Patents by Inventor Yoshikatsu Ishizuki

Yoshikatsu Ishizuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composition of epoxy group-containing cycloolefin resin
    Patent number: 5783639
    Abstract: A resin composition comprising an epoxy group-containing cycloolefin resin and a crosslinking agent is provided. More specifically, a resin composition comprising an epoxy group-containing thermoplastic norbornene resin obtained by introducing epoxy groups into a thermoplastic norbornene resin, and as the crosslinking agent, a curing agent for epoxy resins or a photoreactive substance is provided. The resin composition is suitable for use as an insulating material.
    Type: Grant
    Filed: January 13, 1997
    Date of Patent: July 21, 1998
    Assignees: Nipon Zeon Co., Ltd., Fujitsu Limited
    Inventors: Hideaki Kataoka, Eiko Yuda, Shigemitsu Kamiya, Masahide Yamamoto, Yoshikatsu Ishizuki, Yasuhiro Yoneda, Daisuke Mizutani, Kishio Yokouchi
  • Photosensitive polyimide resin composition
    Patent number: 5777068
    Abstract: Provided are photosensitive resin compositions comprising a polyamic compound having, at each terminal thereof, a specific actinic ray-sensitive functional group which has substituent groups each having a photopolymerizable carbon-carbon double bond, a photosensitive auxiliary having a photopolymerizable functional group and a solvent. The photosensitive resin compositions of the invention are excellent in resist properties such as sensitivity and good in storage stability and can provide a film small in residual stress.
    Type: Grant
    Filed: September 12, 1995
    Date of Patent: July 7, 1998
    Assignees: Nippon Zeon Co., Ltd., Fujitsu Limited
    Inventors: Akira Tanaka, Satoshi Tazaki, Kei Sakamoto, Yasuhiro Yoneda, Kishio Yokouchi, Daisuke Mizutani, Yoshikatsu Ishizuki
  • Method of manufacturing polyimide multilayer printed wiring boards
    Patent number: 5429709
    Abstract: An etching process of a conductive layer in manufacturing polyimide multilayer printed wiring boards comprises the steps of dipping in an alkali aqueous solution for patterning the conductive layer, dipping in an acid aqueous solution for neutralizing the alkali residue, and washing with water thereby washing off the alkali residue. A curing process for each of polyimide layers is controlled so as to obtain a polyimide conversion ratio ranging between 60% and 100% after an initial curing process, and to obtain a polyimide conversion ratio close to 100% after formation of an uppermost polyimide layer.
    Type: Grant
    Filed: April 15, 1994
    Date of Patent: July 4, 1995
    Assignee: Fujitsu Limited
    Inventors: Daisuke Mizutani, Yoshikatsu Ishizuki
  • Excimer laser processing method and apparatus
    Patent number: 5386430
    Abstract: An excimer laser ablation processing for forming via holes in a resin film by irradiation of an excimer laser wherein, the emission of light caused during the decomposition of the resin during the processing is detected, its intensity is measured, and the endpoint of the processing is judged or a comparison is made of the positions of light emission and the design positions for processing to examine for the presence of defects. Provision is made of a means for measuring the intensity and a means for judging the endpoint of the processing from the changes in the intensity of light emission during the processing.
    Type: Grant
    Filed: July 16, 1993
    Date of Patent: January 31, 1995
    Assignee: Fujitsu Limited
    Inventors: Yasuo Yamagishi, Kanae Shimizu, Daisuke Mizutani, Tamotsu Owada, Yoshikatsu Ishizuki, Hideya Hashii