Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: A semiconductor device includes: M*1st conductors in a first layer of metallization (M*1st layer) and being aligned correspondingly along different corresponding ones of alpha tracks and representing corresponding inputs of a cell region in the semiconductor device; and M*2nd conductors in a second layer of metallization (M*2nd layer) aligned correspondingly along beta tracks, and the M*2nd conductors including at least one power grid (PG) segment and one or more of an output pin or a routing segment; and each of first and second ones of the input pins having a length sufficient to accommodate at most two access points; each of the access points of the first and second input pins being aligned to a corresponding different one of first to fourth beta tracks; and the PG segment being aligned with one of the first to fourth beta tracks.

Abstract: Provided is a composition for improving gut microbiota, including: a bacterial species combination consisting of Limosilactobacillus fermentum TCI275 with an accession number of BCRC 910940, Bifidobacterium animalis subsp. lactis TCI604 with an accession number of BCRC 910887, and Weizmannia coagulans TCI803 with an accession number of BCRC 910946. Provided is a method for improving gut microbiota of a subject in need thereof with the bacterial species combination.

Abstract: A gas flow accelerator may include a body portion, and a tapered body portion including a first end integrally formed with the body portion. The gas flow accelerator may include an inlet port connected to the body portion and to receive a process gas to be removed from a semiconductor processing tool by a main pumping line. The semiconductor processing tool may include a chuck and a chuck vacuum line to apply a vacuum to the chuck to retain a semiconductor device. The tapered body portion may be configured to generate a rotational flow of the process gas to prevent buildup of processing byproduct on interior walls of the main pumping line. The gas flow accelerator may include an outlet port integrally formed with a second end of the tapered body portion. An end portion of the chuck vacuum line may be provided through the outlet port.

Abstract: The present disclosure relates to a method for fabricating a semiconductor structure. The method includes providing a substrate with a gate structure, an insulating structure over the gate structure, and a S/D region; depositing a titanium silicide layer over the S/D region with a first chemical vapor deposition (CVD) process. The first CVD process includes a first hydrogen gas flow. The method also includes depositing a titanium nitride layer over the insulating structure with a second CVD process. The second CVD process includes a second hydrogen gas flow. The first and second CVD processes are performed in a single reaction chamber and a flow rate of the first hydrogen gas flow is higher than a flow rate of the second hydrogen gas flow.

Abstract: A method of forming a semiconductor device includes forming source/drain regions on opposing sides of a gate structure, where the gate structure is over a fin and surrounded by a first dielectric layer; forming openings in the first dielectric layer to expose the source/drain regions; selectively forming silicide regions in the openings on the source/drain regions using a plasma-enhanced chemical vapor deposition (PECVD) process; and filling the openings with an electrically conductive material.

Abstract: A semiconductor device includes a substrate having a magnetic tunneling junction (MTJ) region and a logic region, a magnetic tunneling junction (MTJ) on the MTJ region and a first metal interconnection on the MTJ. Preferably, a top view of the MTJ includes a circle and a top view of the first metal interconnection includes an ellipse overlapping the circle.

Abstract: A 3D IC package is provided. The 3D IC package includes: a first IC die comprising a first substrate at a back side of the first IC die; a second IC die stacked at the back side of the first IC die and facing the first substrate; a TSV through the first substrate and electrically connecting the first IC die and the second IC die, the TSV having a TSV cell including a TSV cell boundary surrounding the TSV; and a protection module fabricated in the first substrate, wherein the protection module is electrically connected to the TSV, and the protection module is within the TSV cell.

Abstract: An image object classification method and system are disclosed. The method is executed by a processor coupled to a memory. The method includes: providing an image file including at least one image object, performing a process of extracting multiple binary-classified characteristics on the image object to obtain a plurality of first results independent of each other in categories, combining the plurality of first results in a manner of dimensionality reduction based on concatenation, performing a process of characteristics abstraction on the combined first results to obtain a second result, and performing a process of characteristics integration on the plurality of first results and the second result in a manner of dot product of matrices to obtain a classification result.

Abstract: Semiconductor devices and methods of manufacture are provided wherein a metallization layer is located over a substrate, and a power grid line is located within the metallization layer. A signal pad is located within the metallization layer and the signal pad is surrounded by the power grid line. A signal external connection is electrically connected to the signal pad.

Abstract: The disclosure provides a control method of a display driver. The control method includes receiving address information and defining an IC address according to the address information. The IC address includes n bits representing k zones, and n and k are positive integers. The control method further includes receiving the IC address, a black frame data signal and a pulse-width modulation (PWM) signal, and turning on or off the plurality of LEDs in the corresponding zone according to toggle of bit in the black frame data signal. Each bit in the black frame data signal indicates that a plurality of LEDs in a zone among the k zones are turned on or off.

Abstract: Semiconductor devices and methods of manufacture are provided wherein a metallization layer is located over a substrate, and a power grid line is located within the metallization layer. A signal pad is located within the metallization layer and the signal pad is surrounded by the power grid line. A signal external connection is electrically connected to the signal pad.

Abstract: An automatic target image acquisition and calibration system for application in a defect inspection system is disclosed. During the defect inspection system working normally, the automatic target image acquisition and calibration system is configured to find a recognition structure from an article under inspection, and then determines a relative position and a relative 3D coordinate if the article. Therefore, a robotic arm is controlled to carry a camera to precisely face each of a plurality of inspected surfaces of the article, such that a plurality of article images are acquired by the camera. It is worth explaining that, during the defect inspection of the article, there is no need to modulate an image acquiring height and an image acquiring angle of the camera and an illumination of a light source.

Abstract: A switchable floating image display device, including a light-emitting stack layer, a light-emitting pattern stack layer, a transparent barrier layer, an optical imaging module, and a power supply module, is provided. The light-emitting stack layer is configured to generate a first pattern beam. The light-emitting pattern stack layer is configured to generate a second pattern beam. The transparent barrier layer is disposed between the light-emitting stack layer and the light-emitting pattern stack layer. The optical imaging module is configured to enable the first pattern beam to form a first floating image, and enable the second pattern beam to form a second floating image. The power supply module is electrically connected to the light-emitting stack layer and the light-emitting pattern stack layer, and configured determine whether to generate the first or second floating image by switching between the light-emitting stack layer and the light-emitting pattern stack layer to emit light.

Abstract: A light source module including a light guide plate and a light emitting element is provided. The light guide plate includes an upper surface concentric circle structure and a lower surface concentric circle structure opposite to the upper surface concentric circle structure. The center of the upper surface concentric circle structure corresponds to the center of the lower surface concentric circle structure. The light emitting element is disposed corresponding to the center of the upper surface concentric circle structure and the center of the lower surface concentric circle structure.

Abstract: A light source module including a light guide plate and a light emitting element is provided. The light guide plate includes an upper surface concentric circle structure and a lower surface concentric circle structure opposite to the upper surface concentric circle structure. The center of the upper surface concentric circle structure corresponds to the center of the lower surface concentric circle structure. The light emitting element is disposed corresponding to the center of the upper surface concentric circle structure and the center of the lower surface concentric circle structure.

Abstract: A floating image display device, configured to generate a floating image, is provided. The floating image display device includes an image module and at least one transflective optical element. The image module is configured to provide a first image. The transflective optical element includes a first reflective surface and a second reflective surface. The first image is located between the first reflective surface and the second reflective surface. Each of the first reflective surface and the second reflective surface includes a curved surface and has no opening on an optical axis thereof. The second reflective surface is a transflective surface. The first reflective surface and the second reflective surface are configured to re-converge rays from the first image to form a second image. The second image is a floating image.

Abstract: A space three-dimensional imaging apparatus and a space three-dimensional imaging method are provided. The space three-dimensional imaging apparatus includes a transparent display device, a rotation motor and a processor. The transparent display device has at least one display plane. The rotation motor is configured to drive the transparent display device to rotate along an axis. The processor is coupled to the transparent display device and the rotation motor, and configured to retrieve a three-dimensional virtual image, cut multiple cutting images adapted to be displayed at multiple locations of each display plane after a rotation from the three-dimensional virtual image, and calculate a current location of each display plane during the rotation according to the driving of the rotation motor to control the transparent display device to display the cutting image corresponding to the current location on each display plane.

Abstract: A display device with sensing element includes a substrate having a disposing surface, a plurality of display elements, at least one sensing element, and at least one lighting adjustment element. The display elements are disposed above the disposing surface to present an image. The at least one sensing element disposed above the disposing surface to sense a light brightness projected toward either side of the substrate. The at least one light adjustment element is in signal transmittable connection with the display elements and the at least one sensing element. The at least one light adjustment element adjusts a plurality of control signals inputted into the display elements to determine a contrast of the image.

Abstract: A device and a method for generating floating images are provided. An optical imaging module generates a first floating image. A sensing module sends a detection signal to sense first position information of a tested object at a first time point, and generates a feedback signal according to the first position information when the first position information is within a contour range of the first floating image. A signal processing module is electrically connected to the optical imaging module and the sensing module to receive the feedback signal and generate at least one control command and/or at least one feedback command corresponding to the feedback signal. The at least one control command is transmitted to a controller to perform corresponding control on the controller, and the at least one feedback command is transmitted to the optical imaging module, so that the optical imaging module generates a second floating image different from the first floating image.