Abstract: Devices and methods are provided for processing network nodes. For example, a sorting request is detected; one or more first network nodes to be sorted are acquired corresponding to the sorting request; a first characteristic matrix is constructed based on at least information associated with the first network nodes; association information between the first network nodes is acquired; a sparse matrix is constructed based on at least information associated with the association information between the first network nodes; iterative multiplication is performed on the sparse matrix and the first characteristic matrix to obtain a second characteristic matrix upon convergence; and the first network nodes are sorted based on at least information associated with the second characteristic matrix.

Abstract: Provided is a hot beverage maker, comprising a water tank, a boiler, a dispensing device, a water outlet pipe and a control device. A first valve is provided in the water inlet pipe; the dispensing device comprises a first opening, a second opening, a connecting pipeline connected between the first opening and the second opening, and a second valve provided in the connecting pipeline; the first opening opens to the atmosphere, and the second opening is disposed inside the boiler; the water outlet pipe is in communication with an inner cavity of the boiler; the control device is connected with the first valve and the second valve to control open/close of the first valve and the second valve. This disclosed hot beverage maker without power pump or other priming devices has the structure described above, could reduce the material cost and the dimensions of the machine.

Abstract: A lighting device or a lamp bulb (100, 200) with a smooth appearance comprises at least one light source (101); a heat sink component (104, 204), having a bottom (1043) and a side wall (1044) extending from the bottom (1044), wherein the bottom (1043) comprises a protrusion (1041) and wherein the at least one light source (101) thermally contacts the protrusion (1041) of the heat sink component (104, 204); and a cover provided on the side-wall (1044) opposite to the bottom (1043), thereby defining an air chamber (1051, 2051) between the cover, the side wall (1044), the bottom (1043) and the protrusion (1041).

Abstract: A method for preventing game cheating may comprise acquiring a database associated with an online service, including feature data associated with a plurality of features; and for each of the plurality of features, generating a cheating probability distribution, based on the feature data, associates a value of the feature with a probability that a user account having a same feature value belongs to a cheating user. Further, the method may comprise receiving feature data of a current user account of the online service; determining whether the current user account belongs to a cheating user; and if yes, prohibiting the current user account from accessing the online service.

Abstract: The present invention discloses a method and system for transferring TDM services in GPON, the method includes the steps of: in the case of performing the GPON ranging process, buffering the uplink TDM service data received by an optical signal transceiver in an Input Buffer, reading out and transferring the uplink TDM service data buffered in an Output Buffer. The present invention eliminates the possible interruption of TDM services during the GPON ranging process by buffering the uplink services at the OLT and ONU/ONT side and relevant processes, and therefore realizes the TDM service transmission without any loss during the GPON system ranging process.

Abstract: The invention provides an illumination apparatus (10) and a method of assembling the illumination apparatus. The illumination apparatus comprises a light source (101) having a plurality of LED arrays, wherein at least two of the plurality of LED arrays have different lumen degradations as a function of junction temperature of the respective LED arrays; and a heat dissipation unit (102) configured to be capable of dissipating heat generated by the light source, wherein the heat dissipation unit is mounted on a first surface of the light source in such a way that there is a gap between the first surface and the heat dissipation unit when the light source is not in operation, and the gap is narrowed or can be deemed to disappear when the light source reaches a preset temperature, so that the heat dissipation efficiency of the heat dissipation unit is improved.

Abstract: A housing having a coating is disclosed. The housing comprises a base substrate made of metallic material; a micro-arc oxide layer formed on the base substrate; and a protection outer film formed on the micro-arc oxide layer and comprising a coating layer and a metallic layer, wherein the metallic layer is formed on the micro-arc oxide layer and covers a portion of the micro-arc oxide layer; and the coating layer is formed on a remaining portion of the micro-arc oxide layer so that the micro-arc oxide layer is covered by the metallic layer and the coating layer.

Abstract: There is provided a lighting device 100 comprising a light source, a driver arranged for powering the light source, which is separated in space from the light source. The lighting device has two separate heat sinks, a light source heat sink 112 to which the light source is thermally coupled, and a driver heat sink 115 to which the driver is thermally coupled. The light source heat sink and the driver heat sink are separated by an air gap 114 to provide thermal decoupling of the light source heat sink and the driver heat sink.

Abstract: A housing having a coating is disclosed. The housing comprises a base substrate made of metallic material; a micro-arc oxide layer formed on the base substrate; and a protection outer film formed on the micro-arc oxide layer and comprising a coating layer and a metallic layer, wherein the metallic layer is formed on the micro-arc oxide layer and covers a portion of the micro-arc oxide layer; and the coating layer is formed on a remaining portion of the micro-arc oxide layer so that the micro-arc oxide layer is covered by the metallic layer and the coating layer.

Abstract: The invention provides an illumination apparatus (10) and a method of assembling the illumination apparatus. The illumination apparatus comprises a light source (101) having a plurality of LED arrays, wherein at least two of the plurality of LED arrays have different lumen degradations as a function of junction temperature of the respective LED arrays; and a heat dissipation unit (102) configured to be capable of dissipating heat generated by the light source, wherein the heat dissipation unit is mounted on a first surface of the light source in such a way that there is a gap between the first surface and the heat dissipation unit when the light source is not in operation, and the gap is narrowed or can be deemed to disappear when the light source reaches a preset temperature, so that the heat dissipation efficiency of the heat dissipation unit is improved.

Abstract: A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature.

Abstract: A housing having a coating is disclosed. The housing comprises a base substrate made of metallic material; a micro-arc oxide layer formed on the base substrate; and a protection outer film formed on the micro-arc oxide layer and comprising a coating layer and a metallic layer, wherein the metallic layer is formed on the micro-arc oxide layer and covers a portion of the micro-arc oxide layer; and the coating layer is formed on a remaining portion of the micro-arc oxide layer so that the micro-arc oxide layer is covered by the metallic layer and the coating layer.

Abstract: The present invention discloses a method and system for transferring TDM services in GPON, the method includes the steps of: in the case of performing the GPON ranging process, buffering the uplink TDM service data received by an optical signal transceiver in an Input Buffer, reading out and transferring the uplink TDM service data buffered in an Output Buffer. The present invention eliminates the possible interruption of TDM services during the GPON ranging process by buffering the uplink services at the OLT and ONU/ONT side and relevant processes, and therefore realizes the TDM service transmission without any loss during the GPON system ranging process.

Abstract: Various methods and systems for determining a defect criticality index (DCI) for defects on wafers are provided. One computer-implemented method includes determining critical area information for a portion of a design for a wafer surrounding a defect detected on the wafer by an inspection system based on a location of the defect reported by the inspection system and a size of the defect reported by the inspection system. The method also includes determining a DCI for the defect based on the critical area information, a location of the defect with respect to the critical area information, and the reported size of the defect.

Abstract: Methods and systems for generating an inspection process for a wafer are provided. One computer-implemented method includes separately determining a value of a local attribute for different locations within a design for a wafer based on a defect that can cause at least one type of fault mechanism at the different locations. The method also includes determining a sensitivity with which defects will be reported for different locations on the wafer corresponding to the different locations within the design based on the value of the local attribute. In addition, the method includes generating an inspection process for the wafer based on the determined sensitivity. Groups may be generated based on the value of the local attribute thereby assigning pixels that will have at least similar noise statistics to the same group, which can be important for defect detection algorithms. Better segmentation may lead to better noise statistics estimation.

Abstract: The present invention discloses a method and system for transferring TDM services in GPON, the method includes the steps of: in the case of performing the GPON ranging process, buffering the uplink TDM service data received by an optical signal transceiver in an Input Buffer, reading out and transferring the uplink TDM service data buffered in an Output Buffer. The present invention eliminates the possible interruption of TDM services during the GPON ranging process by buffering the uplink services at the OLT and ONU/ONT side and relevant processes, and therefore realizes the TDM service transmission without any loss during the GPON system ranging process.

Abstract: A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature.

Abstract: Methods and systems for generating an inspection process for a wafer are provided. One computer-implemented method includes separately determining a value of a local attribute for different locations within a design for a wafer based on a defect that can cause at least one type of fault mechanism at the different locations. The method also includes determining a sensitivity with which defects will be reported for different locations on the wafer corresponding to the different locations within the design based on the value of the local attribute. In addition, the method includes generating an inspection process for the wafer based on the determined sensitivity. Groups may be generated based on the value of the local attribute thereby assigning pixels that will have at least similar noise statistics to the same group, which can be important for defect detection algorithms. Better segmentation may lead to better noise statistics estimation.

Abstract: A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature.

Abstract: A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature.