a semiconductor device using the composition.

Abstract: A positive-working resist composition comprising (A) a resin that increases solubility in an alkali developing solution by the action of an acid, (B) a compound which generates an acid upon irradiation of an actinic ray or radiation, (C) a nonionic cyclic compound having at least one partial structure represented by the following formula (I) or (II) and at least having either a melting point of 35° C. or more or a boiling point of 100° C./10 mmHg or more: and (D) a solvent.

Abstract: A photosensitive resin composition comprising: a quinone diazide sulfonic acid ester of a phenol compound represented by formula (I) as defined in the specification; and a polybenzoxazole precursor, and a method for manufacturing a semiconductor device using the same.

Abstract: A photosensitive composition comprising (A) a resin that is decomposed by the action of an acid to increase solubility in an alkali developing solution, (B) a compound that generates an acid upon irradiation of an actinic ray or radiation, and (C1) a compound having a molecular weight of 1,000 or less and containing an aliphatic ring and an aromatic ring, and a photosensitive composition comprising (A) a resin that is decomposed by the action of an acid to increase solubility in an alkali developing solution, (B) a compound that generates an acid upon irradiation of an actinic ray or radiation, and (C2) a resin containing a hydroxystyrene unit; and a pattern forming method using these photosensitive composition.

Abstract: A positive-working resist composition comprising (A) a resin that increases solubility in an alkali developing solution by the action of an acid, (B) a compound which generates an acid upon irradiation of an actinic ray or radiation, (C) a nonionic cyclic compound having at least one partial structure represented by the following formula (I) or (II) and at least having either a melting point of 35° C. or more or a boiling point of 100° C.