Abstract: Embodiments of the present disclosure relate to a method for cleaning an in-process wafer. The method comprises causing the in-process wafer to be rotated, causing function water to be applied to a surface of the rotated in-process wafer to generate a flowing function water film on the rotated in-process wafer, causing the surface of the in-process wafer to be cleaned by a sonic device for a first period, causing the sonic device to be lifted and/or rotation speed of the rotated in-process wafer to be accelerated to separate the sonic device from the flowing function water film, causing the function water to be applied to the surface of the rotated in-process wafer for a second period after separating the sonic device from the function water film, and causing the surface of the in-process wafer to be dried.

Abstract: The present invention discloses a method for cleaning substrate without damaging patterned structure on the substrate using ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; after micro jet generated by bubble implosion and before said micro jet generated by bubble implosion damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned.

Abstract: An apparatus for cleaning semiconductor substrates includes a chamber (101), a chuck (102), a liquid collector (104), an enclosing wall (105), at least one driving mechanism (106), at least one internal dispenser (111), and at least one external dispenser (118). The chamber (101) has a top wall (1011), a side wall (1012) and a bottom wall (1013). The chuck (102) is disposed in the chamber (101) for holding a semiconductor substrate (103). The liquid collector (104) surrounds the chuck (102). The enclosing wall (105) surrounds the liquid collector (104). The at least one driving mechanism (106) drives the enclosing wall (105) to move up and down, wherein when the at least one driving mechanism (106) drives the enclosing wall (105) to move up, a seal room (110) is formed by the liquid collector (104), the enclosing wall (105), the top wall (1011) of the chamber (101), and the bottom wall (1013) of the chamber (101). The at least one internal dispenser (111) is disposed inside the seal room (110).

Abstract: A method for cleaning semiconductor substrate without damaging patterned structure on the substrate using ultra/mega sonic device comprising applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; before bubble cavitation in said liquid damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned. Normally, if f1=f2, then P2 is equal to zero or much less than P1; if P1=P2, then f2 is higher than f1; if the f1<f2, then, P2 can be either equal or less than P1.

Abstract: A coater with automatic cleaning function and a coater automatic cleaning method. The coater (100,200,300,400,500,600,700,800) includes a coater chamber (101,201,301,401,501,601,701,801) capable of being filled up with cleaning solution, a substrate chuck (102,202,302,402,502,602,702,802) holding and positioning a substrate (103,203,303,403,503,603,703,803), and at least one shroud (108,208,308,408,508) capable of moving up for preventing photoresist from splashing out of the coater chamber (101,201,301,401,501,601,701,801), or moving down and immersing into the cleaning solution for cleaning.

Abstract: A substrate (2010, 3010, 4010, 5010, 6010, 7010, 8010) cleaning method is provided, it comprises the steps of: placing a substrate (2010, 3010, 4010, 5010, 6010, 7010, 8010) on a substrate holder (1314); delivering cleaning liquid onto the surface of the substrate (2010, 3010, 4010, 5010, 6010, 7010, 8010); implementing a pre-treatment process to detach bubbles (2050, 2052, 3050, 4050, 5050, 6050, 7052, 70584, 7056, 8052, 8054, 8056) from the surface of the substrate (2010, 3010, 4010, 5010, 6010, 7010, 8010); and then implementing an ultra or mega sonic cleaning process for cleaning the substrate (2010, 3010, 4010, 5010, 6010, 7010, 8010).

Abstract: A method and an apparatus for cleaning a substrate are provided. The substrate (1010) comprises features (4034) of patterned structures. The method comprises placing the substrate on a substrate holder (1014) configured to rotate the substrate; applying cleaning liquid (1032) on the substrate; rotating the substrate by the substrate holder at a first rate when acoustic energy is being applied to the cleaning liquid by a transducer (1004); and rotating the substrate by the substrate holder at a second rate higher than the first rate when acoustic energy is not being applied to the cleaning liquid by the transducer.

Abstract: A method for cleaning semiconductor substrate without damaging patterned structure on the substrate using ultra/mega sonic device comprising applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; before bubble cavitation in said liquid damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned. Normally, if f1=f2, then P2 is equal to zero or much less than P1; if P1=P2, then f2 is higher than f1; if the f1<f2, then, P2 can be either equal or less than P1.

Abstract: Provided herein are compounds of Formula (I): and forms thereof, including compositions thereof and uses therewith for treating spinal muscular atrophy.

Abstract: A coater with automatic cleaning function and a coater automatic cleaning method. The coater (100,200,300,400,500,600,700,800) includes a coater chamber (101,201,301,401,501,601,701,801) capable of being filled up with cleaning solution, a substrate chuck (102,202,302,402,502,602,702,802) holding and positioning a substrate (103,203,303,403,503,603,703,803), and at least one shroud (108,208,308,408,508) capable of moving up for preventing photoresist from splashing out of the coater chamber (101,201,301,401,501,601,701,801), or moving down and immersing into the cleaning solution for cleaning.

Abstract: A method for cleaning semiconductor substrate (1010,2010) without damaging patterned structure on the semiconductor substrate (1010,2010) using ultra/mega sonic device (1003,2003) comprises applying liquid into a space between a substrate (1010,2010) and an ultra/mega sonic device (1003,2003); setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive the ultra/mega sonic device (1003,2003); before bubble cavitation in the liquid damaging patterned structure on the substrate (1010,2010), setting the ultra/mega sonic power supply at zero output;after temperature inside bubble cooling down to a set temperature, setting the ultra/mega sonic power supply at frequency f1 and power P1 again; detecting power on time at power P1 and frequency f1 and power off time separately or detecting amplitude of each waveform output by the ultra/mega sonic power supply; comparing the detected power on time with a preset time ?1, or comparing the detected power off time with a preset time ?2, or comparing dete

Abstract: The present invention provides a vacuuming apparatus for removing bubbles from an oil immersed device containing components immersed in insulating oil. The vacuuming apparatus comprises: a supporting mechanism for supporting the oil immersed device; a swinging mechanism for swinging the supporting mechanism and the oil immersed device supported thereby; and a vacuuming mechanism for vacuuming the oil immersed device.

Abstract: A thermostable formula comprises the following components in percentage by mass: 1% to 5% raffinose, 5% to 10% maltose, 15% to 30% saccharose, 1% to 5% lactose, 1% to 5% glucose, 0.1% to 1.5% polysorbate 80, 0.1% to 0.5% polyethylene glycol 8000, 0.5% to 3% tyrosine, 3% to 6% silk fibroin, and the balance of water for injection. It further discloses a room-temperature-preserved live classical swine fever vaccine and a preparation method thereof, wherein the live classical swine fever vaccine is obtained by mixing the thermostable formula with a live classical swine fever virus solution and then carrying out gradient vacuum drying. The vaccine prepared according to the present invention has a dried foam appearance and presents a glass-layer like structure under a scanning electron microscope, has a glass transition temperature up to more than 50° C.

Abstract: Disclosed are a fusion peptide of CD4 helper T cell epitopes, a nucleic acid encoding the same and an immunogenic composition comprising the same. The epitope fusion peptide comprises a cytomegalovirus epitope and an influenza virus epitope. The epitope fusion peptide can substantially improve the level of cellular immune response to a target immunogen, particularly a weak immunogen, and is an effective means for overcoming the immune tolerance of immune system to an antigen, particularly to a tumor antigen or an infection-related antigen, and is suitable for efficiently enhancing the efficacy of vaccine.

Abstract: The present invention provides a scan gantry for a medical imaging system. The scan gantry comprises a bottom supporting frame and a tilt supporting frame that are connected to each other, wherein the tilt supporting frame is tiltable relative to the bottom supporting frame. The scan gantry further comprises a locking mechanism connected between the bottom supporting frame and the tilt supporting frame. In the process that the tilt supporting frame is being tilted relative to the bottom supporting frame, the locking mechanism is in an unlocked state; and when the tilt supporting frame is stationary relative to the bottom supporting frame, the locking mechanism is in a locked state to prevent the tilt supporting frame from moving relative to the bottom supporting frame.

Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.

Abstract: The present invention relates to a gantry of a CT scanning device comprising: a first housing having a first bore; a second housing having a second bore, disposed opposite to the first housing, wherein there is a gap between the first bore and the second bore, as a ray scanning bore; a scan window assembly comprising an annular window body having an inner surface and an outer surface, the scan window assembly being engaging-locked with the first housing and the second housing and sealing and covering the ray scanning bore. In this way, the engaging-lock can restrict deformation of the annular window body when an external force is applied on the scan window assembly, and the sealing can prevent liquid in the first and second housing from leaking out and prevent liquid inside the scan window assembly from leaking into the first and second housing.

Abstract: Disclosed is a method for rapidly amplifying CD8+ T cells and functional cell subpopulations thereof in vitro. A TLR1/2 agonist, a TLR2/6 agonist and a TLR5 agonist or a combination of above agonists is added to a conventional culture system for in-vitro amplification of CD8+ T cells. Recombinant cytokines IL-2, IL-7 and IL-15 as well as magnetic beads coated with an anti-human CD3 antibody and an anti-human CD28 antibody can be further added to the culture system for continuous co-stimulation.

Abstract: The present invention provides an X-ray transceiving component for a CT imaging apparatus, comprising one or more bulb devices and a plurality of detector devices. The one or more bulb devices are configured to emit quadrate-tapered or fan-shaped X-ray beams. The plurality of detector devices are configure to receive the quadrate-tapered or fan-shaped X-ray beams emitted by the one or more bulb devices, each of the quadrate-tapered or fan-shaped X-ray beams comprising X-rays passing through a scanning field of view. Note that the plurality of detector devices are configured to receive X-rays passing through different areas within the scanning field of view, the one or more bulb devices are micro-focus bulb devices, and the plurality of detector devices are flat panel detectors or photoelectric coupling detectors.

Abstract: Provided herein are compounds, compositions thereof and uses therewith for treating spinal muscular atrophy.