Patents by Inventor Wen Zhou

Wen Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEAT SINK ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20090242168
    Abstract: A heat sink assembly includes a base, a fin group and a heat pipe connecting with the base and the fin group. The fin group includes a plurality of fins. Each of the fins defines a recess at a lower portion thereof. The heat pipe includes an evaporating portion extending through the base and a condensing portion extending through the fin group. The base is interferentially fitted into the recesses of the fins. The base, the fin group and the heat pipe directly and intimately connect with each other. The recess and the base have correspondingly T-shaped profiles. Each fin forms a bended flange defining the recess. The bended flange intimately contacts with the base and the evaporating portion of the heat pipe.
    Type: Application
    Filed: March 27, 2008
    Publication date: October 1, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: JUN CAO, SHI-WEN ZHOU, CHUN-CHI CHEN
  • HEAT DISSIPATION DEVICE WITH HEAT PIPE
    Publication number: 20090242176
    Abstract: A heat dissipation device includes a heat spreader for thermally engaging with a heat generating electronic device, a heat sink assembly located above the heat spreader, and first and second heat pipes connecting with the heat spreader and the heat sink assembly. Each of the first and second heat pipes comprises an evaporation section engaged in the heat spreader, two arc-shaped condensation sections thermally inserted in the heat sink assembly, and two connecting sections interconnecting corresponding condensation sections and the evaporation section. The condensation sections are coplanar with each other and located in a same circle. The condensation sections of the first heat pipe extend in a clockwise direction, while the condensation sections of the second heat pipe extend in an anticlockwise direction.
    Type: Application
    Filed: March 27, 2008
    Publication date: October 1, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: PENG LIU, SHI-WEN ZHOU, CHUN-CHI CHEN, YI-JIUN LI
  • Heat dissipation device
    Patent number: 7589967
    Abstract: A heat dissipation device includes a heat sink (10) for contacting a heat-generating component and a fan (20) mounted to the heat sink. The fan includes a frame (22) and a motor (24) received in the frame. The fan has an intake. The frame has a top level and a bottom level. An airflow is generated by the fan and flows through the heat sink. An anti-backflow plate (30) is mounted between the top level and the bottom level of the fan. The anti-backflow plate extends outwardly and beyond an extremity of the heat sink to prevent the airflow flowing through the heat sink from entering the intake of the fan.
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: September 15, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Guo Chen, Peng Liu, Chun-Chi Chen
  • HEAT DISSIPATION DEVICE HAVING A BRACKET
    Publication number: 20090211730
    Abstract: A heat dissipation device includes a first heat sink, a second heat sink far away from the first heat sink, a heat pipe transferring heat from the first heat sink to the second heat sink and a bracket for reinforcing the heat dissipation device. The bracket includes a first end attached to the first heat sink and a second end attached to the second heat sink. The second end defines a through hole receiving the heat pipe therethrough. The second end has a supporting portion and a clasping portion from an edge of the through hole. The supporting portion and the clasping portion are spaced from each other and firmly clasp the heat pipe. The clasping portion is bent to abut against the heat pipe and urge the heat pipe toward the supporting portion.
    Type: Application
    Filed: June 23, 2008
    Publication date: August 27, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHI-WEN ZHOU, SHOU-BIAO XU, CHUN-CHI CHEN
  • HEAT DISSIPATION DEVICE
    Publication number: 20090154102
    Abstract: A heat dissipation device includes a spreader, a heat sink comprising a base plate and a plurality of outer fins extending upwardly from a top surface of the base plate, a heat pipe thermally connecting the heat sink and the spreader together, a plurality of fasteners each including a fixture having a head at a top thereof, a spring encircling the fixture and a gasket wired on the fixtures. The fixtures extend through the base plate of the heat sink and the spreader, the gaskets are respectively compressed between the heads and the base plate, edge of the base plate of the heat sink is joined with the housing of the computer, and cooperates with the housing to form a hermetic encapsulation which encloses the heat-generating electronic component.
    Type: Application
    Filed: December 12, 2007
    Publication date: June 18, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHI-WEN ZHOU, CHUN-CHI CHEN, GUO CHEN
  • HEAT DISSIPATION DEVICE ASSEMBLY WITH A FAN DUCT HAVING GUIDING MEMBERS FOR GUIDING A SCREWDRIVER TO ASSEMBLE THE HEAT DISSIPATION DEVICE ASSEMBLY TO A PRINTED CIRCUIT BOARD
    Publication number: 20090129018
    Abstract: A heat dissipation device assembly for dissipating heat from a plurality of electronic components mounted on a printed circuit board, includes a heat sink (10) contacting one of the electronic components, a pair of fans (20) attached on a lateral side of the heat sink, and a fan duct (30) fixed on the fans. A plurality of guiding members (322, 346) are formed inwardly from the fan duct to be located in an interior of the fan duct. The guiding members are used for guiding a screwdriver (40) to accurately fit with screws (50) preassembled to the heat sink. Thus, the screws can be quickly and easily fastened by the screwdriver to mount the heat dissipation device assembly on the printed circuit board.
    Type: Application
    Filed: November 15, 2007
    Publication date: May 21, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHI-WEN ZHOU, JUN CAO, JIE-CHENG DENG
  • METHOD AND APPARATUS FOR IMPLEMENTING THE CNAP SERVICE
    Publication number: 20090129578
    Abstract: The present invention discloses a method for realizing the CNAP service, including: receiving a service request sent by the switching system, where the service request carries the identifier of the calling party and the identifier of the called party; querying the calling information set by the calling party according to the identifier of the calling party, and querying the location information of the called party according to the identifier of the called party; after determining that the called MS already rings, sending a flash message that contains the calling information to the called MS according to the location information of the called party. The present invention also provides a calling information service apparatus accordingly. The invention correlates the judging of the status of the call connection process with the time of implementing the CNAP service.
    Type: Application
    Filed: November 14, 2008
    Publication date: May 21, 2009
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventor: Wen ZHOU
  • Heat sink assembly
    Patent number: 7518874
    Abstract: A heat sink assembly includes a heat sink and a clip assembly received in the heat sink. The clip assembly comprises a clip and a movable fastener pivotally connected to the clip via a pair of supporters. Each supporter defines a pivot hole deviated from a center thereof and a retaining slot above the pivot hole. The clip comprises a main body received in the heat sink and two arms extending from the main body and pivotally received in the retaining slots of the supporters. The movable fastener pivotally extends in the pivot holes of the supporters. The movable fastener moves relative to the heat sink and causes rotation of the supporters in a matter such that a distance from the main body of the clip to a bottom of the heat sink is changed, whereby the clip assembly can provide adjustable spring force acting on the heat sink.
    Type: Grant
    Filed: August 10, 2007
    Date of Patent: April 14, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jie-Cheng Deng, Jun Cao, Shi-Wen Zhou
  • Heat dissipation device having mounting brackets
    Patent number: 7493940
    Abstract: A heat dissipation device (100) includes a heat sink (10) having a plurality of fins (14) and a plurality of mounting brackets (20) buckled with the fins of the heat sink. Each of the mounting brackets includes a mounting plate (22) mounted on a top of the heat sink and a baffle plate (26) extending from one side of the mounting plate to a bottom of the heat sink. The baffle plate terminates with a retaining plate (28). A plurality of fasteners (50) extends through the retaining plates to mount the heat dissipation device onto a printed circuit board. Self-tapping screws (40) are used to extend through the fan and the mounting plates of the mounting brackets and threadedly engage with the fins thereby mounting the fan on the heat sink.
    Type: Grant
    Filed: October 10, 2006
    Date of Patent: February 24, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shi-Wen Zhou, Guo Chen, Li He, Peng Liu
  • Heat dissipating assembly having a fan duct
    Patent number: 7495913
    Abstract: A heat dissipating assembly for dissipating heat from a CPU and a VRM simultaneously includes a base (10) contacting the CPU, a heat sink (20) mounted on the base, a pair of fans (30) attached on a front side of the heat sink, and a fan duct (40) secured to the fans. The fan duct has a first inlet (440) through which a part of airflow flows into the fan duct, a second inlet (460) through which another part of the airflow flowing into the fan duct. The another part of the airflow also flows through the VRM so it can cool the VRM. The fan duct further has an outlet (480) for allowing the airflow generated by the fans to blow to the heat sink.
    Type: Grant
    Filed: August 9, 2007
    Date of Patent: February 24, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Peng Liu, Jun Cao, Shi-Wen Zhou
  • APPARATUS AND METHOD FOR POLICY ROUTING
    Publication number: 20090046718
    Abstract: An apparatus and method for policy routing is provided. The method includes: A. configuring a policy routing to a label switching path and obtaining and saving forwarding information; and B. performing packet forwarding based on the forwarding information.
    Type: Application
    Filed: October 23, 2008
    Publication date: February 19, 2009
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yongle SUN, Xia CHEN, Wen ZHOU
  • HEAT DISSIPATING ASSEMBLY HAVING A FAN DUCT
    Publication number: 20090040718
    Abstract: A heat dissipating assembly for dissipating heat from a CPU and a VRM simultaneously includes a base (10) contacting the CPU, a heat sink (20) mounted on the base, a pair of fans (30) attached on a front side of the heat sink, and a fan duct (40) secured to the fans. The fan duct has a first inlet (440) through which a part of airflow flows into the fan duct, a second inlet (460) through which another part of the airflow flowing into the fan duct. The another part of the airflow also flows through the VRM so it can cool the VRM. The fan duct further has an outlet (480) for allowing the airflow generated by the fans to blow to the heat sink.
    Type: Application
    Filed: August 9, 2007
    Publication date: February 12, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: PENG LIU, JUN CAO, SHI-WEN ZHOU
  • HEAT SINK ASSEMBLY
    Publication number: 20090040729
    Abstract: A heat sink assembly includes a heat sink and a clip assembly received in the heat sink. The clip assembly comprises a clip and a movable fastener pivotally connected to the clip via a pair of supporters. Each supporter defines a pivot hole deviated from a center thereof and a retaining slot above the pivot hole. The clip comprises a main body received in the heat sink and two arms extending from the main body and pivotally received in the retaining slots of the supporters. The movable fastener pivotally extends in the pivot holes of the supporters. The movable fastener moves relative to the heat sink and causes rotation of the supporters in a matter such that a distance from the main body of the clip to a bottom of the heat sink is changed, whereby the clip assembly can provide adjustable spring force acting on the heat sink.
    Type: Application
    Filed: August 10, 2007
    Publication date: February 12, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: JIE-CHENG DENG, JUN CAO, SHI-WEN ZHOU
  • HEAT DISSIPATION DEVICE HAVING A FAN FOR DISSIPATING HEAT GENERATED BY AT LEAST TWO ELECTRONIC COMPONENTS
    Publication number: 20080314556
    Abstract: A heat dissipation device for at least two heat-generating electronic components, includes a base, a fin set and a plurality of heat pipes. The base includes a supporting frame and at least two plates attached to a bottom of the frame for contacting with the at least two heat-generating electronic components. The fin set includes a plurality of fins on the base. The heat pipes respectively and thermally connect the at least two plates and the fin set together. A single fan is attached to the heat dissipation device for generating an airflow through the fin set to dissipate heat in the fin set absorbed from the at least two heat-generating electronic components.
    Type: Application
    Filed: June 22, 2007
    Publication date: December 25, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Shi-Wen ZHOU, Peng LIU, Jun CAO
  • HEAT DISSIPATION DEVICE HAVING A FAN MOUNTED THEREON
    Publication number: 20080316705
    Abstract: A heat dissipation device for at least a heat-generating electronic component includes a heat sink, a fan for providing an airflow through the heat sink and a fan holder coupling the fan to the heat sink. The heat sink has a first locking part and a second locking part opposite to the first locking part. The fan holder has a first engaging part engaging with the first locking part at one side of the heat sink and a second engaging part engaging with the second locking part of the heat sink at an opposite side thereof. The first engaging part has a horizontally extending fixing arm and a barb extending downwardly from the fixing arm and hooking with a top side of the heat sink.
    Type: Application
    Filed: June 22, 2007
    Publication date: December 25, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Jun CAO, Peng LIU, Shi-Wen ZHOU
  • Heat dissipation device with heat pipes
    Patent number: 7451806
    Abstract: A heat dissipation device is for contacting with a heat generating electronic device to remove heat from the electronic device. The heat dissipation device includes a base for thermally engaging with the electronic device and a plurality of fins arranged on a face of the base. A first heat pipe is located between the base and the fins, and is sinuously positioned on the face of the base. The first heat pipe has a first section located at a central portion of the base and a plurality of second sections located at lateral portions of the base. At least a second heat pipe has a first section thermally positioned to the base, and a second section extending remotely from the base and thermally engaging with the fins.
    Type: Grant
    Filed: July 24, 2006
    Date of Patent: November 18, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Peng Liu, Chun-Chi Chen
  • Heat dissipation device
    Patent number: 7447025
    Abstract: A heat dissipation device (1) includes a heat sink (10), a fan (20), and an air cooling member (30). Airflow produced by the fan is led to the heat sink after passing through the air cooling member. The air cooling member can lower the temperature of the airflow below an average temperature of an atmosphere surrounding the heat dissipation device.
    Type: Grant
    Filed: November 1, 2005
    Date of Patent: November 4, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shi-Wen Zhou, Zhan Wu
  • Heat dissipation device
    Patent number: 7443677
    Abstract: A heat dissipation device comprises a first heat sink (10) for thermally contacting with an electronic device, a second heat sink (20) mounted on the first heat sink, heat pipes (40) connecting with both the first and second heat sinks. The heat pipes surround an entire periphery of the first heat sink and a part of the second heat sink. Each heat pipe comprises an evaporating portion (42), a first condensing portion (46) and a second condensing portion (44). The first and second condensing portions extend from two opposite ends of the evaporating portion respectively. The evaporating portion is positioned adjacent to the electronic device and the two condensing portions extend inwardly and bend in opposite directions to each other. The first condensing portion extends through the first heat sink and the second condensing portion extends through the second heat sink.
    Type: Grant
    Filed: July 12, 2007
    Date of Patent: October 28, 2008
    Assignees: Fu Zhun Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Chun-Chi Chen, Guo Chen
  • Heat dissipation device
    Patent number: 7423877
    Abstract: A heat dissipation device includes a heat-absorbing member having two arched concave walls formed at opposite sides thereof, and a plurality of fins extending outwardly and slantwise from each of the two arched concave walls of the heat-absorbing member toward a middle between a front and a rear of the heat dissipation device.
    Type: Grant
    Filed: September 1, 2006
    Date of Patent: September 9, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Peng Liu, Guo Chen
  • Heat dissipation device
    Patent number: 7414848
    Abstract: A heat dissipation device includes a base and two heat sinks formed by aluminum extrusion and located on the base. Each heat sink includes a heat conducting portion. The two heat sinks include a plurality of first fins extending inwardly from first faces of the heat conducting portions and located between the heat conducting portions, and a plurality of second fins extending outwardly from second faces of the heat conducting portions. Two heat pipes connect the base and the two heat sinks. Each heat pipe includes a first section thermally engaged with the base, and two second sections extending from the base and thermally engaged with the heat conducting portion of a corresponding heat sink. The second sections are located outside a hub and below fan blades of an impeller of a fan mounted on the heat sinks.
    Type: Grant
    Filed: January 23, 2007
    Date of Patent: August 19, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Peng Liu, Chun-Chi Chen