Abstract: Various methods and systems for determining a defect criticality index (DCI) for defects on wafers are provided. One computer-implemented method includes determining critical area information for a portion of a design for a wafer surrounding a defect detected on the wafer by an inspection system based on a location of the defect reported by the inspection system and a size of the defect reported by the inspection system. The method also includes determining a DCI for the defect based on the critical area information, a location of the defect with respect to the critical area information, and the reported size of the defect.

Abstract: A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature.

Abstract: Wafer inspection systems and methods are provided. One inspection system includes a module measurement cell coupled to a host inspection system by a wafer handler. The module measurement cell is configured to inspect a wafer using one or more modes prior to inspection of the wafer by the host inspection system. The one or more modes include backside inspection, edge inspection, frontside macro defect inspection, or a combination thereof. Another inspection system includes two or more low resolution electronic sensors arranged at multiple viewing angles. The sensors are configured to detect light returned from a wafer substantially simultaneously. A method for analyzing inspection data includes selecting a template corresponding to a support device that contacts a backside of a wafer prior to inspection of the backside of the wafer. The method also includes subtracting data representing the template from inspection data generated by inspection of the backside of the wafer.

Abstract: A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature.

Abstract: Systems and methods of processing scanned pages are described. In one aspect, the invention features a method of processing a sequence of scanned pages of a document in accordance with which, page number indicators are extracted from scanned pages of the document. A histogram of extracted page number indicators is computed. Scanned page sequence information is determined based at least in part on the computed histogram. A computer program and a system for implementing the scanned page processing method also are described.

Abstract: A system and method for protecting self-heating containers that include single-use chemical heaters during overtemperature occasions includes the automatic release into the heater of a suppressant composition in response to a design temperature being achieved. For protection against extreme temperature excursions, the system and method include generating steam to absorb heat and venting that steam.

Abstract: Wafer inspection systems and methods are provided. One inspection system includes a module measurement cell coupled to a host inspection system by a wafer handler. The module measurement cell is configured to inspect a wafer using one or more modes prior to inspection of the wafer by the host inspection system. The one or more modes include backside inspection, edge inspection, frontside macro defect inspection, or a combination thereof. Another inspection system includes two or more low resolution electronic sensors arranged at multiple viewing angles. The sensors are configured to detect light returned from a wafer substantially simultaneously. A method for analyzing inspection data includes selecting a template corresponding to a support device that contacts a backside of a wafer prior to inspection of the backside of the wafer. The method also includes subtracting data representing the template from inspection data generated by inspection of the backside of the wafer.

Abstract: The present invention discloses a method and system for transferring TDM services in GPON, the method includes the steps of: in the case of performing the GPON ranging process, buffering the uplink TDM service data received by an optical signal transceiver in an Input Buffer, reading out and transferring the uplink TDM service data buffered in an Output Buffer. The present invention eliminates the possible interruption of TDM services during the GPON ranging process by buffering the uplink services at the OLT and ONU/ONT side and relevant processes, and therefore realizes the TDM service transmission without any loss during the GPON system ranging process.

Abstract: A housing of electronic product includes an accommodating space and at least one heat dissipating opening, wherein the heat dissipating opening is formed on an upper surface of the housing so as to allow a heat dissipating device received in the accommodating space to dissipate heat generated by operation of electronic components received in the accommodating space to improve heat dissipating efficiency.

Abstract: Systems and methods of processing scanned pages are described. In one aspect, the invention features a method of processing a sequence of scanned pages of a document in accordance with which, page number indicators are extracted from scanned pages of the document. A histogram of extracted page number indicators is computed. Scanned page sequence information is determined based at least in part on the computed histogram. A computer program and a system for implementing the scanned page processing method also are described.

Abstract: A disposable heating device is disclosed that includes a container having a first zone, a second zone and a third zone. A fuel is contained within the first zone and an oxidizing agent contained within the second zone. A first frangible separator disposed between the first zone and the second zone. The first frangible separator is manually operable to provide communication between the first zone and the second zone thereby defining a reaction zone. A second frangible separator is responsive to an exothermic chemical reaction within the reaction chamber. The second frangible separator is operable to provide communication between the reaction chamber and the third zone. Communication between the first zone and the second zone allows mixing of the fuel and the oxidizing agent to initiate an exothermic chemical reaction and an environmental parameter associated with the exothermic chemical reaction operates the second frangible separator.

Abstract: Vacuum packaging methods and materials are claimed. The materials are fusible and can form a part of a heat seal closure for non-rigid and semi-rigid packages. The methods are suitable for packages containing materials generally, and are well suited for those containing granular materials.

Abstract: A disposable heating device is disclosed that includes a container having a first zone, a second zone and a third zone. A fuel is contained within the first zone and an oxidizing agent contained within the second zone. A first frangible separator disposed between the first zone and the second zone. The first frangible separator is manually operable to provide communication between the first zone and the second zone thereby defining a reaction zone. A second frangible separator is responsive to an exothermic chemical reaction within the reaction chamber. The second frangible separator is operable to provide communication between the reaction chamber and the third zone. Communication between the first zone and the second zone allows mixing of the fuel and the oxidizing agent to initiate an exothermic chemical reaction and an environmental parameter associated with the exothermic chemical reaction operates the second frangible separator.

Abstract: A self-contained device for heating/dispensing or cooling/dispensing material is described. The device includes at least one heat- or cold-generating element and at least one container for containing material to be heated or cooled. The device can further be equipped with gussets or similar features to allow free-standing.

Abstract: A self-contained device for heating/dispensing or cooling/dispensing material is described. The device includes at least one heat-or cold-generating element and at least one container for containing material to be heated or cooled. The device can further be equipped with gussets or similar features to allow free-standing.

Abstract: Vacuum packaging methods and materials are claimed. The materials are fusible and can form a part of a heat seal closure for non-rigid and semi-rigid packages. The methods are suitable for packages containing materials generally, and are well suited for those containing granular materials.