Abstract: Various examples with respect to compiler-allocated special registers that resolve data hazards with reduced hardware complexity are described. A processor includes a plurality of hardware components arranged in in an instruction set architecture. The processor allocates one or more forwarding registers with respect to the execution of an instruction. The processor also performs arithmetic operations based on the instruction with data input from multiple ways of the instruction set architecture such that the one or more forwarding registers is utilized for data forwarding between the multiple ways of the instruction set architecture.

Abstract: A semiconductor chip includes a substrate and a transistor. The transistor is formed on the substrate and includes an insulation layer and a fin. The fin includes a base portion and a protrusion connected with the base portion, wherein the protrusion is projected with respect to an upper surface of the base portion and has a recess recessed with respect to the upper surface.

Abstract: A package structure comprising: a substrate, having at least one conductive units provided at a first surface of the substrate; at least one first die, provided on a second surface of the substrate; a connecting layer, provided on the first die; a second die, provided on the connecting layer, wherein the connecting layer comprises at least one bump for connecting the first die; and at least one bonding wire. The connecting layer has a first touch side and a second touch side, the first touch side contacts a first surface of the first die and the second touch side contacts a second surface of the second die, an area of the first touch side is smaller than which for the first surface of the first die, and a size of the first die equals to which of the second die.

Abstract: A package structure comprising: a substrate, having at least one conductive units provided at a first surface of the substrate; at least one first die, provided on a second surface of the substrate; a connecting layer, provided on the first die; a second die, provided on the connecting layer, wherein the connecting layer comprises at least one bump for connecting the first die; and at least one bonding wire. The connecting layer has a first touch side and a second touch side, the first touch side contacts a first surface of the first die and the second touch side contacts a second surface of the second die, an area of the first touch side is smaller than which for the first surface of the first die, and a size of the first die equals to which of the second die.

Abstract: A pair of pyrrole-imidazole polyamides conjugated with nucleic acid-based cooperation system is provided.

Abstract: A semiconductor package structure is provided. The structure includes a first semiconductor die having a first surface and a second surface opposite thereto. A first molding compound surrounds the first semiconductor die. A first redistribution layer (RDL) structure is disposed on the second surface of the first semiconductor die and laterally extends on the first molding compound. A second semiconductor die is disposed on the first RDL structure and has a first surface and a second surface opposite thereto. A second molding compound surrounds the second semiconductor die. A first protective layer covers a sidewall of the first RDL structure and a sidewall of the first molding compound.

Abstract: An electronic apparatus includes an electronic device and a base. The electronic device has an engaging portion with at least two engaging concaves. The base has an engaging mechanism which includes a main body, at least one second engaging bump and a linkage structure. The main body has a first engaging bump. The second engaging bump is movably disposed on the main body and is adapted to move between an engaging position and a releasing position. The electronic device combines with the base such that the first engaging bump and the second engaging bump are engaged with the two engaging concaves. The linkage structure on the main body is connected to the second engaging bump. The electronic device rotates relative to the base to push the linkage structure that drives the second engaging bump from the engaging position to the releasing position to disengage from the engaging portion.

Abstract: An electrical connection device comprises a shield cage assembly and an electrical connector. The shield cage assembly comprises a metal cage and a ground member. The metal cage defines a port and an accommodating space extending from the port along a mating direction, and the metal cage has a keyway which extends from the port along the mating direction. The ground member is provided to an outer surface of the metal cage adjacent to the port, and the ground member has a main body which is connected with the metal cage, a bending portion which bends back from an edge of the main body, extends and is adjacent to the port, and a plurality of elastic fingers which extend from the bending portion, the main body has a guiding cover portion which bulges, the guiding cover portion correspondingly covers the keyway and defines a passage which is communicated with the keyway. The electrical connector is positioned in the accommodating space.

Abstract: The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first semiconductor package including a first redistribution layer (RDL) structure having a first surface and a second surface opposite to the first substrate. The first RDL structure includes a plurality of first conductive traces close to the first surface of the first RDL structure. An antenna pattern is disposed close to the second surface of the first RDL structure. A first semiconductor die is disposed on the first surface of the first RDL structure and electrically coupled to the first RDL structure. A plurality of conductive structures is disposed on the first surface of the first RDL structure and electrically coupled to the first RDL structure. The plurality of conductive structures is spaced apart from the antenna pattern through the plurality of first conductive traces of the first RDL structure.

Abstract: In another aspect, a server chassis is configured to mount to a server rack. The server chassis includes a first housing that includes a first sidewall, where the first housing is configured to mount to the server rack and house a first electronic component, and a second housing that includes a second sidewall, the second housing configured to mount to the server rack and house a second electronic component. The first housing includes a first bracket mounted to the first sidewall of the first housing, and the second housing includes a second bracket mounted to the second sidewall of the second housing. The second bracket of the second housing is engagable to the first bracket of the first housing to secure the first housing and the second housing to each other.

Abstract: A method of manufacturing a DRAM includes isolation structures and word line sets are formed in the substrate. A conductive material is formed on the substrate. Conductive material is removed to form first openings in the conductive material. The first openings expose surfaces of the substrate in the first areas and divide the conductive material into conductive layers, thereby the conductive layers are located on surfaces of the substrate in the second areas. A first dielectric material is filled in the first openings so as to form first dielectric layers on the substrate in the first areas. Top surfaces of the conductive layers are lower than top surfaces of the first dielectric layers. Second dielectric layers are formed respectively in the conductive layers. Capacitors are formed respectively on the conductive posts.

Abstract: A method of generating a graphical user interface for horse race betting includes displaying a first list of horses scheduled to run a first race from among a plurality of horses, displaying, in association with each horse of the first list of horses, a win selection element by which a user of the graphical user interface may mark the horse as selected to win the first race, displaying an automatic ticket generation button by which a user may request an automatic selection of horses, and, in response to a user interaction with the automatic ticket generation button, marking one or more horses of the first list of horses as selected to win the first race based on predicted win percentages of the horses of the first list. The method may include displaying, in association with each horse of the first list of horses, the predicted win percentage of the horse.

Abstract: An abrasive article including a substrate having an elongated body, a tacking layer overlying the substrate, and a first type of abrasive particle overlying the tacking layer and defining a first abrasive particle concentration at least about 10 particles per mm of substrate.

Abstract: A condenser has a main condensing module, an auxiliary condensing module, and a connecting tube. The main condensing module has an input base tube, a first connecting base tube, and a main heat dissipating mechanism, which are series connected. The auxiliary condensing module has a second connecting base tube, an output base tube, and an auxiliary heat dissipating mechanism, which are series connected. The connecting tube is mounted between the main condensing module and the auxiliary condensing module. An interior room of the first connecting base tube communicates with an interior room of the second connecting base tube.

Abstract: An example method for detecting stability of a medical implant is provided. The method includes (a) applying a force to the medical implant with a probe, (b) based on the applied force, determining a response signal associated with a vibration of the medical implant, (c) comparing the determined response signal with a computer model of the medical implant, and (d) based on the comparison, determining an angular stiffness coefficient of the medical implant, wherein the angular stiffness coefficient indicates a stability of the medical implant.

Abstract: An analyzing method is to be implemented in an analyzing device, and includes: (A) dividing respective cycle lengths of a plurality of cardiac cycles of a user during sleep into a plurality of groups based on an order of occurrence of the cardiac cycles; (B) for each group, performing Fourier transform on the cycle lengths of the group to generate a respective spectrum; (C) for each group, calculating total power of the respective spectrum; and (D) determining, for each group, whether sleep quality of the user in a time period during which the corresponding cardiac cycles occurred is poor based on the total power of the respective spectrum and a predetermined threshold.

Abstract: A fan module is provided, including a hub, a plurality of blades connected to the hub, and a plurality of longitudinal members. Each of the blades includes a base side connected to the hub, an end side opposite to the base side, a windward side, a leeward side opposite to the windward side, a windward surface, and a leeward surface opposite to the windward surface. The windward and leeward sides are connected to the base side and the end side. Each of the longitudinal members is disposed on the leeward surface of each of the blades, connected to the end side, and has a first end, a second end, and a tapered structure. The first and second ends face the leeward and windward sides respectively. The height of the first end is the maximum height of the longitudinal member. The tapered structure is connected to the second end.

Abstract: A dynamic random access memory (DRAM) and methods of manufacturing, writing and reading the same. The DRAM includes a substrate, a bit line, a sidewall structure and an interconnection structure. The bit line is disposed on the substrate. The sidewall structure is disposed on a sidewall of the bit line. The sidewall structure includes a first insulation layer, a second insulation layer, and a shield conductor layer. The first insulation layer is disposed on the sidewall of the bit line. The second insulation layer is disposed on the first insulation layer. The shield conductor layer is disposed between the first insulation layer and the second insulation layer. The interconnection structure is electrically connected to the shield conductor layer. The DRAM and the manufacturing, writing and reading methods thereof can effectively reduce the parasitic capacitance of the bit line.

Abstract: An electronic apparatus includes an electronic device and a base. The electronic device has an engaging portion with at least two engaging concaves. The base has an engaging mechanism which includes a main body, at least one second engaging bump and a linkage structure. The main body has a first engaging bump. The second engaging bump is movably disposed on the main body and is adapted to move between an engaging position and a releasing position. The electronic device combines with the base such that the first engaging bump and the second engaging bump are engaged with the two engaging concaves. The linkage structure on the main body is connected to the second engaging bump. The electronic device rotates relative to the base to push the linkage structure that drives the second engaging bump from the engaging position to the releasing position to disengage from the engaging portion.

Abstract: A light blocking sheet includes a first surface, a second surface, an inner annular surface and an outer annular surface. The second surface is corresponding to the first surface. The inner annular surface connects the first surface and the second surface, and forms an inner opening. The outer annular surface connects an edge of the first surface and an edge of the second surface, and includes at least three notches disposed on the outer annular surface and at least three arc surfaces located on the outer annular surface, wherein the at least three notches and the at least three arc surfaces are alternately arranged on the outer annular surface, and the at least three arc surfaces are coaxial and have different arc lengths.