Abstract: An image sensor integrated circuit may contain image sensor pixels. A channel containing a fluid with particles such as cells may be formed on top of the image sensor. The image sensor pixels may form light sensors and imagers. The imagers may gather images of the cells or other particles as the fluid passes over the imagers. The channel may have multiple branches. Gating structures and other fluid control structures may control the flow of fluid through the channel branches. Portions of the channel may be used to form chambers. The chambers may each be provided with one or more light sensors, light sources, and color filters to alter the color of illumination form a light source, one or more reactants such as dyes, antigens, and antibodies, and heaters. The branches may route the fluid to respective chambers each of which has a different set of capabilities.

Abstract: A microlens structure includes lower lens layers on a substrate. A sputtered layer of glass, such as silicon oxide, is applied over the lower lens layers at an angle away from normal to form upper lens layers that increase the effective focal length of the microlens structure. The upper lens layers can be deposited in an aspherical shape with radii of curvature longer than the lower lens layers. As a result, small microlenses can be provided with longer focal length. The microlenses are arranged in arrays for use in imaging devices.

Abstract: Micro-electrical-mechanical (MEMS) wafers in which a lens is formed on a micro-electrical-mechanical structure. The micro-electrical-mechanical wafers can comprise a substrate, MEMS structures, and a lens array. A method of forming a micro-electrical-mechanical wafer comprises providing a substrate, forming a micro-electrical-mechanical structure on the substrate, forming a carrier, forming a lens array on the carrier, and transferring the lens array from the carrier onto the micro-electrical-mechanical structure. The lens array is placed above the micro-electrical-mechanical structure.

Abstract: Various embodiments include interconnects for semiconductor structures that can include a first conductive structure, a second conductive structure and a non-hardening liquid conductive material in contact with the first and second structure. Other embodiments include semiconductor components and imager devices using the interconnects. Further embodiments include methods of forming a semiconductor structure and focusing methods for an imager device.

Abstract: Micro-electrical-mechanical (MEMS) wafers in which a lens is formed on a micro-electrical-mechanical structure. The micro-electrical-mechanical wafers can comprise a substrate, MEMS structures, and a lens array. A method of forming a micro-electrical-mechanical wafer comprises providing a substrate, forming a micro-electrical-mechanical structure on the substrate, forming a carrier, forming a lens array on the carrier, and transferring the lens array from the carrier onto the micro-electrical-mechanical structure. The lens array is placed above the micro-electrical-mechanical structure.

Abstract: A lens stack having a movable lens attached to a MEMS structure and method of fabricating the same. The method comprises attaching at least one MEMS structure to a transparent substrate. The method further comprises forming a movable lens in contact with the at least one MEMS structure.

Abstract: A lens includes a gradient index of refraction and a curved shape. A method of making the lens includes forming a plurality of layers, forming a shaped resist on the plurality of layers, and etching the resist and the plurality of layers to transfer the shape of the resist into the plurality of layers.

Abstract: A method, apparatus and system providing a microlens having a substantially flat upper surface and having a plurality of holes arranged in a pattern in a microlens material which produces a focal point at a desired location.

Abstract: A lens includes a gradient index of refraction and a curved shape. A method of making the lens includes forming a plurality of layers, forming a shaped resist on the plurality of layers, and etching the resist and the plurality of layers to transfer the shape of the resist into the plurality of layers.

Abstract: Methods of fabricating a microlens and/or array of microlenses used to focus light on photosensors, by forming a protective coating over a microlenses precursor material, and etching the protective coating and microlens precursor material to obtain a predetermined shape.

Abstract: A method, apparatus and system providing a microlens having a substantially flat upper surface and having a plurality of holes arranged in a pattern in a microlens material which produces a focal point at a desired location.

Abstract: Method of forming a microlens array and an imaging device and system containing such a microlens array. The microlens array is formed with a plurality of substantially gapless microlenses. A plurality of overlying portions are formed on the microlenses and have substantially the same curvature and/or height.

Abstract: A method and apparatus to fabricate a patterned structure using a template supported on a carrier. The method includes patterning a material to conform to the patterned structure. The patterned material is cured while remaining on the template. The carrier is removable during the curing process. The template is later removed from the patterned material to obtain the patterned structure. A patterning device is also provided, which is formed by a template and a carrier releasably attached to each other. The template and the carrier can be separated from each other when the patterning device is subjected to curing of the patterned structure.

Abstract: Embodiments of the present invention relate to an image sensor that may be used for digital photography. One embodiment of the present invention may include an image sensor comprising a substrate, a plurality of pixel cell arrays disposed on the substrate, a first array of the plurality of pixel cell arrays including pixels of a first size, a second array of the plurality of pixel cell arrays including pixels of a second size, the second size differing from the first size, and a plurality of photographic lenses, each of the plurality of photographic lenses arranged to focus light onto one array of the plurality of pixel cell arrays.

Abstract: A microlens structure includes lower lens layers on a substrate. A sputtered layer of glass, such as silicon oxide, is applied over the lower lens layers at an angle away from normal to form upper lens layers that increase the effective focal length of the microlens structure. The upper lens layers can be deposited in an aspherical shape with radii of curvature longer than the lower lens layers. As a result, small microlenses can be provided with longer focal lengths. The microlenses are arranged in arrays for use in imaging devices.

Abstract: A microlens has a surface with an effective index of refraction closer to the index of air than the body of the microlens to reduce reflection. Fibers protrude vertically from the surface of a microlens. For fabrication, the fibers are propelled at an adhesive layer provided over a microlens body and subjected to an electric field so that they stand vertically on the surface of the microlens. The adhesive layer is cured to hold the fibers in place.

Abstract: Methods and apparatus are provided. An image sensor has an array of light sensing elements and a transparent cover overlying the array of light sensing elements. The cover has a first roughened surface facing the array of light sensing elements and a second roughened surface facing away from the light sensing elements.

Abstract: Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces are disclosed herein. In one embodiment, a method for forming microlenses includes forming a plurality of shaping members on a microfeature workpiece between adjacent pixels, reflowing the shaping members to form a shaping structure between adjacent pixels, depositing lens material onto the workpiece, removing selected portions of the lens material adjacent to the shaping structure such that discrete masses of lens material are located over corresponding pixels, and heating the workpiece to reflow the discrete masses of lens material and form a plurality of microlenses.

Abstract: A micro-lens and a method for forming the micro-lens is provided. A micro-lens includes a substrate and lens material located within the substrate, the substrate having a recessed area serving as a mold for the lens material. The recessed can be shaped such that the lens material corrects for optical aberrations. The micro-lens can be part of a micro-lens array. The recessed area can serve as a mold for lens material for the micro-lens array and can be shaped such that the micro-lens array includes arcuate, non-spherical, or non-symmetrical micro-lenses.

Abstract: An apparatus and method to provide an imager having an array of color filter elements, each color filter element being separated from each other by spacers. The spacers can optically isolate filter elements from each other.