Abstract: A positive resist composition comprising: at least two resins which differ in glass transition temperature by at least 5° C.; and a compound which generates an acid upon irradiation with actinic rays or radiation, wherein each of the two resins comprises at least either of a repeating unit derived from an acrylic acid derivative monomer and a repeating unit derived from an methacrylic acid derivative monomer and further comprises an alicyclic structure and at least one group that increases a solubility of the resin in alkaline developer by the action of an acid.

Abstract: Provided is a positive photosensitive composition which has high photosensitivity, is capable of giving an excellent resist pattern, and changes little with time after exposure. The positive photosensitive composition comprises (1) a resin having group(s) capable of decomposing by the action of an acid to enhance solubility of the resin in an alkaline developing solution and (2) a compound represented by formula (I), (II) or (III) which is capable of generating a sulfonic acid upon irradiation with actinic rays or a radiation: wherein R1 to R5 and R7 to R10 each represents a hydrogen atom, an alkyl group, a cycloalkyl group, an alkoxy group, a hydroxy group, a halogen atom, or a group represented by —S—R6, where R6 represents an alkyl group or an aryl group; X− represents the anion of a benzenesulfonic, naphthalenesulfonic, or anthracenesulfonic acid as deifined in the specification; and m, n, p and q each represents an integer of 1 to 3.

Abstract: A positive working photosensitive composition comprising a resin having repeating units represented by the following formulae (I), (II) and (III), respectively and a compound which generates an acid with irradiation of an active ray or radiation: ##STR1## wherein R.sub.1 represents a hydrogen atom or a methyl group; R.sub.2 represents --C(.dbd.O)--O--C(R.sub.6) (R.sub.7) (R.sub.8) or --O--R.sub.5 --C(.dbd.O)--O--(R.sub.6) (R.sub.7) (R.sub.8); R.sub.3 represents --O--C(R.sub.6)(R.sub.7) (R.sub.8), --O--Si(R.sub.6)(R.sub.7)(Rs) or --O--C(R.sub.9)(R.sub.10)--OR.sub.11 ; R.sub.4 represents a hydrogen atom, a halogen atom, an alkyl group, an aryl group, an alkoxy group, an acyl group or an acyloxy group; R.sub.5 represents an alkylene group; R.sub.6, R.sub.7, R.sub.8, R.sub.9 and R.sub.10 each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group or an alkenyl group, provided that at least two among R.sub.6, R.sub.7 and R.sub.8 are groups other than a hydrogen atom; R.sub.

Abstract: Provided is a positive photosensitive composition which has high photosensitivity, is capable of giving an excellent resist pattern, and changes little with time after exposure. The positive photosensitive composition comprises (1) a resin having group(s) capable of decomposing by the action of an acid to enhance solubility of the resin in an alkaline developing solution and (2) a compound represented by formula (I), (II) or (III) which is capable of generating a sulfonic acid upon irradiation with actinic rays or a radiation: ##STR1## wherein R.sub.1 to R.sub.5 and R.sub.7 to R.sub.10 each represents a hydrogen atom, an alkyl group, a cycloalkyl group, an alkoxy group, a hydroxy group, a halogen atom, or a group represented by --S--R.sub.6, where R.sub.6 represents an alkyl group or an aryl group; X.sup.- represents the anion of a benzenesulfonic, naphthalenesulfonic, or anthracenesulfonic acid as defined in the specification; and m, n, p and q each represents an integer of 1 to 3.

Abstract: Disclosed is a chemically amplified positive resist composition which comprises (A) a compound which contains at least one group selected among tert-alkyl ester groups and tert-alkyl carbonate groups and is capable of increasing solubility of the compound in an alkali aqueous solution by the action of an acid, (B) a compound which contains at least one group selected among acetal groups and silyl ether groups and is capable of increasing solubility of the compound in an alkali aqueous solution by the action of an acid, (C) a compound which is capable of generating an acid by irradiation with an active ray or radiation, and (D) an organic basic compound. The resist composition has high resolving power and forms a satisfactory pattern free from undergoing sensitivity decrease, T-top formation, and change in line width which are caused from exposure to post exposure bake.

Abstract: A positive working photosensitive composition is disclosed, which comprises (a) a resin having groups capable of increasing solubility of the resin in an alkali developer through their decomposition due to the action of an acid and (b) a compound represented by formula (I) or (II) generating sulfonic acid by irradiation with active rays or radiant rays: ##STR1##

Abstract: A positive photosensitive composition comprising (a)a resin soluble in an aqueous alkali solution containing a specific structure unit; (b) a compound which generates an acid with irradiation of an active ray or radiation; and (c) a low molecular weight acid-decomposable dissolution inhibitor having a molecular weight of not more than 3000, which possesses a tertiary alkyl ester group and whose solubility in an aqueous alkali solution is increased by the action of an acid; wherein compound (c) is a compound having at least two tertiary alkyl ester groups, in which the longest distance with respect to the distance between two tertiary ester groups selected arbitrarily comprises at least 10 bonding atoms except for the atoms contained in the ester groups or a compound having at least three tertiary alkyl ester groups, in which the longest distance with respect to the distance between two tertiary ester groups selected arbitrarily comprises at least 9 bonding atoms except for the atoms contained in the ester gro

Abstract: Disclosed is a positive radiation-sensitive resist composition comprising polymer(s) of the following general formula (1) and a radiation-sensitive agent. ##STR1## Ra, Rb, Rc and Rd each are independently a hydrogen atom, a hydroxyl group, a halogen atom, an alkyl group, an alkoxy group, an alkenyl group, an aryl group, an aralkyl group, an alkoxycarbonyl group, an arylcarbonyl group, an acyloxy group, an acyl group, or a cycloalkyl group; k is an integer of from 1 to 30; (1+n) is an integer of from 1 to 100; m is an integer of from 1 to 50; p1, p2 and p3 each are an integer of from 1 to 3; q1 is an integer of from 1 to 4. The resist composition has high resolution to give resist patterns with good profiles and has high heat resistance and good storage stability.

Abstract: Disclosed is a photosensitive composition comprising a sulfonimide compound represented by formula (I):R.sub.1 --SO.sub.2 --NR.sub.3 --SO.sub.2 --R.sub.2 (I)wherein R.sub.1, R.sub.2 and R.sub.3 each represents an unsubstituted or substituted aromatic group or an unsubstituted or substituted alkyl group.

Abstract: A positive working photosensitive composition is disclosed, which comprises:(a) a resin which is insoluble in water but soluble in an alkaline aqueous solution;(b) a compound which generates an acid upon irradiation with active light or radiation;(c) a low molecular acid-decomposable dissolution-inhibitive compound having a molecular weight of 3,000 or less and containing a group decomposable with an acid, and which increases its solubility in an alkaline developer by the action of an acid; and(d) a resin containing a basic nitrogen atom and having a weight-average molecular weight of 2,000 or more.A further positive working photosensitive composition is disclosed, which comprises:(1) a compound which generates an acid upon irradiation with active light or radiation;(2) a resin having a group which undergoes decomposition by an acid whereby increasing its solubility in an alkaline developer; and(3) a resin containing a basic nitrogen atom and having a weight-average molecular weight of 2,000 or more.