Patents by Inventor Wen Zhou

Wen Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9144229
    Abstract: Transgenes encoding exogenous antibodies are stably integrated into donor cells and are present in the somatic tissue of chimeric birds. The transgenes encode exogenous antibodies and are preferably expressed in the oviduct for collection in the egg. Tissue specificity is provided by selecting the content of the transgene accordingly. Birds whose genome is comprised of transgene-derived exogenous antibody-encoding DNA express exogenous antibodies having desirable chemical properties with increased therapeutic utility compared to antibodies derived from bacterial expression systems.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: September 29, 2015
    Assignee: Synageva BioPharma Corp.
    Inventors: Lei Zhu, Wen Zhou, Robert J. Etches
  • Patent number: 8993729
    Abstract: Transgenes encoding exogenous antibodies are stably integrated into donor cells and are present in the somatic tissue of chimeric birds. The transgenes encode exogenous antibodies and are preferably expressed in the oviduct for collection in the egg. Tissue specificity is provided by selecting the content of the transgene accordingly. Birds whose genome is comprised of trangene-derived exogenous antibody-encoding DNA express exogenous antibodies having desirable chemical properties with increased therapeutic utility compared to antibodies derived from bacterial expression systems.
    Type: Grant
    Filed: July 16, 2012
    Date of Patent: March 31, 2015
    Assignee: Synageva Biopharma Corp.
    Inventors: Lei Zhu, Wen Zhou, Robert J. Etches
  • Publication number: 20140329996
    Abstract: Transgenes encoding exogenous antibodies are stably integrated into donor cells and are present in the somatic tissue of chimeric birds. The transgenes encode exogenous antibodies and are preferably expressed in the oviduct for collection in the egg. Tissue specificity is provided by selecting the content of the transgene accordingly. Birds whose genome is comprised of transgene-derived exogenous antibody-encoding DNA express exogenous antibodies having desirable chemical properties with increased therapeutic utility compared to antibodies derived from bacterial expression systems.
    Type: Application
    Filed: March 25, 2014
    Publication date: November 6, 2014
    Applicant: SYNAGEVA BIOPHARMA CORP.
    Inventors: Lei Zhu, Wen Zhou, Robert J. Etches
  • Patent number: 8703011
    Abstract: The present invention provides a class of thermotropic liquid crystalline polyesters (TLCPs) and molding compositions comprising the polyesters and glass fiber. The TLCPs consist essentially of repeat units derived from p-hydroxybenzoic acid (HBA), 6-hydroxy-2-naphthoic acid (HNA), terephthalic acid (TA), and hydroquinone (HQ), and the mole percent of HBA, HNA, TA and HQ is 34-72%, 12-26%, 4-21% and 4-21%, respectively. The TLCPs have a melting temperature equal to or below 355° C., an inherent viscosity of 4.0-10.0 dL/g and a Heat Deflection Temperature (HDT) in the range of 260-285° C. when compounded with 30% by weight glass fiber. The optimum compositions, selected from the above-mentioned compositional ranges exhibit a relatively low melting temperature and a relatively high HDT. Specified compositions, selected from the above-mentioned compositional ranges have low melting point, which are useful to blend with conventional polymers such as poly (ethylene terephthalate) and nylon etc.
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: April 22, 2014
    Inventors: Xiuzhen Wang, Haishan Bu, Wen Zhou
  • Patent number: 8579016
    Abstract: An exemplary heat dissipation device dissipating heat generated by an electronic element mounted on a printed circuit board includes a supporter, a heat conducting base, a first fin assembly and a heat pipe. The heat conducting base is securely attached to a bottom side of the supporter and thermally contacting the electronic element. The first fin assembly is securely attached to a top side of the supporter. The heat pipe includes an evaporator sandwiched between the supporter and the heat conducting base, and a condenser extending through the supporter and extending in the first fin assembly.
    Type: Grant
    Filed: January 15, 2010
    Date of Patent: November 12, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Guo Chen, Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 8579017
    Abstract: An exemplary heat dissipation device includes a connecting plate, a first heat sink, a second heat sink, and a second flattened heat pipe. The first heat sink includes a substrate mounted on a bottom of the connecting plate and a plurality of cylindrical pins inserted in the connecting plate and contacting the substrate. The second heat sink includes a heat spreader and a plurality of rectangular solid fins integrally extending from the heat spreader. The heat spreader engages in the connecting plate. The heat pipe thermally connects the substrate of the first heat sink and the second heat spreader of the second heat sink.
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: November 12, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Guo Chen, Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 8579019
    Abstract: An exemplary heat dissipation device includes a base plate, two fin groups, a core, a fan holder coupled to a top of the core, a fan located over the fin groups and secured by the fan holder, and two heat pipes. The two fin groups cooperate to define a central hole in a center thereof and have a plurality of fins extending radially and outwardly from the central hole. The core is placed on the base plate and received in the central hole. Each heat pipe comprises an evaporation section sandwiched between the core and the base plate, an arc-shaped condensation section sandwiched between the two fin groups and an adiabatic section connecting the evaporation section and the condensation section.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: November 12, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shou-Biao Xu, Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 8571531
    Abstract: The present invention discloses a method for realizing the CNAP service, including: receiving a service request sent by the switching system, where the service request carries the identifier of the calling party and the identifier of the called party; querying the calling information set by the calling party according to the identifier of the calling party, and querying the location information of the called party according to the identifier of the called party; after determining that the called MS already rings, sending a flash message that contains the calling information to the called MS according to the location information of the called party. The present invention also provides a calling information service apparatus accordingly. The invention correlates the judging of the status of the call connection process with the time of implementing the CNAP service.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: October 29, 2013
    Assignee: Huawei Technologies Co., Ltd.
    Inventor: Wen Zhou
  • Patent number: 8430153
    Abstract: A heat dissipation device includes a base, a first heat sink mounted over the base and connected to the base via two first heat pipes, and a second heat sink located at a lateral side of the first heat sink and thermally connected to the base via a second heat pipe. The first heat sink includes two fin groups. One of the fin groups is stacked on the other fin group. Each of the fin groups includes a plurality of fins spreading radially from a center of the fin group to a periphery of the fin group along horizontal directions.
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: April 30, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shou-Biao Xu, Guo Chen, Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 8378712
    Abstract: The present invention provides in a first aspect a programmable interconnect network for an array of logic blocks, which comprises a plurality of switch boxes being connected in a tree-based hierarchical architecture and providing selection and connection for the logic blocks, switch boxes located at the lowest level of the tree structure are connected to the logic blocks; wherein said network comprises a crosslink established between two of said plurality of switch boxes. The present invention helps implement functions with more area and timing efficiency and/or placement-friendliness.
    Type: Grant
    Filed: May 8, 2009
    Date of Patent: February 19, 2013
    Assignee: Agate Logic, Inc.
    Inventors: Fung Fung Lee, Wen Zhou
  • Patent number: 8365810
    Abstract: A heat sink includes a heat conducting base, a heat conducting shaft thermally connected to and rotating with respect to the base, and a plurality of fins. The shaft includes a heat absorbing section thermally connected to the base and a heat dissipating section connected with the heat absorbing section. The fins are disposed on the heat dissipating section of the shaft.
    Type: Grant
    Filed: July 2, 2009
    Date of Patent: February 5, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shou-Biao Xu, Shi-Wen Zhou, Chun-Chi Chen
  • Publication number: 20130023653
    Abstract: Transgenes encoding exogenous antibodies are stably integrated into donor cells and are present in the somatic tissue of chimeric birds. The transgenes encode exogenous antibodies and are preferably expressed in the oviduct for collection in the egg. Tissue specificity is provided by selecting the content of the transgene accordingly. Birds whose genome is comprised of trangene-derived exogenous antibody-encoding DNA express exogenous antibodies having desirable chemical properties with increased therapeutic utility compared to antibodies derived from bacterial expression systems.
    Type: Application
    Filed: July 16, 2012
    Publication date: January 24, 2013
    Inventors: Lei Zhu, Wen Zhou, Robert J. Etches
  • Patent number: 8347951
    Abstract: A heat dissipation device includes a canister filled with a phase-changeable working fluid, a housing hermetically fixed to a top of the canister and communicating with the canister, a fan located above a top of the housing and an impeller comprising a driving member received in the housing, an annular magnet accommodated in the hub and an axle coaxially connecting the driving member and the annular magnet together. The fan includes a plurality of windings fixed on an inner side thereof. When the working fluid is heated and vaporized to move through the driving member, the driving member is driven by the vaporized working fluid to rotate, whereby the annular magnet rotates within the windings to cause the windings to generate a current.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: January 8, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 8341842
    Abstract: A method of manufacturing a heat sink includes, firstly, providing a plurality of fins each having a head and a body extending from the head, providing a base having a plurality of studs protruding from a top surface thereof, and providing a cover defining a plurality of recesses in a bottom thereof for receiving the heads of the fins and a plurality of orfices for receiving the studs. Next, the cover and the base are pressed to sandwich the heads of the fins therebetween. Then the studs of the base are punched to expand the studs and cause the studs to intimately engage with the cover.
    Type: Grant
    Filed: August 7, 2009
    Date of Patent: January 1, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Guo Chen, Peng Liu, Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 8320267
    Abstract: A wireless terminal operating in TDD mode transmits a plurality of sounding reference signals using an assigned maximum sounding reference signal (SRS) bandwidth (BW) size. At least one of the sounding reference signals is transmitted in a corresponding uplink pilot time slot (UpPTS) region of a special sub-frame of a radio frame wherein, in the frequency dimension, an uplink BW center is misaligned with a BW center of the SRS in the UpPTS region, a maximum SRS BW size in the UpPTS region is an even number of resource blocks with prime factors from a set of {2, 3, 5}, and the maximum SRS BW having a size in number of resource blocks less than or equal to (NRBUL?6·NRA) where NRA is a number of Random Access Channel (RACH) opportunities in the UpPTS region.
    Type: Grant
    Filed: June 23, 2009
    Date of Patent: November 27, 2012
    Assignee: Motorola Mobility LLC
    Inventors: Na Wei, Vijay Nangia, Wen Zhou, Brian K Classon
  • Publication number: 20120275848
    Abstract: An exemplary connector includes a main body and a block engaged with the main body. The main body includes a central plate, a first extension plate extending downwardly from a lateral side of the central plate, and a second extension plate extending upwardly from an opposite lateral side of the central plate. Two riveting holes are defined through the central plate. The block includes a first securing plate and a second securing plate extending from the first securing plate and attached to the central plate of the main body. Two pins extend from the second securing plate and are punched to be engagingly received in the rivet holes of the central plate to engage with the main body.
    Type: Application
    Filed: August 3, 2011
    Publication date: November 1, 2012
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
    Inventors: GUO CHEN, SHI-WEN ZHOU, CHUN-CHI CHEN
  • Patent number: 8296947
    Abstract: A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed.
    Type: Grant
    Filed: July 20, 2009
    Date of Patent: October 30, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Peng Liu, Guo Chen, Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 8251132
    Abstract: A heat sink assembly includes a base, a fin group and a heat pipe connecting with the base and the fin group. The fin group includes a plurality of fins. Each of the fins defines a recess at a lower portion thereof. The heat pipe includes an evaporating portion extending through the base and a condensing portion extending through the fin group. The base is interferentially fitted into the recesses of the fins. The base, the fin group and the heat pipe directly and intimately connect with each other. The recess and the base have correspondingly T-shaped profiles. Each fin forms a bended flange defining the recess. The bended flange intimately contacts with the base and the evaporating portion of the heat pipe.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: August 28, 2012
    Assignees: Fu Zhun Precision Industry (ShenZhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jun Cao, Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 8245765
    Abstract: A heat dissipation device dissipating heat from a heat-generating electronic element, includes a canister filled with a phase-changeable working fluid, a housing hermetically fixed to a top of the canister and communicating with the canister, a fan located above a top of the housing, an impeller comprising a driving member received in the housing and an axle which extends through a center of the driving member. The axle has a lower end extending downwardly through a bottom of the housing to a center of the top of the canister and an upper end extending upwardly through a top of the housing to engage the fan. The working fluid is heated by the heat-generating electronic element and vaporized into the housing to engage the driving member to rotate and drive the fan to rotate synchronously.
    Type: Grant
    Filed: August 28, 2008
    Date of Patent: August 21, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Lt., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 8220527
    Abstract: A heat dissipation device includes a heat spreader for thermally engaging with a heat generating electronic device, a heat sink assembly located above the heat spreader, and first and second heat pipes connecting with the heat spreader and the heat sink assembly. Each of the first and second heat pipes comprises an evaporation section engaged in the heat spreader, two arc-shaped condensation sections thermally inserted in the heat sink assembly, and two connecting sections interconnecting corresponding condensation sections and the evaporation section. The condensation sections are coplanar with each other and located in a same circle. The condensation sections of the first heat pipe extend in a clockwise direction, while the condensation sections of the second heat pipe extend in an anticlockwise direction.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: July 17, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Peng Liu, Shi-Wen Zhou, Chun-Chi Chen, Yi-Jiun Li