Abstract: A system and method for providing substantially defect free rapid thermal processing. The present invention includes a wafer processing system used to process semiconductor wafers into electronic devices. In accordance with the present invention, once the wafer is processed, a shield can be inserted into the reactor to a position between the reactor heating surface and the wafer. The shield causes the temperature of the wafer to be reduced. Once the temperature of the wafer has been reduced to below a predetermined critical temperature, the robot picks up the wafer and removes the wafer from the processing chamber.

Abstract: A system and method for transporting semiconductor wafers in a semiconductor processing system, which may include a transport module and a process chamber. The system includes a container configured to house a plurality of semiconductor wafers, where the container is a separate component from the semiconductor processing system. A semiconductor wafer transport device is disposed in the transport module, which is configured to extend into the container from the transport module and deliver the semiconductor wafers to the process chamber.

Abstract: A system and method for filling a plurality of closely-spaced apart recesses to form a high-density pattern in the surface of a substrate. The metallization system and process includes providing a substrate, which includes a first surface defining a plurality of recesses; overlaying a resistive foil on the first surface; and subjecting the substrate to a pressure to cause said resistive foil to enter said plurality of recesses.

Abstract: A processing system and associated method for vacuum evaporation of material onto a substrate. The processing system includes a loading chamber, a transfer chamber, and a thermal processing chamber arranged together to form a cluster tool. The cluster tool arrangement provides the system a continuous processing capability. The system also includes an evacuation system arrangement for evacuating the processing system to adequate processing pressure levels. The evacuation system arrangement includes a series of pumps, which are capable of maintaining the selected processing pressure levels for continuous thermal evaporation processing without the need for lowering the pressure to deep vacuum pressure levels.

Abstract: An object handling system and apparatus for moving objects through a pressure sensitive system. The present invention can operate in a chamber having a pressurized environment, without adversely influencing or causing pressure changes. The present invention can be used in the transfer chamber of a semiconductor processing system, which has vertically mounted (i.e., vertically integrated) multiple reactors, load locks, and cooling stations, and which requires substantial vertical movement of the handling system. The handling system of the present invention includes a handling mechanism operatively coupled to a robotic device, which is mounted to a driver member. The driver member is movably secured at opposite ends of the chamber in which it operates. The robotic device can translate along the driver member and extend the handling mechanism in the horizontal plane to grab or pick-up an object and move the object to an alternative location.

Abstract: A system and method for conserving and/or recycling hydrogen used in processing operations. The present invention can be used with any conventional reactor, which supports semiconductor processes using hydrogen. Hydrogen is pumped into the reactor from a hydrogen gas supply chamber. The hydrogen is used in the reactor as needed to perform the process function. The hydrogen accompanied with other process gases is exhausted from the reactor. The exhausted gases are routed through a scrubber, which is used to separate the hydrogen from the other gases. The other gases are allowed to vent from the system in a typical manner. The hydrogen is then pumped through an H2 purifier, which cleans the hydrogen gas making the gas once again useable in the semiconductor process.

Abstract: A multi-spectral uniform light source provides a single light source for a variety of applications. The gas or gases inside the light source may be exchanged for another gas or gases depending on the desired application and need for a particular wavelength of emitted light.

Abstract: A wafer processing system occupies minimal floor space by using vertically mounted modules such as reactors, load locks, and cooling stations. Further saving in floor space is achieved by using a loading station which employs rotational motion to move a wafer carrier into a load lock. The wafer processing system includes a robot having extension, rotational, and vertical motion for accessing vertically mounted modules. The robot is internally cooled and has a heat resistant end-effector, making the robot compatible with high temperature semiconductor processing.

Abstract: A robot wafer alignment tool uses a reflector mounted on a multi-axis robot to determine the position of the robot or other objects within a chamber. The reflector reflects images to at least one camera from an area or object of interest in the chamber.

Abstract: A method for forming a thin film on a semiconductor wafer. The method includes loading a semiconductor wafer into a process chamber while the process chamber is under vacuum pressure, or alternatively, while the partial pressure of the reactive gas is substantially zero. The process gas is introduced under pressure into the process chamber. The semiconductor wafer is unloaded from the process chamber while the process chamber is under a vacuum pressure, or alternatively while the partial pressure of the reactive gas is substantially zero.

Abstract: An apparatus and process for processing a substrate using components and particles formed in a remote plasma generation section of a processing chamber. The processing chamber includes a processing section and a plasma generation section. A plasma field is generated in the plasma generation section, such that the plasma field is generated remotely from the processing section. Components and particles from the plasma field can diffuse and/or drift from the plasma generation section through a passageway to the processing section. The processing chamber may include a plurality of plasma generation sections for generating additional plasma fields. In each instance, the additional plasma fields are generated remotely from the processing section.

Abstract: A wafer processing system occupies minimal floor space by using vertically mounted modules such as reactors, load locks, and cooling stations. Further saving in floor space is achieved by using a loading station which employs rotational motion to move a wafer carrier into a load lock. The wafer processing system includes a robot having extension, rotational, and vertical motion for accessing vertically mounted modules. The robot is internally cooled and has a heat resistant end-effector, making the robot compatible with high temperature semiconductor processing.

Abstract: A wafer processing system which requires no isolation between the operational areas within the processing system. The system of the present invention includes operational areas, such as a loading area, a transport area, and a reactor or thermal processing area. Advantageously, since there are no isolation devices or gate valves separating the areas, the processing system effectively has each operational area combined into a “single” chamber. Preferably, the single chamber has a single slit valve, hinge door, or other vacuum sealable door disposed proximate to the loading area to allow for the removal/insertion of the wafers into the loading area. Once the door to the loading area has been closed the internal pressure within the chamber can be kept uniform throughout each operational area.

Abstract: A system and method for using a portable enclosure system for conducting on-site demonstrations of semiconductor processing operations or as a temporary clean room. A vehicle transports an environmentally-controlled enclosure including a semiconductor processing workspace, preparation area, and entrance area, from a first location to a second location. An air suspension device and trailer are included in one embodiment. Air suspension devices and an enclosed truck are included in another embodiment. In yet another embodiment, the environmentally-controlled enclosure system includes a viewing mechanism, which allows for visual inspection of the internal portion of the enclosure from outside of the controlled environment, especially advantageous during demonstrations.

Abstract: A positionable arm composed of multiple member segments connected by an adjustable joint which may be fixedly positioned and repeatedly repositioned. The first member includes an end portion defining a first connector opening and an inner surface defining a chamber. A slideable piston provided in the first member includes a first end and a second end, the first end being adjacent the chamber and creating a seal along the inner surface of the first member. A rotatable connector is received in the first member between the second end of said piston and the end portion of the first member, and a second member is attached to the rotatable connector. To position the arm, a pressurized fluid source supplies compressed air to the chamber, which presses the piston against the rotatable connector, fixedly clamping the connector between the piston and the end portion of the first chamber.

Abstract: A system for uniformly and controllably heating the active surface of a semiconductor wafer or substrate during processing. The present invention may include a radiation energy source provided, which is enclosed or substantially surrounded by a reflective/absorptive surface, which both reflects and absorbs the radiation, emitted from the energy source. In accordance with the present invention, the resultant energy output as seen by the wafer is substantially free of non-uniformity.

Abstract: A heat exchanger is used to transfer heat from water to liquid nitrogen. As heat is transferred from the water to the liquid nitrogen, the temperature of the water becomes lower and the liquid nitrogen converts to gaseous nitrogen. The cooled water and gaseous nitrogen are used by one or more semiconductor fabrication equipment in the semiconductor fabrication process. Thus, overall power consumption of the semiconductor fabrication process is lowered because water is cooled by passing the water by liquid nitrogen to convert the liquid nitrogen to gaseous nitrogen for use in the semiconductor fabrication process.

Abstract: A heating apparatus for isothermally distributing a temperature across a semiconductor device or wafer during processing. The invention includes a chamber configured to receive a single semiconductor wafer. Housed within the chamber is a heating member or heating plate. Disposed on a periphery of the heating member is a heat source. Heat energy radiating from the heat source conducts through the heating member to create an isothermal temperature distribution across the heating member. Wafer supports are included on the heating plate which support the wafer in close proximity to the heating plate, such that the temperature of the heating plate establishes the temperature of the wafer. Advantageously, this configuration permits the temperature to be uniformly and isothermally distributed over the wafer.

Abstract: A system for uniformly and controllably heating the active surface of a semiconductor wafer or substrate during processing. The present invention may include a radiation energy source provided, which is enclosed or substantially surrounded by a reflective/absorptive surface, which both reflects and absorbs the radiation, emitted from the energy source. In accordance with the present invention, the resultant energy output as seen by the wafer is substantially free of non-uniformity.

Abstract: A gate valve assembly, which may be used to seal a semiconductor processing chamber to isolate the chamber and/or maintain pressure or vacuum therein. The invention includes a gate coupled to a linear axial shaft. The axial shaft is driven using a single action actuator. The gate of the present invention has an inclined surface to the shaft. Because the surface is inclined, the gate can be forced by the movement of the axial shaft against a similarly inclined gate seat surface. The angled surface translates the axial sealing force provided by the axial shaft into a positive lateral sealing force without the need for lateral movement of the gate.