Abstract: A solid electrolytic capacitor having grooves provided in a valve-acting metal substrate that includes a porous surface part and a non-porous body part, the bottoms of the grooves being non-porous. The valve-acting metal substrate is divided into a plurality of unit regions by the grooves, and define cathode layer formation parts in the porous surface parts for each unit region. A dielectric layer covers the surfaces of the cathode layer formation parts of the valve-acting metal substrate and the grooves between the cathode layer formation parts. A solid electrolyte layer and a cathode extraction layer cover the surface of the dielectric layer, thereby providing a sheet in which a plurality of solid electrolytic capacitor elements are prepared integrally with the grooves interposed therebetween. The sheet is cut at the grooves, and a dielectric layer is formed on the cut surfaces located around the cathode layer formation parts.

Abstract: A solid electrolytic capacitor having grooves provided in a valve-acting metal substrate that includes a porous surface part and a non-porous body part, the bottoms of the grooves being non-porous. The valve-acting metal substrate is divided into a plurality of unit regions by the grooves, and define cathode layer formation parts in the porous surface parts for each unit region. A dielectric layer covers the surfaces of the cathode layer formation parts of the valve-acting metal substrate and the grooves between the cathode layer formation parts. A solid electrolyte layer and a cathode extraction layer cover the surface of the dielectric layer, thereby providing a sheet in which a plurality of solid electrolytic capacitor elements are prepared integrally with the grooves interposed therebetween. The sheet is cut at the grooves, and a dielectric layer is formed on the cut surfaces located around the cathode layer formation parts.

Abstract: A solid electrolytic capacitor having grooves provided in a valve-acting metal substrate that includes a porous surface part and a non-porous body part, the bottoms of the grooves being non-porous. The valve-acting metal substrate is divided into a plurality of unit regions by the grooves, and define cathode layer formation parts in the porous surface parts for each unit region. A dielectric layer covers the surfaces of the cathode layer formation parts of the valve-acting metal substrate and the grooves between the cathode layer formation parts. A solid electrolyte layer and a cathode extraction layer cover the surface of the dielectric layer, thereby providing a sheet in which a plurality of solid electrolytic capacitor elements are prepared integrally with the grooves interposed therebetween. The sheet is cut at the grooves, and a dielectric layer is formed on the cut surfaces located around the cathode layer formation parts.

Abstract: A solid electrolytic capacitor that includes: a laminated body having a plurality of capacitor elements stacked to have principal surfaces thereof overlapped with each other. The capacitor elements each include a valve-action metallic substrate having two principal surfaces opposed to each other, a dielectric oxide film covering a surface of the valve-action metallic substrate, and a cathode layer covering a surface of the dielectric oxide film. The laminated body has two principal surfaces and more than one side surface, and has at least one of the side surfaces with the valve-action metallic substrates exposed. An anode terminal is electrically connected to the side surface of the laminated body having the valve-action metallic substrates exposed therefrom, and the cathode layers and the anode terminal are insulated with insulators interposed therebetween, the insulators being obtained from the cathode layers.

Abstract: A solid electrolytic capacitor that includes: a laminated body having a plurality of capacitor elements stacked to have principal surfaces thereof overlapped with each other. The capacitor elements each include a valve-action metallic substrate having two principal surfaces opposed to each other, a dielectric oxide film covering a surface of the valve-action metallic substrate, and a cathode layer covering a surface of the dielectric oxide film. The laminated body has two principal surfaces and more than one side surface, and has at least one of the side surfaces with the valve-action metallic substrates exposed. An anode terminal is electrically connected to the side surface of the laminated body having the valve-action metallic substrates exposed therefrom, and the cathode layers and the anode terminal are insulated with insulators interposed therebetween, the insulators being obtained from the cathode layers.

Abstract: A solid electrolytic capacitor that includes a laminated body, a solid electrolyte layer, and conductive bases. The laminated body is obtained by laminating a plurality of dielectric-coated valve action metal sheets, each of which includes a valve action metal base and a dielectric coating, and joining together the adjacent valve action metal bases. The valve action metal base has a cathode layer part, and the dielectric coating covers the surface of the valve action metal base at least the cathode layer part. The valve action metal base of at least one of the dielectric-coated valve action metal sheets further has an anode lead part. The solid electrolyte layer is a continuous layer that fills gaps between the dielectric-coated valve action metal sheets and covers the outer surface of the laminated body at the cathode layer parts, and conductive bases are provided in the solid electrolyte layer.

Abstract: A solid electrolytic capacitor having grooves provided in a valve-acting metal substrate that includes a porous surface part and a non-porous body part, the bottoms of the grooves being non-porous. The valve-acting metal substrate is divided into a plurality of unit regions by the grooves, and define cathode layer formation parts in the porous surface parts for each unit region. A dielectric layer covers the surfaces of the cathode layer formation parts of the valve-acting metal substrate and the grooves between the cathode layer formation parts. A solid electrolyte layer and a cathode extraction layer cover the surface of the dielectric layer, thereby providing a sheet in which a plurality of solid electrolytic capacitor elements are prepared integrally with the grooves interposed therebetween. The sheet is cut at the grooves, and a dielectric layer is formed on the cut surfaces located around the cathode layer formation parts.

Abstract: An in-liquid-substance detection sensor that achieves size reduction and detection accuracy improvement includes a piezoelectric substrate, at least two SAW devices provided on one major surface of the piezoelectric substrate and each having at least one IDT electrode defining a sensing portion, outer electrodes provided on the other major surface of the piezoelectric substrate and electrically connected to the SAW devices through vias extending through the piezoelectric substrate, a channel-defining member provided on the one major surface of the piezoelectric substrate so as to surround the SAW devices and a region connecting the SAW devices to each other, thereby defining sidewalls of a channel, and a protective member bonded to the one major surface of the piezoelectric substrate with the channel-defining member interposed therebetween, thereby sealing the channel, the protective member having at least two through holes communicating with the channel.

Abstract: A solid electrolytic capacitor that includes a laminated body, a solid electrolyte layer, and conductive bases. The laminated body is obtained by laminating a plurality of dielectric-coated valve action metal sheets, each of which includes a valve action metal base and a dielectric coating, and joining together the adjacent valve action metal bases. The valve action metal base has a cathode layer part, and the dielectric coating covers the surface of the valve action metal base at least the cathode layer part. The valve action metal base of at least one of the dielectric-coated valve action metal sheets further has an anode lead part. The solid electrolyte layer is a continuous layer that fills gaps between the dielectric-coated valve action metal sheets and covers the outer surface of the laminated body at the cathode layer parts, and conductive bases are provided in the solid electrolyte layer.

Abstract: An ignition element mounting capacitor having an ignition element mounted on a capacitor, includes therein a first capacitor section and a second capacitor section, and first external terminal electrodes electrically connected to the first capacitor section and second external terminal electrodes electrically connected to the second capacitor section. The first capacitor section has a capacity for igniting ignition powder, and the second capacitor section has a function for removing noise which affects external circuits. Further, provided on the surface of the capacitor are third external terminal electrodes electrically connected to the ignition element.

Abstract: An ignition element mounting capacitor having an ignition element mounted on a capacitor, includes therein a first capacitor section and a second capacitor section, and first external terminal electrodes electrically connected to the first capacitor section and second external terminal electrodes electrically connected to the second capacitor section. The first capacitor section has a capacity for igniting ignition powder, and the second capacitor section has a function for removing noise which affects external circuits. Further, provided on the surface of the capacitor are third external terminal electrodes electrically connected to the ignition element.

Abstract: An in-liquid-substance detection sensor that achieves size reduction and detection accuracy improvement includes a piezoelectric substrate, at least two SAW devices provided on one major surface of the piezoelectric substrate and each having at least one IDT electrode defining a sensing portion, outer electrodes provided on the other major surface of the piezoelectric substrate and electrically connected to the SAW devices through vias extending through the piezoelectric substrate, a channel-defining member provided on the one major surface of the piezoelectric substrate so as to surround the SAW devices and a region connecting the SAW devices to each other, thereby defining sidewalls of a channel, and a protective member bonded to the one major surface of the piezoelectric substrate with the channel-defining member interposed therebetween, thereby sealing the channel, the protective member having at least two through holes communicating with the channel.

Abstract: There are provided an electronic component in which two substrates are bonded to each other with a large bonding force and a method for manufacturing electronic components in which two substrates can be bonded to each other with a large bonding force and in which the substrates are not likely to be bent and broken. In an embodiment, a plurality of first connection portions 30 is formed on a first substrate 22, and in addition, a plurality of IDT electrodes 26 and a plurality of second connection portions 32 are formed on a second substrate 24. The first connection portions 30 are engaged in concave parts of the second connection portions 32, so that temporary bonding is performed. Between adjacent first connection portions 30, only the first substrate is cut. By heat application, laser irradiation, pressure application, ultrasonic application, or the like, the first connection portions 30 and the second connection portions 32 are finally bonded to each other.

Abstract: A method of wiring formation includes forming a feeder film partially on a substrate, forming on the substrate a plating base film via a physical film making method so that the plate base film partially overlaps the feeder film, forming a plated wiring on the plating base film using an electrolytic plating, and selectively removing at least an area of the feeder film which is exposed from the plated wiring, using a wet etching process.

Abstract: A piezoelectric device includes an element substrate having a piezoelectric element and an electrically conductive pattern connected to the piezoelectric element, a supporting layer arranged within the periphery of the piezoelectric element, a cover extending so as to provide a groove inside the external periphery of the element substrate, the groove ranging over the entire external periphery of the element substrate by removing a portion of the cover and/or supporting layer inside the external periphery of the element substrate after the cover is arranged on the supporting layer, an insulating reinforcing material that entirely covers portions of the element substrate ranging from the cover to the periphery of a principal surface of the element substrate, and an electrically conductive member electrically connected to the electrically conductive pattern so as to pass through the cover and the reinforcing material.

Abstract: A SAW device includes a SAW element having an IDT and a conductive pad connected to the IDT provided on a piezoelectric substrate, and an external terminal. The SAW device also includes an insulating layer having an exciting portion protective opening defining a space for protecting a SAW-exciting portion including the IDT and a conductive opening. The external terminal is connected to the conductive pad through a wiring extending in the conductive opening.

Abstract: A piezoelectric device includes an element substrate having a piezoelectric element and an electrically conductive pattern connected to the piezoelectric element, a supporting layer arranged within the periphery of the piezoelectric element, a cover extending so as to provide a groove inside the external periphery of the element substrate, the groove ranging over the entire external periphery of the element substrate by removing a portion of the cover and/or supporting layer inside the external periphery of the element substrate after the cover is arranged on the supporting layer, an insulating reinforcing material that entirely covers portions of the element substrate ranging from the cover to the periphery of a principal surface of the element substrate, and an electrically conductive member electrically connected to the electrically conductive pattern so as to pass through the cover and the reinforcing material.

Abstract: A surface acoustic wave device includes a SAW having an IDT disposed on a piezoelectric substrate, a conductive pad connected to the IDT, and a bonding substrate, wherein the SAW is bonded to the bonding substrate such that a protective space of the IDT is provided. The bonding substrate includes a through-hole in which an external terminal connection member connected to the conductive pad and an external terminal are disposed. The SAW is bonded to the bonding substrate by an adhesive layer including a solder layer.

Abstract: A surface acoustic wave device includes a SAW element having an IDT provided on a piezoelectric substrate and electroconductive pads connected to the IDT, and a bonding substrate having electroconductive pad through holes bonded by an adhesive layer so as to face the IDT. A protective space is provided by an excitation portion protecting hollow structure for protecting a surface acoustic wave excitation portion. External terminals connected to the electroconductive pads via the electroconductive pad through holes are at disposed at positions offset from the electroconductive pad through holes.

Abstract: A method of wiring formation includes forming a feeder film partially on a substrate, forming on the substrate a plating base film via a physical film making method so that the plate base film partially overlaps the feeder film, forming a plated wiring on the plating base film using an electrolytic plating, and selectively removing at least an area of the feeder film which is exposed from the plated wiring, using a wet etching process.