Abstract: An arrangement for a micro-mechanical beam includes a support structure to provide an increase in bending stiffness of the micro-mechanical beam without significantly influencing torsional stiffness, where the support structure is configured to directly attach to the micro-mechanical beam.

Abstract: An arrangement for use with a micro-mechanical beam, in which a plurality of support structures are configured to directly attach to the micro-mechanical beam to increase bending stiffness of the micro-mechanical beam without significantly influencing torsional stiffness. At least two of the support structures are arranged to touch each upon reaching a predetermined bending action of the micro-mechanical beam and prevent a further bending action of the micro-mechanical beam, and at least two of the support structures are non-identical.

Abstract: There are many inventions described and illustrated herein, as well as many aspects and embodiments of those inventions. In one aspect, the present invention is directed to a resonator architecture including a plurality of in-plane vibration microelectromechanical resonators (for example, 2 or 4 resonators) that are mechanically coupled to provide, for example, a differential signal output. In one embodiment, the present invention includes four commonly shaped microelectromechanical tuning fork resonators (for example, tuning fork resonators having two or more rectangular-shaped or square-shaped tines). Each resonator is mechanically coupled to another resonator of the architecture. For example, each resonator of the architecture is mechanically coupled to another one of the resonators on one side or a corner of one of the sides. In this way, all of the resonators, when induced, vibrate at the same frequency.

Abstract: An arrangement for use with a micro-mechanical beam, in which a plurality of support structures are configured to directly attach to the micro-mechanical beam to increase bending stiffness of the micro-mechanical beam without significantly influencing torsional stiffness. At least two of the support structures are arranged to touch each upon reaching a predetermined bending action of the micro-mechanical beam and prevent a further bending action of the micro-mechanical beam, and at least two of the support structures are non-identical.

Abstract: A method for producing micromechanical structures, in which a functional layer is deposited onto a sacrificial layer, and the sacrificial layer is removed again for the production of at least one mechanical functional element, which is characterized by a surface barrier layer, with which the functional layer begins on the sacrificial layer, and which has a different state from the remaining functional layer, is also removed at least to a considerable part, or, on the functional layer, one layer or a plurality of layers having at least approximately the same properties with respect to stress in the layer or layers such as the surface barrier layer is(are) applied. Additionally, a micromechanical structure having a functional layer in which the functional layer is constructed in such a way that the stresses are neutralized or no stress gradient appears.

Abstract: A method for producing micromechanical structures, in which a functional layer is deposited onto a sacrificial layer, and the sacrificial layer is removed again for the production of at least one mechanical functional element, which is characterized by a surface barrier layer, with which the functional layer begins on the sacrificial layer, and which has a different state from the remaining functional layer, is also removed at least to a considerable part, or, on the functional layer, one layer or a plurality of layers having at least approximately the same properties with respect to stress in the layer or layers such as the surface barrier layer is (are) applied. Additionally, a micromechanical structure having a functional layer in which the functional layer is constructed in such a way that the stresses are neutralized or no stress gradient appears.

Abstract: An arrangement for a micro-mechanical beam includes a support structure to provide an increase in bending stiffness of the micro-mechanical beam without significantly influencing torsional stiffness, where the support structure is configured to directly attach to the micro-mechanical beam.

Abstract: There are many inventions described and illustrated herein, as well as many aspects and embodiments of those inventions. In one aspect, the present invention is directed to a resonator architecture including a plurality of in-plane vibration microelectromechanical resonators (for example, 2 or 4 resonators) that are mechanically coupled to provide, for example, a differential signal output. In one embodiment, the present invention includes four commonly shaped microelectromechanical tuning fork resonators (for example, tuning fork resonators having two or more rectangular-shaped or square-shaped tines). Each resonator is mechanically coupled to another resonator of the architecture. For example, each resonator of the architecture is mechanically coupled to another one of the resonators on one side or a corner of one of the sides. In this way, all of the resonators, when induced, vibrate at the same frequency.

Abstract: A zinc/air battery includes a plurality zinc/air battery cells and an arrangement for exposing the plurality of zinc/air battery cells to air wherein the exposing arrangement opens the plurality of zinc/air battery cells in a serial manner such that only one cell is operative at a time.

Abstract: A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure.

Abstract: A process for recovering a solid adduct of a bis(4-hydroxyaryl)alkane and a phenolic compound from a suspension comprising the addict is disclosed. The process comprises the steps of a) supplying the suspension to a rotary filter, b) filtering the supplied suspension in the rotary filter to retain adduct as an adduct cake, c) pre-drying the adduct cake with an inert gas, d) washing the pre-dried adduct cake, e) optionally drying the washed adduct cake, and f) discharging the washed adduct cake from the rotary filter.

Abstract: Bisphenol-A is purified in a process which comprises the following steps: a) cooling a liquid mixture comprising bisphenol-A and water in a bisphenol-A crystallizer to form bisphenol-A crystals in a liquid phase; b) separating the bisphenol-A crystals from the liquid phase; c) dividing at least a portion of the liquid phase into a bisphenol-rich organic phase and a water-rich phase; d) feeding phenol and at least a portion of the bisphenol-rich organic phase into a adduct crystallizer to form a crystalline adduct of phenol and bisphenol-A in a mother liquor, and e) separating the crystalline adduct from the mother liquor. Bisphenol-A of high purity at a high yield is obtained.

Abstract: Methods of fabricating micromachined devices are disclosed, as are micromachined (MEMS) devices fabricated using such methods. According to one embodiment, the method includes forming a composite thin film layer stack on a substrate such that composite thin film layer stack comprises a plurality of etch-resistant layers, directionally etching a first portion of the composite thin film layer stack selectively masked by a first etch-resistant layer thereof, and directionally etching a first portion of the substrate selectively masked by the first etch-resistant layer. These steps may result in the formation of a composite thin film microstructure.

Abstract: Bisphenol-A is purified in a process which comprises the following steps: a) cooling a liquid mixture comprising bisphenol-A and water in a bisphenol-A crystallizer to form bisphenol-A crystals in a liquid phase; b) separating the bisphenol-A crystals from the liquid phase; c) dividing at least a portion of the liquid phase into a bisphenol-rich organic phase and a water-rich phase; d) feeding phenol and at least a portion of the bisphenol-rich organic phase into a adduct crystallizer to form a crystalline adduct of phenol and bisphenol-A in a mother liquor, and e) separating the crystalline adduct from the mother liquor. Bisphenol-A of high purity at a high yield is obtained.

Abstract: A method for producing a microsystem that has, situated on a substrate, a first functional layer that includes a conductive area and a sublayer. Situated on the first functional layer is a second mechanical functional layer, which is first initially applied onto a sacrificial layer situated and structured on the first functional layer. In addition, a layer is situated on the side of the sublayer facing away from the conductive area. The layer constitutes a protective layer on the first functional layer that acts in areas during a sacrificial layer etching process so that during removal of the sacrificial layer no etching of the areas of the first functional layer covered by the protective layer occurs, and that in the region of the areas of the first functional layer implemented without the protective layer the sublayer is removed essentially selectively to the conductive area at the same time as the sacrificial layer.

Abstract: A method of manufacturing a micromechanical component has the steps: providing a substrate having a front side and a back side; structuring the front side of the substrate; at least partially covering the structured front side of the substrate with a protective layer containing germanium; structuring the back of the substrate; and at least partially removing the protective layer containing germanium from the structured front side of the substrate.

Abstract: A sensor arrangement for measuring a displacement of a proof mass using a tunneling current includes a proof mass body suspended by micro-mechanical beams to permit a mass body movement, at least one integrated electrode tip arranged to be integrated with the proof mass body, and at least one external electrode tip arranged externally to the proof mass body and suspended by micro-mechanical beams to permit an external electrode movement, the at least one external electrode tip further arranged to be in a close proximity to the at least one integrated electrode tip to permit a flow of the tunneling current between the at least one external electrode tip and the at least one integrated electrode tip, in which the displacement of the proof mass causes a change in the tunneling current.

Abstract: A sensor arrangement for measuring a displacement of a proof mass using a tunneling current includes a proof mass body suspended by micro-mechanical beams to permit a mass body movement, at least one integrated electrode tip arranged to be integrated with the proof mass body, and at least one external electrode tip arranged externally to the proof mass body and suspended by micro-mechanical beams to permit an external electrode movement, the at least one external electrode tip further arranged to be in a close proximity to the at least one integrated electrode tip to permit a flow of the tunneling current between the at least one external electrode tip and the at least one integrated electrode tip, in which the displacement of the proof mass causes a change in the tunneling current.

Abstract: A method is described for producing surface micromechanical structures having a high aspect ratio, a sacrificial layer being provided between a substrate and a function layer, trenches being provided by a plasma etching process in the function layer, at least some of these trenches exposing surface regions of the sacrificial layer. To increase the aspect ratio of the trenches, an additional layer is deposited on the side walls of the trenches in at least some sections, but not on the exposed surface regions of the sacrificial layer. In addition, a sensor is described, in particular an acceleration sensor or a rotational rate sensor.

Abstract: A method for manufacturing a microsystem is provided, which microsystem has a first functional layer situated on a substrate provided with an integrated circuit, the first functional layer including a conductive area and a sub-layer, and a second mechanical functional layer situated on the first functional layer. In the manufacturing method, the second mechanical functional layer is first applied to a sacrificial layer situated on the first functional layer and structured. In addition, a protective layer is provided in selected areas on the side of sub-layer facing away from the conductive area, such that as the sacrificial layer is etched, etching of the areas of the first functional layer covered by the protective layer is prevented, and in the areas of the first functional layer without the protective layer, the sub-layer is selectively etched simultaneously with the sacrificial layer, down to the conductive area.