Abstract: A method for producing a compound represented by formula (C) wherein R1 represents an amino group protected with a protecting group, the method comprising a step of subjecting a compound represented by formula (B) wherein R1 represents the same meaning as above, to intramolecular cyclization to convert the compound into the compound represented by formula (C).

Abstract: A photocoupler of an embodiment includes an input terminal, an output terminal, a first MOSFET, a second MOSFET, a semiconductor light receiving element, a semiconductor light emitting element, and a resin layer. The first MOSFET is joined onto the third lead. The second MOSFET is joined onto the fourth lead. The semiconductor light receiving element is joined to each of the first junction region and the second junction region. The semiconductor light receiving element includes a light receiving region provided in a central part of a surface on opposite side from a surface joined to the first and second MOSFET. The resin layer seals the first and second MOSFETs, the semiconductor light receiving element, the semiconductor light emitting element, an upper surface and a side surface of the input terminal, and an upper surface and a side surface of the output terminal.

Abstract: An optical coupling device includes a light receiving element provided with a first output terminal and a second output terminal, a light emitting element provided on the light receiving element, a first switching element, a first electrode plate, and a sealing member. The first switching element is provided side by side on the light receiving element. A first main terminal and a control terminal are provided on an upper surface of the first switching element. A second main terminal is provided on a lower surface of the first switching element. The first main terminal is connected to the first output terminal. The control terminal is connected to the second output terminal. An upper surface of the first electrode plate is connected to the second main terminal. The sealing member covers the light receiving element, the light emitting element, and the first switching element.

Abstract: A semiconductor device includes a light-emitting element, a light-receiving element, an input-side terminal, a first switching element, a first lead and a resin package. The first lead includes a first mount bed and a first output-side terminal, the first switching element being mounted on the first mount bed. The resin package seals the light-emitting element, the light-receiving element, and the first switching element. The resin package includes first and second side surfaces opposite to each other. The input-side terminal protrudes from the first side surface. The first output-side terminal protrudes from the second side surface. The first switching element is sealed at a center between the first and second side surfaces. The first mount bed is arranged in a direction along the second side surface so that a side surface of the first mount bed is positioned between a center of the resin package and the first output-side terminal.

Abstract: An optical coupling device includes a light receiving element provided with a first output terminal and a second output terminal, a light emitting element provided on the light receiving element, a first switching element, a first electrode plate, and a sealing member. The first switching element is provided side by side on the light receiving element. A first main terminal and a control terminal are provided on an upper surface of the first switching element. A second main terminal is provided on a lower surface of the first switching element. The first main terminal is connected to the first output terminal. The control terminal is connected to the second output terminal. An upper surface of the first electrode plate is connected to the second main terminal. The sealing member covers the light receiving element, the light emitting element, and the first switching element.

Abstract: A photocoupler of an embodiment includes an input terminal, an output terminal, a first MOSFET, a second MOSFET, a semiconductor light receiving element, a semiconductor light emitting element, and a resin layer. The first MOSFET is joined onto the third lead. The second MOSFET is joined onto the fourth lead. The semiconductor light receiving element is joined to each of the first junction region and the second junction region. The semiconductor light receiving element includes a light receiving region provided in a central part of a surface on opposite side from a surface joined to the first and second MOSFET. The resin layer seals the first and second MOSFETs, the semiconductor light receiving element, the semiconductor light emitting element, an upper surface and a side surface of the input terminal, and an upper surface and a side surface of the output terminal.

Abstract: A mechanical pencil includes: a barrel; a cushion spring that has a rear end supported by the barrel; a sleeve that is biased forward in an axial direction by the cushion spring and movable in a direction perpendicular to the axial direction by an impact applied from outside of the barrel in an elastically supported state; a chuck spring that has a front end supported by the sleeve; a chuck that chucks a writing lead for a mechanical pencil; a writing lead tube that is fitted to the chuck and biased rearward in the axial direction together with the chuck by the chuck spring; and a contact sliding part that suppresses movement of the sleeve in the direction perpendicular to the axial direction.

Abstract: A photocoupler of an embodiment comprises an insulating substrate, a semiconductor light receiving element, a semiconductor light emitting element, an input terminal, an output terminal, a resin molded body, and an antistripping material. The semiconductor light receiving element includes a light receiving region, a first electrode, and a second electrode. The semiconductor light emitting element includes a first and a second electrode, and emits emission light. The input terminal includes a first and a second conductive region. The output terminal includes a third and a fourth conductive region. The resin molded body is provided on the upper surface of the insulating substrate, the input terminal, the output terminal, the semiconductor light receiving element, and the semiconductor light emitting element. The antistripping material bonds a lower surface of the resin molded body to the input terminal and a lower surface of the resin molded body to the output terminal.

Abstract: A mechanical pencil according to an embodiment includes a barrel; and a chucking/feed-out mechanism chucking and feeding out a writing lead for a mechanical pencil, the chucking/feed-out mechanism configured to include a chuck, a chuck ring, and a chuck spring and being substantially housed in the barrel, wherein the barrel has a first level difference on an inner circumferential surface thereof, the chucking/feed-out mechanism has a second level difference opposing the first level difference, and when a prescribed load in an axial direction is applied to the writing lead for a mechanical pencil, the first level difference and the second level difference engage with each other in the axial direction to reduce an output of the chuck spring with respect to the chucking/feed-out mechanism and relax the chuck on the writing lead for a mechanical pencil by the chuck and the chuck ring.

Abstract: A writing instrument according to an embodiment of the invention including, a chuck that chucks a writing lead, wherein the chuck includes a first chuck pawl which comes into point contact or line contact with the writing lead to press the writing lead so as to apply first contact stress to the writing lead; and a second chuck pawl which presses the writing lead so as to apply, to the writing lead, second contact stress that is lower than the first contact stress, and the first contact stress is configured such that, when a prescribed impact is applied to the writing lead, a contact portion of the writing lead subjected to the first contact stress fractures and absorbs the prescribed impact.

Abstract: A writing instrument according to an embodiment of the invention including, a chuck that chucks a writing lead, wherein the chuck includes a first chuck pawl which comes into point contact or line contact with the writing lead to press the writing lead so as to apply first contact stress to the writing lead; and a second chuck pawl which presses the writing lead so as to apply, to the writing lead, second contact stress that is lower than the first contact stress, and the first contact stress is configured such that, when a prescribed impact is applied to the writing lead, a contact portion of the writing lead subjected to the first contact stress fractures and absorbs the prescribed impact.

Abstract: A mechanical pencil according to an embodiment includes: a barrel; a cushion spring that has a rear end supported by the barrel; a sleeve that is biased forward in an axial direction by the cushion spring and movable in a direction perpendicular to the axial direction by an impact applied from outside of the barrel in an elastically supported state; a chuck spring that has a front end supported by the sleeve; a chuck that chucks a writing lead for a mechanical pencil; a writing lead tube that is fitted to the chuck and biased rearward in the axial direction together with the chuck by the chuck spring; and a contact sliding part that suppresses movement of the sleeve in the direction perpendicular to the axial direction.

Abstract: A writing instrument according to an embodiment of the invention including, a chuck that chucks a writing lead, wherein the chuck includes a first chuck pawl which comes into point contact or line contact with the writing lead to press the writing lead so as to apply first contact stress to the writing lead; and a second chuck pawl which presses the writing lead so as to apply, to the writing lead, second contact stress that is lower than the first contact stress, and the first contact stress is configured such that, when a prescribed impact is applied to the writing lead, a contact portion of the writing lead subjected to the first contact stress fractures and absorbs the prescribed impact.

Abstract: A liquid applying tool which can create pressurizing action with a simple structure and without any labor at the time of using the liquid applying tool, and allows liquid to be smoothly fed to a tip end of a liquid applicator member with the assistance of the pressurizing action.

Abstract: A light-emitting device includes a semiconductor light-emitting element, for example, a light emitting diode. A first metal member includes a first metal plate and a first metal layer between the semiconductor light-emitting element and a first surface of the first metal plate. An insulating layer contacts a second surface of the first metal plate. The second surface is in a second plane that intersects a first plane of the first surface.

Abstract: A mounting member includes: an insulating substrate, a first die pad unit, first and second terminals. The insulating substrate has a rectangular first surface, a second surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. A through hole is provided from the first surface to the second surface. The first die pad unit is provided on the first surface. The first terminal has a conductive region covering the first side surface, the first surface, and the second surface. The second terminal has a conductive region covering the second side surface and the second surface, connected to the first die pad unit by conductive material provided in the through hole or on a side wall of the through hole. The first die pad unit, the first terminal, and the second terminal are apart from one another.

Abstract: A light-emitting device includes a semiconductor light-emitting element, for example, a light emitting diode. A first metal member includes a first metal plate and a first metal layer between the semiconductor light-emitting element and a first surface of the first metal plate. An insulating layer contacts a second surface of the first metal plate. The second surface is in a second plane that intersects a first plane of the first surface.

Abstract: A mounting member includes: an insulating substrate, a first die pad unit, first and second terminals. The insulating substrate has a rectangular first surface, a second surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. A through hole is provided from the first surface to the second surface. The first die pad unit is provided on the first surface. The first terminal has a conductive region covering the first side surface, the first surface, and the second surface. The second terminal has a conductive region covering the second side surface and the second surface, connected to the first die pad unit by conductive material provided in the through hole or on a side wall of the through hole. The first die pad unit, the first terminal, and the second terminal are apart from one another.

Abstract: A mounting member includes: an insulating substrate, a first die pad unit, first and second terminals. The insulating substrate has a rectangular first surface, a second surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. A through hole is provided from the first surface to the second surface. The first die pad unit is provided on the first surface. The first terminal has a conductive region covering the first side surface, the first surface, and the second surface. The second terminal has a conductive region covering the second side surface and the second surface, connected to the first die pad unit by conductive material provided in the through hole or on a side wall of the through hole. The first die pad unit, the first terminal, and the second terminal are apart from one another.

Abstract: A photocoupler includes: a support substrate; a MOSFET; a light receiving element; a light emitting element; and a bonding layer. The support substrate includes an insulating layer, input and output terminals. The MOSFET is bonded to the support substrate. The MOSFET has a first surface having an operation region. The light receiving element includes p-n junction and is bonded to the MOSFET. The light receiving element has first and second surfaces. The first surface includes a light reception region, a first electrode, and a second electrode. The light emitting element is connected to the input terminal. The light emitting element has first and second surfaces. The first surface includes first and second electrodes. The second surface has a light emitting region. The bonding layer is configured to bond the light emitting element to the light reception region.