Patents by Inventor Yoshihiro Koshido

Yoshihiro Koshido has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of wiring formation and method for manufacturing electronic components
    Publication number: 20010008225
    Abstract: A method of wiring formation includes forming a feeder film partially on a substrate, forming on the substrate a plating base film via a physical film making method so that the plate base film partially overlaps the feeder film, forming a plated wiring on the plating base film using an electrolytic plating, and selectively removing at least an area of the feeder film which is exposed from the plated wiring, using a wet etching process.
    Type: Application
    Filed: January 17, 2001
    Publication date: July 19, 2001
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Yoshiyuki Tonami, Yoshihiro Koshido
  • Method for producing an electronic device
    Patent number: 6204190
    Abstract: A method for producing an electronic device, comprises the steps of: depositing a thin film on a substrate; etching a portion of the thin film by a reactive ion etching so as to leave a remaining portion of the thin film behind; and removing the remaining thin film by a physical etching using an inert gas.
    Type: Grant
    Filed: July 16, 1999
    Date of Patent: March 20, 2001
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yoshihiro Koshido
  • Method of forming dielectric thin film pattern and method of forming laminate pattern comprising dielectric thin film and conductive thin film
    Patent number: 6156672
    Abstract: A method of forming a dielectric thin film pattern, comprises the steps of: depositing a dielectric thin film on a substrate having a resist pattern thereon by a vapor deposition method, wherein as a material for the dielectric thin film, at least one of CeO.sub.2, Sm.sub.2 O.sub.3, Dy.sub.2 O.sub.3, Y.sub.2 O.sub.3, TiO.sub.2, Al.sub.2 O.sub.3, and MgO is used; and removing the resist pattern whereby the dielectric thin film is patterned.
    Type: Grant
    Filed: November 19, 1999
    Date of Patent: December 5, 2000
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshihiro Koshido, Kei Fujibayashi, Yuji Toyota, Tadayuki Okawa, Ryoichiro Takahashi