Patents by Inventor Wen Zhou

Wen Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEAT SINK
    Publication number: 20110048675
    Abstract: A heat sink includes a plurality of first fins and a plurality of second fins. Each first fin and each second fin includes an inner end and an outer end opposite to the inner end, respectively. Each of the second fins is sandwiched between two respective adjacent first fins. The inner end of each of the first fins is engagingly received in the inner end of the previous adjacent first fin, sandwiching the inner end of a corresponding second fin therebetween. The outer end of each of the first fins is engagingly received in the outer end of the previous adjacent second fin, and the outer end of each of the second fins is engagingly received in the outer end of the previous adjacent first fin.
    Type: Application
    Filed: November 17, 2009
    Publication date: March 3, 2011
    Applicants: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shou-Biao Xu, Shi-Wen Zhou, Chun-Chi Chen
  • Heat sink and method of manufacturing the same
    Patent number: 7898809
    Abstract: A heat sink includes a base plate and a plurality of cylindrical pins extending upwardly from the base plate. The cylindrical pins each include an upper dissipating portion, a lower mounting portion, and an engaging portion between the dissipating portion and the mounting portion. The mounting portion is interferentially fitted in a lower part of a corresponding aperture of the base plate. The engaging portion has a diameter smaller than that of the mounting portion. The engaging portion is cramped by an interior wall of the base plate defining an upper part of the corresponding aperture of the base plate by punching an upper surface of the base plate downwardly at a rim of the corresponding aperture.
    Type: Grant
    Filed: October 16, 2008
    Date of Patent: March 1, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Yi-Jiun Li, Peng Liu, Shi-Wen Zhou, Chun-Chi Chen
  • Heat dissipation device having a fan for dissipating heat generated by at least two electronic components
    Patent number: 7891411
    Abstract: A heat dissipation device for at least two heat-generating electronic components, includes a base, a fin set and a plurality of heat pipes. The base includes a supporting frame and at least two plates attached to a bottom of the frame for contacting with the at least two heat-generating electronic components. The fin set includes a plurality of fins on the base. The heat pipes respectively and thermally connect the at least two plates and the fin set together. A single fan is attached to the heat dissipation device for generating an airflow through the fin set to dissipate heat in the fin set absorbed from the at least two heat-generating electronic components.
    Type: Grant
    Filed: June 22, 2007
    Date of Patent: February 22, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Peng Liu, Jun Cao
  • HEAT DISSIPATION DEVICE
    Publication number: 20110024090
    Abstract: An exemplary heat dissipation device includes a base plate, two fin groups, a core, a fan holder coupled to a top of the core, a fan located over the fin groups and secured by the fan holder, and two heat pipes. The two fin groups cooperate to define a central hole in a center thereof and have a plurality of fins extending radially and outwardly from the central hole. The core is placed on the base plate and received in the central hole. Each heat pipe comprises an evaporation section sandwiched between the core and the base plate, an arc-shaped condensation section sandwiched between the two fin groups and an adiabatic section connecting the evaporation section and the condensation section.
    Type: Application
    Filed: December 18, 2009
    Publication date: February 3, 2011
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Shou-Biao Xu, Shi-Wen Zhou, Chun-Chi Chen
  • Heat dissipation device with a heat pipe
    Patent number: 7870889
    Abstract: A heat dissipation device comprises a radiator comprising a collar, a core received in the collar and a helical heat pipe embedded in a circumferential face of the core. The collar has a receiving hole and a plurality of fins extending radially and outwardly from an outer face of the collar. The core together with the heat pipe is received in the receiving hole of the radiator. The core has a flat bottom face and a top face opposite to the bottom face. The heat pipe is located between the radiator and the core and thermally contacts the collar of the radiator and the core. The heat pipe extends from the bottom face of the core to the top face of the core, and has a flattened bottom face coplanar with the bottom face of the core for contacting with an electronic device.
    Type: Grant
    Filed: May 23, 2007
    Date of Patent: January 18, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Guo Chen, Peng Liu, Chun-Chi Chen
  • Heat dissipation device with heat pipes
    Patent number: 7866375
    Abstract: A heat dissipation device includes a base (10), a plurality of fins (20), first and second heat pipes (30), (40), a fan holder (50) and a fan (60) secured to the fan holder. The first heat pipe includes a heat-receiving section (32) and two heat-discharging sections (34). The second heat pipe includes an evaporating portion (42) and two condensing portions (44). The condensing portions of the second heat pipe extend into the fins and are disposed adjacent to opposite ends of each of the fins. One heat-discharging section extends in the fins and is disposed between the condensing portions, thus allowing heat absorbed from the base to be evenly distributed throughout the fins by the heat-discharging sections and the condensing portions.
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: January 11, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Chun-Chi Chen, Bao-Chun Chen
  • Reference Signal Sounding for Uplink Pilot Time Slot in Wireless Communication System
    Publication number: 20100322115
    Abstract: A wireless terminal operating in TDD mode transmits a plurality of sounding reference signals using an assigned maximum sounding reference signal (SRS) bandwidth (BW) size. At least one of the sounding reference signals is transmitted in a corresponding uplink pilot time slot (UpPTS) region of a special sub-frame of a radio frame wherein, in the frequency dimension, an uplink BW center is misaligned with a BW center of the SRS in the UpPTS region, a maximum SRS BW size in the UpPTS region is an even number of resource blocks with prime factors from a set of {2, 3, 5}, and the maximum SRS BW having a size in number of resource blocks less than or equal to (NRBUL?6·NRA) where NRA is a number of Random Access Channel (RACH) opportunities in the UpPTS region.
    Type: Application
    Filed: June 23, 2009
    Publication date: December 23, 2010
    Applicant: MOTOROLA, INC.
    Inventors: Na Wei, Vijay Nangia, Wen Zhou, Brian K. Classon
  • ELECTRONIC SYSTEM WITH HEAT DISSIPATION STRUCTURE
    Publication number: 20100309626
    Abstract: An electronic system such as a computer system includes a casing defining an opening at a side thereof, a motherboard arranged in the casing, a hard disk located at a side of the motherboard and a heat dissipation structure covering the opening of the casing. The motherboard includes a printed circuit board facing toward the opening of the casing, first electronic components and second electronic components mounted on the printed circuit board and facing toward the opening. The heat dissipation structure includes a base engaging with the casing and fins extending from the base and outside of the casing. The base includes a first engaging portion contacting the first and second electronic components and a second engaging portion contacting the hard disk. The first engaging portion and the second engaging portion are in different levels from each other.
    Type: Application
    Filed: November 9, 2009
    Publication date: December 9, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHOU-BIAO XU, SHI-WEN ZHOU, CHUN-CHI CHEN
  • HEAT DISSIPATION DEVICE
    Publication number: 20100296251
    Abstract: A heat dissipation device is provided for dissipating heat generated by a plurality of electronic components mounted on a printed circuit board and having different heights. The heat dissipation device includes a connecting member and a first base mounted on the connecting member and located at above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the first base to assemble the first base on the one of the electronic components on the printed circuit board. A distance between the first base and the one of the electronic components is adjustable by adjusting the joining members to make the first base intimately contact with the one of the electronic components.
    Type: Application
    Filed: September 23, 2009
    Publication date: November 25, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHUN-CHI CHEN, SHI-WEN ZHOU, GUO CHEN
  • HEAT SINK AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20100258287
    Abstract: A heat sink includes a base, a cover and plurality of columned fins. The base protrudes a plurality of studs from a top surface thereof. The cover defines a plurality of recesses and orifices therein. The columned fins each have a head received in corresponding recess of the base and a body extending from the head through the cover. The base joints with the cover by the studs of the base riveted in the orifices of the cover. The base cooperates with the cover to sandwich the heads of the fins therebetween to thereby secure the columned fins to the cover.
    Type: Application
    Filed: August 7, 2009
    Publication date: October 14, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: GUO CHEN, PENG LIU, SHI-WEN ZHOU, CHUN-CHI CHEN
  • HEAT SINK AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20100243229
    Abstract: A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed.
    Type: Application
    Filed: July 20, 2009
    Publication date: September 30, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: PENG LIU, GUO CHEN, SHI-WEN ZHOU, CHUN-CHI CHEN
  • THERMAL MODULE
    Publication number: 20100243207
    Abstract: A thermal module comprises a flat heat spreader, a fin unit arranged above the heat spreader and a plurality of solid poles interconnecting the heat spreader with the fin unit. The heat spreader defines a chamber therein. A working fluid is filled in the chamber. A wick structure is received in the chamber and attached to an inner wall of the heat spreader surrounding the chamber. The fin unit comprises a plurality of fins stacked together.
    Type: Application
    Filed: July 17, 2009
    Publication date: September 30, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: PENG LIU, SHI-WEN ZHOU, CHUN-CHI CHEN
  • HEAT DISSIPATION DEVICE
    Publication number: 20100238630
    Abstract: A heat dissipation device includes a heat sink and a pair of heat pipes fixed to the heat sink. The heat sink includes a rectangular post, four branches extending outwardly from four corners of the post, respectively, and a plurality of fins extending between the branches. Each heat pipe includes an evaporating section attached to a bottom of the post, a condensing section parallel to the evaporation section and attached to a top of the post, and an adiabatic section interconnecting the evaporating section and the condensing section. A block is secured to bottoms of the condensing sections of the heat pipes.
    Type: Application
    Filed: July 24, 2009
    Publication date: September 23, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHOU-BIAO XU, GUO CHEN, SHI-WEN ZHOU
  • Integrated Circuit with Improved Logic Cells
    Publication number: 20100219860
    Abstract: The present invention provides integrated circuits with improved logic cells. In one embodiment, an integrated circuit having a plurality of logic cells (LC) is provided, each LC comprising: a lookup table having a LUT output terminal; and, a first multiplexer; wherein, a first multiplexer input terminal is connected to of a first input terminal of the LC, a second multiplexer input terminal is connected to the LUT output terminal, a multiplexer output terminal is connected to a first output terminal of the LC, and a multiplexer select terminal is connected to a second input terminal of the LC so as to select which of the signals appearing at the first and second multiplexer input terminal to pass through;wherein, by coupling in chain the first input terminal of one LC to the first output terminal of another LC, a WLUT chain is formed.
    Type: Application
    Filed: April 2, 2010
    Publication date: September 2, 2010
    Applicant: AGATE LOGIC (BEIJING), INC.
    Inventors: Fung Fung Lee, Wen Zhou
  • Integrated Circuit with Improved Logic Cells
    Publication number: 20100219861
    Abstract: The present invention provides integrated circuits with improved logic cells. In one embodiment, an integrated circuit having a plurality of logic cells (LC) is provided, each LC comprising: a lookup table having a LUT output terminal; and, a first multiplexer; wherein, a first multiplexer input terminal is connected to of a first input terminal of the LC, a second multiplexer input terminal is connected to the LUT output terminal, a multiplexer output terminal is connected to a first output terminal of the LC, and a multiplexer select terminal is connected to a second input terminal of the LC so as to select which of the signals appearing at the first and second multiplexer input terminal to pass through; wherein, by coupling in chain the first input terminal of one LC to the first output terminal of another LC, a WLUT chain is formed.
    Type: Application
    Filed: April 2, 2010
    Publication date: September 2, 2010
    Inventors: Fung Fung Lee, Wen Zhou
  • Protective device for protecting thermal interface material and fasteners of heat dissipation device
    Patent number: 7779895
    Abstract: A heat dissipation device assembly includes a heat dissipation device for dissipating heat from an electronic element and a protective device assembly. The heat dissipation device includes a base with fasteners extending therethrough, a plurality of fins arranged on a top of the base, and a heat conducting plate attached on a bottom of the base. A thermal interface material is spread on a bottom surface of the heat conducting plate. The protective device assembly includes a first cover attached to a bottom of the heat conducting plate and a second cover separated from the first cover and attached to a lateral side of the base. The first cover protects the thermal interface material from being contaminated and the second cover protects the fasteners from dropping from the base, when the heat dissipation device is transported.
    Type: Grant
    Filed: April 14, 2008
    Date of Patent: August 24, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Jun Cao, Qing-Song Xu
  • Heat dissipation device
    Patent number: 7755894
    Abstract: A heat dissipation device includes a first base plate having a flat top surface, a plurality of flattened heat pipes, a fin assembly located above the heat pipes and a thermally conductive layer formed between the heat pipes and the fin assembly. The thermally conductive layer has a flat surface contacting with the heat pipes. The heat pipes are supported on the top surface of the first base plate. The first base plate has a flat bottom surface for engaging with an electronic package. Each heat pipe comprises an evaporating section and a condensing section bent from the evaporating section, and the evaporating sections of the heat pipes abut side by side against each other.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: July 13, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Ping-An Yang, Meng Fu, Shi-Wen Zhou, Chun-Chi Chen
  • PROGRAMMABLE INTERCONNECT NETWORK FOR LOGIC ARRAY
    Publication number: 20100171524
    Abstract: The present invention provides an integrated circuit, comprising an array of components and programmable interconnect network for the array of components, said programmable interconnect network comprising a plurality of switch boxes being connected in a tree-based hierarchical architecture and providing selection and connection for the components responsive to configuration bits, switch boxes located at the lowest level of hierarchy are connected to the components; switch boxes in at least one level of hierarchy have different number of children from those in other levels of hierarchy. The present invention provides a hierarchical architecture with a vast variety of cell numbers, which facilitates circuit implementation. The present invention also offers greater layout flexibility.
    Type: Application
    Filed: June 20, 2007
    Publication date: July 8, 2010
    Applicant: AGATE LOGIC, INC.
    Inventors: Fungfung Lee, Wen Zhou
  • ACTIVE HEAT SINK FOR USE WITH ELECTRONIC DEVICE
    Publication number: 20100163213
    Abstract: A heat sink includes a heat conducting base, a heat conducting shaft thermally connected to and rotating with respect to the base, and a plurality of fins. The shaft includes a heat absorbing section thermally connected to the base and a heat dissipating section connected with the heat absorbing section. The fins are disposed on the heat dissipating section of the shaft.
    Type: Application
    Filed: July 2, 2009
    Publication date: July 1, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHOU-BIAO XU, SHI-WEN ZHOU, CHUN-CHI CHEN
  • HEAT DISSIPATION APPARATUS HAVING HEAT PIPES INSERTED THEREIN
    Publication number: 20100155023
    Abstract: A heat dissipation apparatus includes a base, a heat sink on the base, two heat pipes thermally connecting the base and the heat sink and a fan mounted in the heat sink. The heat sink comprises a first fin group placed on the base and a second fin group located on the first fin group. Each heat pipe comprises an evaporation section connected to the base, a condensation section and an adiabatic section interconnecting the evaporation section and the condensation section. The condensation sections of the heat pipes are sandwiched between the first and second fin groups and surround the fan.
    Type: Application
    Filed: April 15, 2009
    Publication date: June 24, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Shi-Wen Zhou, Jun Cao, Qing-Song Xu, Chun-Chi Chen