Abstract: A vehicle armrest includes an armrest base having a pivot axle that extends along a pivot axis. The armrest base also includes a release mechanism that includes a pair of latch extensions supported on the armrest base for relative movement along a latch axis that is substantially parallel to the pivot axis. A latch spring biases the latch extensions apart from each other. A release handle is mounted on the armrest base for relative movement in a handle release direction. A pinion is mounted on the armrest base for relative rotational movement. Movement of the release handle in the release direction causes rotation of the pinion relative to the armrest base which, in turn, causes the latch extensions to move along the latch axis toward one another.

Abstract: A radiation source includes a semiconductor substrate, an array of vertical-cavity surface-emitting lasers (VCSELs) formed on the substrate, which are configured to emit optical radiation, and a transparent crystalline layer formed over the array of VCSELs. The transparent crystalline layer has an outer surface configured to diffuse the radiation emitted by the VCSELs.

Abstract: A thin film transistor array substrate for a display device generally includes: a substrate; a plurality of gate lines and a plurality of data lines arranged on the substrate intersecting with and insulated from each other; and a plurality of pixel elements arranged in areas defined by the gate lines and the data lines. At least one of the pixel elements includes: a switch element; an insulation layer located on the switch element; and a pixel electrode located at the insulation layer. The insulation layers of the pixel elements define a plurality of vias. The pixel electrodes of two adjacent pixel elements are electrically coupled with the corresponding switch elements of the two adjacent pixel elements through a common via defined by the insulation layers of the two adjacent pixel elements. The two adjacent pixel elements are disposed along extensions of the plurality of the gate lines.

Abstract: A vehicle armrest includes an armrest base. The armrest base includes a pivot axle that extends along a pivot axis. The armrest base also includes a release mechanism that includes a pair of latch extensions supported on the armrest base for relative movement along a latch axis that is substantially parallel to the pivot axis. A latch spring biases the latch extensions apart from each other. A release handle is mounted on the armrest base for relative movement in a handle release direction. A pinion is mounted on the armrest base for relative rotational movement. Movement of the release handle in the release direction causes rotation of the pinion relative to the armrest base. And rotation of the pinion relative to the armrest base causes the latch extensions to move along the latch axis toward one another.

Abstract: A bumper for a vehicle armrest assembly includes a base that extends from a first end to a second end. The base includes a front surface. The bumper includes a stop that extends from the front surface of the base. The bumper also includes a cushion that extends from the front surface of the base. The cushion extends a greater distance from the base than the stop does.

Abstract: An optoelectronic device includes a semiconductor substrate, having front and back sides and having at least one cavity extending from the back side through the semiconductor substrate into proximity with the front side. At least one optoelectronic emitter is formed on the front side of the semiconductor substrate in proximity with the at least one cavity. A heat-conducting material at least partially fills the at least one cavity and is configured to serve as a heat sink for the at least one optoelectronic emitter.

Abstract: A radiation source includes a semiconductor substrate, an array of vertical-cavity surface-emitting lasers (VCSELs) formed on the substrate, which are configured to emit optical radiation, and a transparent crystalline layer formed over the array of VCSELs. The transparent crystalline layer has an outer surface configured to diffuse the radiation emitted by the VCSELs.

Abstract: A method for production of an optoelectronic device includes fabricating a plurality of vertical emitters on a semiconductor substrate. Respective top surfaces of the emitters are bonded to a heat sink, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters. Both anode and cathode contacts are attached to the bottom surfaces so as to drive the emitters to emit light from the bottom surfaces. In another embodiment, the upper surface of a semiconductor substrate is bonded to a carrier substrate having through-holes that are aligned with respective top surfaces of the emitters, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters, and the respective bottom surfaces of the emitters are bonded to a heat sink.

Abstract: A thin film transistor array substrate for a display device generally includes: a substrate; a plurality of gate lines and a plurality of data lines arranged on the substrate intersecting with and insulated from each other; and a plurality of pixel elements arranged in areas defined by the gate lines and the data lines. At least one of the pixel elements includes: a switch element; an insulation layer located on the switch element; and a pixel electrode located at the insulation layer. The insulation layers of the pixel elements define a plurality of vias. The pixel electrodes of two adjacent pixel elements are electrically coupled with the corresponding switch elements of the two adjacent pixel elements through a common via defined by the insulation layers of the two adjacent pixel elements. The two adjacent pixel elements are disposed along extensions of the plurality of the gate lines.

Abstract: An optoelectronic device includes a semiconductor substrate, having front and back sides and having at least one cavity extending from the back side through the semiconductor substrate into proximity with the front side. At least one optoelectronic emitter is formed on the front side of the semiconductor substrate in proximity with the at least one cavity. A heat-conducting material at least partially fills the at least one cavity and is configured to serve as a heat sink for the at least one optoelectronic emitter.

Abstract: A thin film transistor array substrate for a display device generally includes: a substrate; a plurality of gate lines and a plurality of data lines arranged on the substrate intersecting with and insulated from each other; and a plurality of pixel elements arranged in areas defined by the gate lines and the data lines. At least one of the pixel elements includes: a switch element; an insulation layer located on the switch element; and a pixel electrode located at the insulation layer. The insulation layers of the pixel elements define a plurality of vias. The pixel electrodes of two adjacent pixel elements are electrically coupled with the corresponding switch elements of the two adjacent pixel elements through a common via defined by the insulation layers of the two adjacent pixel elements. The two adjacent pixel elements are disposed along extensions of the plurality of the gate lines.

Abstract: An optoelectronic device includes a semiconductor substrate, having front and back sides and having at least one cavity extending from the back side through the semiconductor substrate into proximity with the front side. At least one optoelectronic emitter is formed on the front side of the semiconductor substrate in proximity with the at least one cavity. A heat-conducting material at least partially fills the at least one cavity and is configured to serve as a heat sink for the at least one optoelectronic emitter.

Abstract: A method for production of an optoelectronic device includes fabricating a plurality of vertical emitters on a semiconductor substrate. Respective top surfaces of the emitters are bonded to a heat sink, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters. Both anode and cathode contacts are attached to the bottom surfaces so as to drive the emitters to emit light from the bottom surfaces. In another embodiment, the upper surface of a semiconductor substrate is bonded to a carrier substrate having through-holes that are aligned with respective top surfaces of the emitters, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters, and the respective bottom surfaces of the emitters are bonded to a heat sink.

Abstract: An extrusion blow molding machine comprises an extrusion apparatus, an electrically-driven parison thickness programming apparatus, an electrically-driven mold-clamping apparatus with a dual-driving function, and a frame, wherein the extrusion apparatus, the parison thickness programming apparatus and the mold-clamping apparatus with a dual-driving function are installed on the frame. The mold-clamping apparatus with a dual-driving function comprises a driving assembly, a mold-opening/closing assembly, a mold-moving assembly, and a base. The driving assembly includes a servo motor, which actuates both mold-opening/closing and mold-moving assemblies, respectively. The parison thickness programming apparatus is driven by asynchronous motors, which run in a single direction continuously to result in a required axial parison thickness distribution. An extrusion blow molding method is realized using the machine.

Abstract: A thin film transistor array substrate for a display device generally includes: a substrate; a plurality of gate lines and a plurality of data lines arranged on the substrate intersecting with and insulated from each other; and a plurality of pixel elements arranged in areas defined by the gate lines and the data lines. At least one of the pixel elements includes: a switch element; an insulation layer located on the switch element; and a pixel electrode located at the insulation layer. The insulation layers of the pixel elements define a plurality of vias. The pixel electrodes of two adjacent pixel elements are electrically coupled with the corresponding switch elements of the two adjacent pixel elements through a common via defined by the insulation layers of the two adjacent pixel elements. The two adjacent pixel elements are disposed along extensions of the plurality of the gate lines.

Abstract: A manufacture method for a surface mounted power LED support comprises providing a wiring board having both sided metal layers. In addition, the method comprises forming a hole. Further, the method comprises setting a metal layer in the surface of the hole. Still further, the method comprises thickening the metal layer of the wiring board. The method also comprises etching the metal layer of the wiring board. Moreover, the method comprises cutting the wiring board to form single support unit. A surface mounted power LED support comprises a both sided wiring board, a hole formed in the wiring board and wiring layers set on the surface of the wiring board.

Abstract: An electrical system assembly of an electric automobile includes an energy system, a power system, and an instrument system. The energy system includes a battery module and a management module for managing the battery module; the power system includes a motor and a controller; the battery module includes a number of storage batteries connected in series and a solar panel for charging the storage batteries; and the storage batteries provide energy to the controller, controlling the motor through the controller. There is communication between the management module, the controller and the instrument system, thereby each of these is capable of knowing the working status of the other two, thus facilitating coordination and enabling a powerful protection function for the electrical system assembly of the electric automobile.

Abstract: An extrusion blow molding machine comprises an extrusion apparatus, an electrically-driven parison thickness programming apparatus, an electrically-driven mold-clamping apparatus with a dual-driving function, and a frame, wherein the extrusion apparatus, the parison thickness programming apparatus and the mold-clamping apparatus with a dual-driving function are installed on the frame. The mold-clamping apparatus with a dual-driving function comprises a driving assembly, a mold-opening/closing assembly, a mold-moving assembly, and a base. The driving assembly includes a servo motor, which actuates both mold-opening/closing and mold-moving assemblies, respectively. The parison thickness programming apparatus is driven by asynchronous motors, which run in a single direction continuously to result in a required axial parison thickness distribution. An extrusion blow molding method is realized using the machine.

Abstract: An electrical system assembly of an electric automobile includes an energy system, a power system, and an instrument system. The energy system includes a battery module and a management module for managing the battery module; the power system includes a motor and a controller; the battery module includes a number of storage batteries connected in series and a solar panel for charging the storage batteries; and the storage batteries provide energy to the controller, controlling the motor through the controller. There is communication between the management module, the controller and the instrument system, thereby each of these is capable of knowing the working status of the other two, thus facilitating coordination and enabling a powerful protection function for the electrical system assembly of the electric automobile.

Abstract: A manufacture method for a surface mounted power LED support comprises providing a wiring board having both sided metal layers. In addition, the method comprises forming a hole. Further, the method comprises setting a metal layer in the surface of the hole. Still further, the method comprises thickening the metal layer of the wiring board. The method also comprises etching the metal layer of the wiring board. Moreover, the method comprises cutting the wiring board to form single support unit. A surface mounted power LED support comprises a both sided wiring board, a hole formed in the wiring board and wiring layers set on the surface of the wiring board.