Abstract: A permutated ring network includes a plurality of bi-directional source-synchronous ring networks, each having a plurality of data transport stations, and a plurality of communication nodes. Each of the communication nodes is coupled to one of the data transport stations in each of the plurality of bi-directional source-synchronous ring networks.

Abstract: The present disclosure describes methods and apparatuses for fabricating integrated-circuit (IC) die with tilted patterning. In some aspects, mandrels are fabricated on a material stack and occlude portions of a layer of material from a field of energy radiated at an angle of incidence relative to the mandrels. The occluded portions of the layer of material can be used to mask an underlying film to create a film pattern on a substrate of the IC die. These methods and apparatuses may enable the fabrication of IC die with features that are smaller in size than those afforded by conventional lithography processes.

Abstract: The present disclosure describes apparatuses and methods for manufacturing programmable memory devices with optimized gate oxide thickness. In some aspects, lithography masks are used to fabricate oxide gates for programmable memory devices of an integrated-circuit (IC) die that are thinner than oxide gates fabricated for processor core devices of the IC die. In other aspects, lithography masks are used to fabricate oxide gates for the programmable memory devices of the IC die such that they are thicker than the oxide gates fabricated for the processor core devices of the IC die. By so doing, the programmable memory devices can be manufactured with optimized gate oxide thickness that may reduce programming voltage or increase device reliability of the programmable memory devices.

Abstract: In some implementations, a method of fabricating an integrated circuit includes obtaining first data for a first chip containing a first version of the integrated circuit, determining that a transistor should be coupled with another transistor, selecting one or more masks for coupling the transistor with the other transistor to adjust the threshold voltage of the transistor, obtaining second data for a second chip containing a second version of the integrated circuit, determining that the second version of the integrated circuit meets one or more requirements, and preparing a final integrated circuit design for production based on the second version of the integrated circuit.

Abstract: Systems and methods described herein provide a memory cell circuit. The memory cell circuit includes a first internal node communicatively coupled to a first write bit line via a first write pass gate, and a second internal node communicatively coupled to a second write bit line via a second write pass gate. The memory cell circuit further includes a first read bit line connected to a first read pass gate and a first transistor, and a second read bit line connected to a second read pass gate and a second transistor. The first internal node is decoupled from the first read bit line by the first transistor, and the second internal node is decoupled from the second read bit line by the second transistor when a write operation and a read operation occur at the same time.

Abstract: In a method of executing instructions in a processing system, respective global age tags are assigned to each of the one or more instructions fetched for processing by the processing system. Each global age tag indicates an age of the corresponding instruction in the processing system. Respective physical registers in a physical register file are allocated to each destination logical register referenced by each instruction. The respective global age tags are written to the in respective physical registers allocated to the destination logical registers of the instructions. The instructions are executed by the processing system. At least some of the instructions are executed in an order different from a program order of the instructions.

Abstract: The present disclosure includes systems and techniques relating to methods and systems that improve yield in multiple chips integration processes. In some implementations, a method includes providing, in a chamber, a first integrated circuit chip and a second integrated circuit chip supported on a carrier, flowing a molding compound to cover the first integrated circuit chip, the second integrated circuit chip, and the carrier; and flowing a forming gas into the chamber while curing the molding compound.

Abstract: Circuits, architectures, a system and methods for memories with multiple power supplies and/or multiple low power modes. The circuit generally includes peripheral circuitry operating at a first voltage, a memory array operating at a second voltage, and translation circuitry configured to receive an input from the peripheral circuitry at the first voltage and provide an output to the memory array at the second voltage, the translation circuitry further configured to prevent leakage during a standard operating mode of the memory.

Abstract: A circuit includes a latch circuit, a buffer transistor having a control terminal coupled to a first output of the latch, a first write transistor having a conduction terminal coupled to the first output and a control terminal coupled to a first write bitline, and a second write transistor having a conduction terminal coupled to a second output of the latch and a control terminal coupled to a second write bitline. A method of operating a memory cell circuit includes providing a first value on first and second write bitlines when a read operation is performed, and when a write operation is performed, providing first and second values on the first and second write bitlines, respectively, when a first storable value is to be stored, and providing the first and second value on the second and first write bitlines, respectively, when a second storable value is to be stored.

Abstract: Systems and methods are provided for using and manufacturing a semiconductor device. A semiconductor device comprises an array of transistors, wherein each respective transistor in at least some of the transistors in the array of transistors (1) is positioned adjacent to a respective first neighboring transistor and a respective second neighboring transistor in the array of transistors, (2) has a source region that shares a first contact with a source region of the respective first neighboring transistor, and (3) has a drain region that shares a second contact with a drain region of the respective second neighboring transistor.

Abstract: A system including a resistive element of a memory cell and a device to access the resistive element of the memory cell. The resistive element includes (i) a first electrode, and (ii) a second electrode. The device includes (i) a first terminal connected to a first contact, and (i) a second terminal connected to a second contact. One or more of the first contact and the second contact of the device is respectively connected to one or more of the first electrode and the second electrode of the resistive element via a third contact. A size of the third contact decreases from the one or more of the first contact and the second contact of the device to the one or more of the first electrode and the second electrode of the resistive element of the memory cell.

Abstract: Embodiments include a method comprising: receiving a first voltage; and while testing a memory cell: modifying the first voltage to generate a second voltage that is different from the first voltage; and performing a first read operation on the memory cell, based on applying (i) the second voltage to an array of transistors of the memory cell and (ii) the first voltage to the memory cell.

Abstract: Systems and methods are provided for reading from a static random-access memory (SRAM). The systems and methods include activating a first bitline connected to a first transistor, wherein the first transistor provides access to a state stored by the SRAM. The systems and methods further include preventing a second bitline from being activated when the first bitline is activated, wherein the second bitline is connected to a second transistor that isolates the SRAM from a reference potential when the second bitline is activated, and reading the state stored by the SRAM by triggering a wordline connected to a gate of the first transistor.

Abstract: Circuits, architectures, a system and methods for memories with multiple power supplies and/or multiple low power modes. The circuit generally includes peripheral circuitry operating at a first voltage, a memory array operating at a second voltage, and translation circuitry configured to receive an input from the peripheral circuitry at the first voltage and provide an output to the memory array at the second voltage, the translation circuitry further configured to prevent leakage during a standard operating mode of the memory.

Abstract: A system including a resistive element of a memory cell and a device to access the resistive element of the memory cell. The resistive element includes (i) a first electrode, and (ii) a second electrode. The device includes (i) a first terminal connected to a first contact, and (i) a second terminal connected to a second contact. One or more of the first contact and the second contact of the device is respectively connected to one or more of the first electrode and the second electrode of the resistive element via a third contact. A size of the third contact decreases from the one or more of the first contact and the second contact of the device to the one or more of the first electrode and the second electrode of the resistive element of the memory cell.

Abstract: A resistive random access memory system includes a plurality of bitlines, a plurality of wordlines, and an array of resistive random access memory cells. Each of the resistive random access memory cells in the array includes a transistor and a resistive random access memory element connected in a common gate configuration.

Abstract: In some implementations, a built-in self-test (BIST) circuitry of a memory device is configured to perform an execution of a test sequence to test the memory device, wherein performing the execution comprises generating addresses of the memory device in accordance with the test sequence and advancing a value of a modulo counter as each of the addresses is generated, enable error logging when a generated address and a value of the modulo counter corresponding to the generated address match an address and a value of the modulo counter stored for a previously detected error, detect an error in data read from the memory device after enabling error logging, and store information associated with the detected error.

Abstract: Methods and structures for transistors having reduced source contact to gate spacings in semiconductor devices are disclosed. In one embodiment, a method of forming a transistor can include: forming a gate over an active area of the transistor; forming source and drain regions aligned to the gate in the active area; forming source and drain contacts over the source and drain regions, where a spacing from the gate to the source contact of the transistor is less than a spacing from the gate to the drain contact of the transistor; and using one or more modified masks for forming doping profiles for the source region and the drain region.

Abstract: Aspects of the disclosure provide a circuit, such as an integrated circuit. The circuit includes a first circuit and a second circuit. The second circuit includes a delay circuit configured to cause the second circuit to have substantially matched delay characteristics of the first circuit in response to at least one parameter change of manufacturing, environmental and operational parameters, such as process variation, temperature variation, and supply voltage variation.

Abstract: Circuits, architectures, a system and methods for memories with multiple power supplies and/or multiple low power modes. The circuit generally includes peripheral circuitry operating at a first voltage, a memory array operating at a second voltage, and translation circuitry configured to receive an input from the peripheral circuitry at the first voltage and provide an output to the memory array at the second voltage, the translation circuitry further configured to prevent leakage during a standard operating mode of the memory.