Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a first user equipment (UE) may receive, from one of a programmable logic controller (PLC) or a network node, a configuration. The first UE may transmit, to one or more of a second UE, the PLC, or the network node, and based at least in part on the configuration, status information associated with the first UE, the status information being associated with an ability of the first UE to perform one or more of: data relaying for other UEs; a reading of radio frequency (RF) signals associated with reading or processing information from one or more zero power internet of things (ZP-IoT) devices and a relaying of information associated with the RF signal; or a transmission of wireless energy to one or more ZP-IoT devices. Numerous other aspects are described.

Abstract: A computing system including a plurality of processing devices configured to execute a Mixture-of-Experts (MoE) layer included in an MoE model. The processing devices are configured to execute the MoE layer at least in part by, during a first collective communication phase between the processing devices, splitting each of a plurality of first input tensors along a first dimension to obtain first output tensors. Executing the MoE layer further includes processing the first output tensors at a respective a plurality of expert sub-models to obtain a plurality of second input tensors. Executing the MoE layer further includes, during a second collective communication phase between the processing devices, receiving the second input tensors from the expert sub-models and concatenating the second input tensors along the first dimension to obtain second output tensors. Executing the MoE layer further includes outputting the second output tensors as output of the MoE layer.

Abstract: A light-emitting device comprises a first semiconductor layer and a semiconductor mesa formed on the first semiconductor layer, wherein the first semiconductor layer comprises a first sidewall and a first semiconductor layer first surface surrounding the semiconductor mesa, and the semiconductor mesa comprises a second sidewall; and a first reflective structure comprising a first reflective portion covering the first sidewall and a second reflective portion covering the second sidewall, wherein the first reflective portion and the second reflective portion are connected to form a first reflective structure outer opening to expose the first semiconductor layer first surface in a top view of the light-emitting device.

Abstract: A non-volatile memory includes a plurality of non-volatile memory cells arranged in blocks. Each block includes multiple sub-blocks that can be independently erased and programmed. A control circuit is connected to the non-volatile memory cells. The control circuit is configured to independently erase and program sub-blocks of a same block. The control circuit is configured to only allow one sub-block per block to be open at a time.

Abstract: The present invention discloses a microminiature image acquisition and processing system package structure and a preparation method thereof. This structure includes optical coated glass, a CMOS chip, a wafer Re-Distribution Layer and a molding layer, the first surface of the CMOS chip is provided with a photosensitive and microlens region and a metal bonding pad, and a through-silicon via is etched in a second surface of the CMOS chip until it extends to the metal bonding pad on the first surface; the wafer Re-Distribution Layer covers the second surface of the CMOS chip and extends to the through-silicon via. The structure and the method of the present invention are integrated with wafer-level package and SIP integrated package technologies to achieve single package of the whole device, thereby greatly reducing the system complexity and power consumption, reducing the overall product size and signal path, and improving the image anti-interference capability.

Abstract: The present disclosure belongs to the technical field of lubricating material preparation, and specifically relates to a halloysite nanotube (HNT)-encapsulated ionic liquid (IL) microcapsule, a self-lubricating fiber textile composite, and a preparation method and use thereof. In the present disclosure, the preparation method includes the following steps: dispersing a HNT and an alkali metal salt of a saturated fatty acid in water, dispersing a resulting inner surface-modified HNT and an IL in an organic solvent, injecting the IL into the HNT in the mixed dispersion under vacuumizing to obtain an IL-filled HNT, and encapsulating a resulting IL-filled HNT at a tube end with an encapsulating material to obtain the HNT-encapsulated IL microcapsule.

Abstract: A method of manufacturing a semiconductor device, including: forming a plurality of gate strips, wherein each gate strip is arranged to be a gate terminal of a transistor; forming a plurality of first metal strips above the plurality of gate strips; and forming a plurality of second metal strips above the plurality of first metal strips, wherein the plurality of second metal strips are co-planar, and each second metal strip and one of the first metal strips are crisscrossed from top view; wherein a length between two adjacent gate strips is twice as a length between two adjacent second metal strips, and a length of said one of the first metal strips is smaller than two and a half times as the length between two adjacent gate strips.

Abstract: A microlens array includes a bottom electrode chip, a sidewall electrode chip, and a top glass chip configured to cooperate to define an array of cavities, each one of the array of cavities containing a fluid. The fluid is a mixture of a polar liquid and a non-polar liquid, in contact with one of the array of sidewalls at a contact angle. The bottom electrode chip includes a plurality of electrical contacts. The sidewall electrode chip includes an array of sidewalls, each including an electrode layer and an insulator layer. When a voltage is applied across the fluid contained a cavity via electrical contacts and the electrode layer of the cavity, the contact angle of the fluid with the sidewall is modified, in embodiments without affecting the contact angle of fluid contained in other ones of the plurality of array of cavities.

Abstract: A computing system is provided, including a plurality of processing devices configured to execute a Mixture-of-Experts (MoE) layer included in an MoE model. The MoE layer includes a plurality of expert sub-models that each have a respective plurality of parameter values. The MoE layer is configured to be switchable between a data parallel mode and an expert-data-model parallel mode without conveying the respective parameter values of the expert sub-models among the plurality of processing devices.

Abstract: A base station performs joint channel estimation for a set of physical uplink shared channels (PUSCHs) with bundled DMRS from a user equipment (UE). The UE receives an indication to transmit the set of PUSCHs, each PUSCH of the set of PUSCHs comprising a corresponding DMRS from the base station. The base station transmits, and the UE receives, a sounding reference signal resource indicator for each PUSCH of the set of PUSCHs. The UE transmits the PUSCHs based on a same sounding reference single resource, the SRI for a first PUSCH of the set of PUSCHs indicating the same SRS resource.

Abstract: Disclosed are a power demand side speech interaction method and system. The method includes: obtaining original demand information, the original demand information including user's basic information, user demand information, and a user demand time; converting the original demand information into first information in text format; performing text statistical analysis based on an industry term on the first information in text format, to obtain second information; searching for corresponding user's actual information from a database according to the second information; outputting the user's actual information; searching for a corresponding forecasting model from the database, according to the second information and the user's basic information; calculating, according to a policy limit value of latest policy information in the database, a time for which the model corresponding to the user's basic information reaches the policy limit value; and transmitting an early warning message.

Abstract: A power supply unit supplies power to a load, and the power supply unit includes a power factor corrector, a DC conversion module, and an isolated conversion module. The power factor corrector is plugged into a first main circuit board and converts an AC power into a DC power. The DC conversion module is plugged into the first main circuit board and converts the DC power into a main power. The isolated conversion module includes a bus capacitor, the bus capacitor is coupled to the DC conversion module through a first power copper bar, and coupled to the power factor corrector through a second power copper bar. The first power copper bar and the second power copper bar are arranged on a side opposite to the first main circuit board, and are arranged in parallel with the first main circuit board.

Abstract: A device to detect and analyze defects in a finished surface includes a supporting mechanism, a transmitting mechanism, a detecting mechanism, and a processor. The transmitting mechanism carries and transmits the product. The detecting mechanism includes a detecting frame, a light source assembly. The processor is used to connect to a first camera module and a second camera module, and preprocess the first image and the second image to obtain a detection and analysis of any defects of the front of the product.

Abstract: An array substrate includes: a first substrate (10), including a plurality of sub-pixel regions (101) arranged in an array along a row direction (X) and a column direction (Y); a pixel circuit layer, including a plurality of sub-pixel circuits; a planarization layer (17), provided with a first via hole (170) located in the sub-pixel regions (101), and includes at least one pattern portion (171), the pattern portion (171) includes a plurality of pattern units (171a) arranged in an array along the row direction (X) and the column direction (Y); and a reflective electrode layer, wherein the reflective electrode layer includes a plurality of reflective electrodes (18) that are mutually disconnected, each of the reflective electrodes (18) is located in one of the sub-pixel regions (101) and is electrically connected to the sub-pixel circuit through the first via hole (170).

Abstract: An intelligent monitoring system for waste disposal and the method thereof are provided, which include a plurality of operational devices and stages. First, a transportation stage is performed to loading a transport vehicle with a waste so as to transport the waste to a disposal station for further treatment. A camera and a sensor for detecting abnormal conditions are installed any one of the operational devices or installed in the operational path of any one of the operational devices. The camera records the videos of the operational stages, captures the images from the videos and recognizes the images in order to determine whether the abnormal conditions occur in any one of the operational stages. Alternatively, the camera is triggered to capture the images and recognize the images after the abnormal conditions are detected by the sensor in order to determine whether the abnormal conditions actually occur.

Abstract: A virtual consultation method and an electronic device are provided. The method includes: receiving physiological information obtained through sensing a user by a sensing device; analyzing the physiological information to obtain an analysis result; adjusting weights of a plurality of questions according to the analysis result and determining a first question applicable to the user and an order of the first question according to the weights; and outputting the first question according to the order to simulate a question asked by a doctor for the user during consultation.

Abstract: A method of non-coherent wireless communication performed by a wireless communication device includes generating information bits for transmission to another wireless communication device. The method also includes identifying a configuration for a polar code encoder for encoding the information bits. The method further includes encoding a set of the information bits with a polar code encoding operation based on the configuration to generate a codeword, the configuration rendering the polar code encoding operation incapable of generating a codeword that is a bit-flipped counterpart of another codeword that the polar code encoding operation is capable of generating based on the configuration. The method still further includes transmitting the codeword via a wireless channel without a reference signal.

Abstract: The present application relates to devices and components including apparatus, systems, and methods for control signaling and reference signal transmission in wireless networks.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive a downlink communication. The UE may receive a configuration identifying a first uplink resource for a hybrid automatic repeat request acknowledgement (HARQ-ACK) and a second uplink resource for multiplexing channel state information (CSI) reports. The UE may receive a downlink communication. The UE may determine that a HARQ-ACK for the downlink communication is to be multiplexed with one or more CSI reports on the second uplink resource. The UE may determine that an error has occurred based at least in part on a determination that the second uplink resource configured is in a different sub-slot than the first uplink resource. Numerous other aspects are provided.

Abstract: A semiconductor structure includes a substrate, first and second transistors, first and second fuses, a contact structure, and a dielectric layer. The substrate has first and second device regions, and a fuse region. The first and second transistors are respectively above the first and second device regions. The first fuse is electrically connected to the first transistor and includes a first fuse active region having first and second portions. The second fuse is electrically connected to the second transistor and includes a second fuse active region having third and fourth portions. The contact structure interconnects the second portion and the third portion, wherein the first portion and the fourth portion are on opposite sides of the contact structure. The dielectric layer is between the contact structure and the fuse region of the substrate.