Patents by Inventor Weileun Fang
Weileun Fang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11881347Abstract: The present invention provides a micro tactility-simulating sensing device, including: a chip including a first top surface and a first inductor, wherein the first top surface has wiring through holes configured to allow an external circuit to connect to the first inductor, and the first top surface is a flat surface except the wiring through holes; a magnetic rigid body coupled with the first inductor to allow the first inductor to sense a magnetic flux passing therethrough, and configured to receive a tactile load; and a polymer configured between the chip and the magnetic rigid body to have a characteristic distance therebetween, wherein the characteristic distance and the magnetic flux have a functional relationship. The micro tactility-simulating sensing device of the present invention can effectively increase the magnitude of the measured signal and provide two different ways to read the signal.Type: GrantFiled: December 2, 2019Date of Patent: January 23, 2024Assignee: National Tsing Hua UniversityInventors: Sheng-Kai Yeh, Jiunn-Horng Lee, Weileun Fang
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Publication number: 20210074469Abstract: The present invention provides a micro tactility-simulating sensing device, including: a chip including a first top surface and a first inductor, wherein the first top surface has wiring through holes configured to allow an external circuit to connect to the first inductor, and the first top surface is a flat surface except the wiring through holes; a magnetic rigid body coupled with the first inductor to allow the first inductor to sense a magnetic flux passing therethrough, and configured to receive a tactile load; and a polymer configured between the chip and the magnetic rigid body to have a characteristic distance therebetween, wherein the characteristic distance and the magnetic flux have a functional relationship. The micro tactility-simulating sensing device of the present invention can effectively increase the magnitude of the measured signal and provide two different ways to read the signal.Type: ApplicationFiled: December 2, 2019Publication date: March 11, 2021Inventors: Sheng-Kai Yeh, Jiunn-Horng Lee, Weileun Fang
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Patent number: 10077185Abstract: A method for manufacturing a micro normally-closed structure. The method includes steps of providing a flexible arm, and a stationary base and a fixed contact separated from the flexible arm, wherein the flexible arm is free to move and includes a first end configured at one terminal and a movable contact configured at another terminal, the transient base is configured at where corresponds to the first end, and the fixed contact is configured at where corresponds to the movable contact; forming a temporary electrical connection between the first end and the stationary base; forming a temporary electrical conduction between the movable contact and the fixed contact; maintaining the temporary electrical connection and the temporary electrical conduction; and securing the first end to the stationary base permanently which causes the temporary electrical connection turn into a permanent electrical connection and the temporary electrical conduction turn into the micro normally-closed structure.Type: GrantFiled: April 1, 2015Date of Patent: September 18, 2018Assignee: National Tsing Hua UniversityInventors: Wei-Cheng Lai, Weileun Fang
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Publication number: 20150287556Abstract: The present invention relates to a micro normally-closed structure, which is manufactured by a MEMS process and used as a MEMS component. The structure includes a base and a fixed contact; and a flexible arm including a first end and a movable contact, wherein the first end is electrically connecting to the base, and remaining a normally closed electrically conducting state between the movable contact and the fix end.Type: ApplicationFiled: April 1, 2015Publication date: October 8, 2015Applicant: National Tsing Hua UniversityInventors: Wei-Cheng LAI, Weileun FANG
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Patent number: 9070699Abstract: A micromachined structure includes a substrate and a suspended structure. The substrate has a cavity formed thereon. The suspended structure is formed on the cavity of the substrate. The suspended structure includes a first metal layer, a second metal layer, and a first dielectric layer positioned between the first and second metal layers, wherein the first dielectric layer has a first opening in communication with the cavity through an opening formed in the first metal layer.Type: GrantFiled: January 4, 2012Date of Patent: June 30, 2015Assignee: PIXART IMAGING INC.Inventors: Chuanwei Wang, Ming Han Tsai, Chih Ming Sun, Weileun Fang
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Patent number: 8443670Abstract: Disclosed is a novel three-axis capacitive-type accelerometer implemented on SOI wafer. The accelerometer consists of four springs, one proof mass, four pairs of gap-closing sensing electrodes (each pair of gap-closing sensing electrode containing one movable electrode and one stationary electrode), and several metal-vias as the electrical interconnections. The movable electrodes are on the proof mass, whereas the stationary electrodes are fixed to the substrate. The three-axis accelerometer has five merits.Type: GrantFiled: September 9, 2009Date of Patent: May 21, 2013Assignee: National Tsing Hua UniversityInventors: Chia-Pao Hsu, Weileun Fang, Ming-Ching Wu
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Patent number: 8436435Abstract: The present invention discloses an MEMS capacitive microphone including a rigid diaphragm arranged on an elastic element. When a sound wave acts on the rigid diaphragm, the rigid diaphragm is moved parallel to a normal of a back plate by elasticity of the elastic element. Thereby the variation of the capacitance is obtained between the rigid diaphragm and the back plate.Type: GrantFiled: July 27, 2010Date of Patent: May 7, 2013Assignee: National Tsing Hua UniversityInventors: Chun-Kai Chan, Weileun Fang
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Patent number: 8318511Abstract: A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a connecting area and an actuating area respectively located thereon, c) forming plural microstructures in the actuating area, d) mounting a conducting element in the connecting area and the actuating area, e) forming an insulating layer on the conducting element and f) connecting the first substrate to the connecting area to form the MEMS device. The concavity contains the plural microstructures.Type: GrantFiled: January 4, 2012Date of Patent: November 27, 2012Assignee: Walsin Lihwa Corp.Inventors: Mingching Wu, Hsueh-An Yang, Hung-Yi Lin, Weileun Fang
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Patent number: 8277667Abstract: A magnetic element and its manufacturing method are provided. A magnetic element includes an actuation part having a first surface and a second surface, a torsion bar connected to the actuation part, and a frame connected to the first torsion bar, wherein the first surface of the actuation part is an uneven surface. The manufacturing method of the magnetic element starts with forming an passivation layer on a substrate and defining a special area by the mask method, then continues with forming the adhesion layer and electroplate-initializing layer on the substrate sequentially. The photoresist layer are formed and the magnetic-inductive material is electroformed on the electroplate area. Finally, the substrate is etched and the passivation layer is removed to obtain the magnetic element. The manufacturing method of magnetic element of the present invention can be applied in the microelectromechanical system field and other categories.Type: GrantFiled: January 14, 2008Date of Patent: October 2, 2012Assignee: National Tsing Hua UniversityInventors: Hsueh-An Yang, Weileun Fang, Tsung-Lin Tang
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Patent number: 8261428Abstract: The present invention discloses a method for assembling a 3D microelectrode structure. Firstly, 2D microelectrode arrays are stacked to form a 3D microelectrode array via an auxiliary tool. Then, the 3D microelectrode array is assembled to a carrier chip to form a 3D microelectrode structure. The present invention uses an identical auxiliary tool to assemble various types of 2D microelectrode arrays having different shapes of probes to the same carrier chip. Therefore, the method of the present invention increases the design flexibility of probes. The present invention also discloses a 3D microelectrode structure, which is fabricated according to the method of the present invention and used to perform 3D measurement of biological tissues.Type: GrantFiled: November 25, 2009Date of Patent: September 11, 2012Assignee: National Tsing Hua UniversityInventors: Weileun Fang, Yu-Tao Lee, Yen-Chung Chang
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Publication number: 20120111096Abstract: A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a connecting area and an actuating area respectively located thereon, c) forming plural microstructures in the actuating area, d) mounting a conducting element in the connecting area and the actuating area, e) forming an insulating layer on the conducting element and f) connecting the first substrate to the connecting area to form the MEMS device. The concavity contains the plural microstructures.Type: ApplicationFiled: January 4, 2012Publication date: May 10, 2012Applicant: WALSIN LIHWA CORPORATIONInventors: Mingching Wu, Hsueh-An Yang, Hung-Yi Lin, Weileun Fang
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Publication number: 20120107545Abstract: A micromachined structure includes a substrate and a suspended structure. The substrate has a cavity formed thereon. The suspended structure is formed on the cavity of the substrate. The suspended structure includes a first metal layer, a second metal layer, and a first dielectric layer positioned between the first and second metal layers, wherein the first dielectric layer has a first opening in communication with the cavity through an opening formed in the first metal layer.Type: ApplicationFiled: January 4, 2012Publication date: May 3, 2012Applicant: PixArt Imaging Inc.Inventors: Chuanwei Wang, Ming Han Tsai, Chih Ming Sun, Weileun Fang
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Patent number: 8114699Abstract: A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a connecting area and an actuating area respectively located thereon, c) forming plural microstructures in the actuating area, d) mounting a conducting element in the connecting area and the actuating area, e) forming an insulating layer on the conducting element and f) connecting the first substrate to the connecting area to form the MEMS device. The concavity contains the plural microstructures.Type: GrantFiled: March 28, 2011Date of Patent: February 14, 2012Assignee: Walsin Lihwa Corp.Inventors: Migching Wu, Hsueh-An Yang, Hung-Yi Lin, Weileun Fang
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Publication number: 20120027235Abstract: The present invention discloses an MEMS capacitive microphone, which comprises a supporting portion and a diaphragm, wherein the supporting portion supports the central portion of the diaphragm to facilitate releasing the residual stress of the diaphragm generated in the thermal fabrication process. Thereby is maintained the flatness of the diaphragm and promoted the precision of sensing capacitance.Type: ApplicationFiled: July 27, 2010Publication date: February 2, 2012Inventors: Chun-Kai CHAN, Weileun Fang
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Publication number: 20120025334Abstract: The present invention discloses an MEMS capacitive microphone including a rigid diaphragm arranged on an elastic element. When a sound wave acts on the rigid diaphragm, the rigid diaphragm is moved parallel to a normal of a back plate by elasticity of the elastic element. Thereby the variation of the capacitance is obtained between the rigid diaphragm and the back plate.Type: ApplicationFiled: July 27, 2010Publication date: February 2, 2012Inventors: Chun-Kai CHAN, Weileun Fang
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Patent number: 8105498Abstract: A method for fabricating micromachined structures is provided. A structure including a dielectric layer, a metal layer and a passivation layer is formed, wherein the dielectric layer has a via thereon. An etching window is formed on the passivation layer. An etching solution is poured into the via through the etching window to perform a process of etching. After etching, the etching solution is removed and the passivation layer is removed. Finally, the structure is etched again to form the micromachined structure.Type: GrantFiled: November 21, 2007Date of Patent: January 31, 2012Assignee: PixArt Imaging Inc.Inventors: Chuanwei Wang, Ming Han Tsai, Chih Ming Sun, Weileun Fang
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Patent number: 8030111Abstract: A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a connecting area and an actuating area respectively located thereon, c) forming plural microstructures in the actuating area, d) mounting a conducting element in the connecting area and the actuating area, e) forming an insulating layer on the conducting element and f) connecting the first substrate to the connecting area to form the MEMS device. The concavity contains the plural microstructures.Type: GrantFiled: December 2, 2008Date of Patent: October 4, 2011Assignee: Walsin Lihwa Corp.Inventors: Mingching Wu, Hsueh-An Yang, Hung-Yi Lin, Weileun Fang
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Publication number: 20110179870Abstract: A dual-axis acceleration detection element comprises a first detection element, a second detection element and a stationary unit. The first detection element is movable relative to the second detection element. The second detection element is movable relative to the stationary unit. The relative movements take place on different axes to detect acceleration on two different axes. The first detection element and the second detection element are interposed by corresponding detection electrodes, and the second detection element and the stationary unit also are interposed by other corresponding detection electrodes. Hence when the relative movements occur among the first and second detection elements and the stationary unit, overlapped areas of the detection electrodes change to generate and output a capacitance difference, thereby acceleration alteration can be detected.Type: ApplicationFiled: January 25, 2010Publication date: July 28, 2011Inventors: Chun-Kai CHAN, Weileun Fang
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Publication number: 20110174058Abstract: A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a connecting area and an actuating area respectively located thereon, c) forming plural microstructures in the actuating area, d) mounting a conducting element in the connecting area and the actuating area, e) forming an insulating layer on the conducting element and f) connecting the first substrate to the connecting area to form the MEMS device. The concavity contains the plural microstructures.Type: ApplicationFiled: March 28, 2011Publication date: July 21, 2011Applicant: WALSIN LIHWA CORP.Inventors: Mingching Wu, Hsueh-An Yang, Hung-Yi Lin, Weileun Fang
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Patent number: 7981329Abstract: A method of manufacturing an optical component is provided. The method comprises steps of providing a first liquid; providing a fluid, disposed above the first liquid, wherein an interface exists between the first liquid and the fluid; providing a polymer precursor at the interface; and solidifying the polymer precursor so as to form the optical component made by a polymer.Type: GrantFiled: January 21, 2009Date of Patent: July 19, 2011Assignee: National Tsing Hua UniversityInventors: Chih-Chun Lee, Sheng-Yi Hsiao, Weileun Fang