Abstract: In the SDRAM, a selector selects one of four global IO line pairs according to a column block select signal and a word configuration selecting signal, and connects the selected global IO line pair to an input/output node pair of a preamplifier in a pulsed manner for a prescribed period of time. Since the equalization of the global IO line pair can be started immediately after the global IO line pair is connected in a pulsed manner to the input/output node pair of the preamplifier, longer equalization period for the global IO line can be set aside so that the read operation can be stabilized.

Abstract: A semiconductor memory device is provided with a static random access memory (SRAM) serving as a cache memory and a dynamic random access memory (DRAM) serving as a main memory. A bi-directional data transfer circuit is arranged for transfer of data blocks between the SRAM and the DRAM. A command register is provided for holding command data to set operation modes such as a data output mode of the memory device. The data output mode may include a transparent mode, a latched mode and a registered mode selected depending on a data combination at data input terminals of the memory device. An output circuit for providing a selected data output mode includes an output latch circuit for latching data on read data buses in response to clock signals, and an output buffer for outputting data from the output latches to a data output terminal.

Abstract: A semiconductor memory device includes a DRAM, an SRAM and a bi-direction transfer gate circuit provided between SRAM and DRAM. SRAM array includes a plurality of sets of word lines. Each set is provided in each row of SRAM array and each word line in each set is connected to a different group of memory cells of an associated row. An address signal for the SRAM and an address signal for the DRAM are separately applied to an address buffer. The semiconductor memory device further includes an additional function control circuit for realizing a burst mode and a sleep mode. A data transfer path from DRAM to the SRAM and a data transfer path from the SRAM to the DRAM are separately provided in the bi-directional transfer gate circuit. Data writing paths and data reading paths are separately provided in the DRAM array. By the above described structure, operation of the buffer circuit is stopped in the sleep mode, reducing power consumption.

Abstract: Common circuit includes inactivation/activation circuits. Exclusive circuits include inverters IV3, IV4, IV5 and IV6 at the input portions thereof. When an SDR-SDRM is to be produced, inactivation/activation circuit outputs an inactivation signal DASL fixed to a ground voltage to exclusive circuit, while inactivation/activation circuit outputs a signal/OE inverted from an output enable signal OE to exclusive circuit. Inverters IV5 and IV6 in exclusive circuit then output a signal based on the signal/OE. Further, an N-channel MOS transistor and a P-channel MOS transistor in exclusive circuit are completely turned off, so that no through current flows from a power-supply node to a ground terminal in exclusive circuit. As a result, generation of the through current is prevented in an inactivated circuit.

Abstract: A semiconductor memory device receives an external control signal repeatedly generated independently of an access to the memory device. The memory device includes an internal voltage generator for generating a desired internal voltage in response to the control signal. The internal voltage generator includes a charge pump circuit responsive to the control signal. The internal voltage may provide a negative voltage such as a substrate bias voltage, or may be a positive voltage boosted over an operating power supply voltage and used as a boosted word line drive signal. This scheme eliminates an oscillator for generating a repeated clock signal to the charge pump circuit, leading to reduced current consumption and reduced chip area for the semiconductor memory device.

Abstract: In a SDRAM, there is introduced a control signal going active low following a passage of a predetermined period of time after a sense amplifier activation signal goes active high. When a signal going high during a burst period goes low and the control signal also goes low, a word line is dropped, non-selected low. As such, paired bit lines can have a potential difference sufficiently amplified to allow data to be satisfactorily rewritten into a memory cell.

Abstract: A semiconductor memory device includes a DRAM, an SRAM and a bi-direction transfer gate circuit provided between SRAM and DRAM. SRAM array includes a plurality of sets of word lines. Each set is provided in each row of SRAM array and each word line in each set is connected to a different group of memory cells of an associated row. An address signal for the SRAM and an address signal for the DRAM are separately applied to an address buffer. The semiconductor memory device further includes an additional function control circuit for realizing a burst mode and a sleep mode. A data transfer path from DRUM to the SRAM and a data transfer path from the SRAM to the DRAM are separately provided in the bi-directional transfer gate circuit. Data writing paths and data reading paths are separately provided in the DRAM array. By the above described structure, operation of the buffer circuit is stopped in the sleep mode, reducing power consumption.

Abstract: In a SDRAM, there is introduced a control signal going active low following a passage of a predetermined period of time after a sense amplifier activation signal goes active high. When a signal going high during a burst period goes low and the control signal also goes low, a word line is dropped, non-selected low. As such, paired bit lines can have a potential difference sufficiently amplified to allow data to be satisfactorily rewritten into a memory cell.

Abstract: A semiconductor device according to the present invention includes a plurality of test mode circuits. Each test mode circuit includes a plurality of decode circuits decoding an input signal and a plurality of latch circuits. Each decode circuit generates a test mode signal. The test mode signals are held in the latch circuits. Each test mode circuit further includes decode circuits outputting a group reset signal for resetting a corresponding latch circuit. Thus, a plurality of test mode signals can be combined arbitrarily and serially.

Abstract: A semiconductor memory device is configured to include a static random access memory (SRAM) array and a dynamic random access memory (DRAM) array. The memory device includes an internal data line which enables the transfer of data blocks between the SRAM and DRAM arrays. Data transfer circuitry is provided separately from the internal data line and includes a latch circuit for latching the data to be transferred. The data transfer circuitry is responsive to a transfer designating signal.

Abstract: A read enable signal OEMF activated in response to an input command is applied to an N minus 2 clock shift circuit included in an output control circuit for implementation of ZCAS latency. An output signal of the N minus 2 clock shift circuit and an internal mask instructing signal activated in response to an external mask instructing signal are logically processed and applied to a one-clock shift circuit. According to an output signal OEMQM of one-clock shift circuit, a data output enable signal OEM controlling activation/inactivation of an output buffer circuit is activated/inactivated. Data output controlling portion occupying area of a synchronous dynamic random access memory is reduced and timings of activation/inactivation of data output by different commands are made the same.

Abstract: A semiconductor memory device includes a DRAM, an SRAM and a bi-direction transfer gate circuit provided between SRAM and DRAM. SRAM array includes a plurality of sets of word lines. Each set is provided in each row of SRAM array and each word line in each set is connected to a different group of memory cells of an associated row. An address signal for the SRAM and an address signal for the DRAM are separately applied to an address buffer. The semiconductor memory device further includes an additional function control circuit for realizing a burst mode and a sleep mode. A data transfer path from DRAM to the SRAM and a data transfer path from the SRAM to the DRAM are separately provided in the bi-directional transfer gate circuit. Data writing paths and data reading paths are separately provided in the DRAM array. By the above described structure, operation of the buffer circuit is stopped in the sleep mode, reducing power consumption.

Abstract: In a synchronous dynamic random access memory (SDRAM), one bank A is divided into banks A0 and A1, and two sets of writing-related circuits are arranged corresponding to each memory cell array bank and are capable of performing writing operation substantially independently. The first and second bits of write data applied successively from the outside world are applied alternately to write registers. Since the I/O line pair is connected to the selected memory cells in respective memory cell array banks after incorporation of the second bit data to be written is completed, the potential levels of the corresponding I/O line pair always change to the corresponding potential levels from the initial state in writing the first and second bit data.

Abstract: An external clock enable signal is taken in accordance with a first internal clock signal from clock buffer circuit from which an input buffer enable signal is generated to be input to input buffer circuit. Current path in the input buffer circuit is shut off in accordance with the input buffer enable signal. Since the state of the input buffer enable signal is changed in synchronization with the rise of the internal clock signal, the set up time of the external signal can be sufficiently ensured while current consumption of input buffer circuit can be reduced.

Abstract: Memory arrays are divided into banks which can be operated independent from each other. Read data storing registers and write data storing registers operating independent from each other are provided for the banks. The memory array is divided into a plurality of small array blocks, local IO lines are arranged corresponding to each array block, and the local IO lines are connected to global IO lines. The global IO lines are connected to preamplifier groups and to write buffer groups. By control signal generating circuits and by a register control circuit, inhibition of writing of a desired bit only during successive writing operation can be done, data can be collectively written to the selected memory cells when the final data is input if the data writing should be stopped before reaching the wrap length in successive writing, and the timing for activating the memory array when the write cycle should be repeatedly carried out can be delayed.

Abstract: A semiconductor memory device includes a DRAM, an SRAM and a bi-direction transfer gate circuit provided between SRAM and DRAM. SRAM array includes a plurality of sets of word lines. Each set is provided in each row of SRAM array and each word line in each set is connected to a different group of memory cells of an associated row. An address signal for the SRAM and an address signal for the DRAM are separately applied to an address buffer. The semiconductor memory device further includes an additional function control circuit for realizing a burst mode and a sleep mode. A data transfer path from DRAM to the SRAM and a data transfer path from the SRAM to the DRAM are separately provided in the bi-directional transfer gate circuit. Data writing paths and data reading paths are separately provided in the DRAM array. By the above described structure, operation of the buffer circuit is stopped in the sleep mode, reducing power consumption.

Abstract: When an operating frequency is increased and a CAS latency is set longer, a data write end time is delayed by a specific time in response to the change of the CAS latency. The specific time is greater than a period corresponding to the CAS latency. The specific time may be the minimum time necessary for writing second-bit data. The write margin can also be enlarged by delaying the write timing (activation and inactivation) in the interior of a memory itself by one clock cycle of an external clock signal. Thus, a write period for second-bit data is ensured in an SDRAM, even if the operation frequency is increased.

Abstract: A correspondence defining circuit changes a correspondence between an external signal and an internal signal and supplies it to a mode designating signal generating circuit according to a logic state of an operation mode switching signal. The mode designating signal generating circuit activates a mode designating signal which designates a specific operation mode in a semiconductor device when the internal signal satisfies a prescribed condition. An operation mode setting circuit, applicable to applications in which states of external signals are different without a change of its internal structure, is thus provided.

Abstract: A first clock signal for controlling the inputting of an external signal and for controlling internal operation and a second clock signal for controlling data output are applied to separate clock input nodes, respectively. Data output timing with respect to the first clock signal can be adjusted and thus clock access time and data hold time can be adjusted. Internal data read path is pipelined to include a first transfer gate responsive to the first clock signal for transferring internal read data and a second transfer gate responsive to the second clock signal for transferring the internal read data from the first transfer gate for external outputting through an output buffer. A synchronous semiconductor memory device is provided capable of setting clock access time and data hold time at the optimal values depending on the application and of reducing the clock access time.

Abstract: Disclosed is a DRAM including a test mode operation capable of testing whether a plurality of memory cells are defective or not in a short time. The DRAM includes a power-on detection signal generator, a power-on reset signal generator, and a test mode instruction signal generator. The power-on detection signal generator detects application of a power supply voltage and generates a power-on detection signal. The power-on reset signal generator is reset by a power-on reset signal, counts at least once an external RAS signal applied after reset and generates a power-on reset signal. The test mode instruction signal generator detects logic states of an internal RAS signal, an internal CAS signal and an internal W signal applied after the power-on reset and generates a test mode instructing signal.