Patents by Inventor Young-Do Kweon

Young-Do Kweon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating a package substrate
    Patent number: 8951835
    Abstract: A method of fabricating a package substrate, includes forming a cavity in at least one region of an upper surface of a wafer, the cavity including a chip mounting region, forming a through-hole penetrating through the wafer and a via filling the through-hole, forming a first wiring layer and a second wiring layer spaced apart from the first wiring layer, which are extended into the cavity, and mounting a chip in the cavity to be connected to the first wiring layer and the second wiring layer.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: February 10, 2015
    Assignees: Samsung Electro-Mechanics Co., Ltd., Sungkyunkwan University Foundation for Corporate Collaboration
    Inventors: Seung Wook Park, Young Do Kweon, Jang Hyun Kim, Tae Seok Park, Su Jeong Suh, Jae Gwon Jang, Nam Jung Kim, Seung Kyu Lim, Kwang Keun Lee
  • Method of manufacturing a capacitor-embedded printed circuit board
    Patent number: 8943685
    Abstract: A method of manufacturing a capacitor-embedded printed circuit board using a first conductive layer formed on one side of an insulation layer, the method including: forming a second conductive layer on one side of the first conductive layer; forming a second electrode by removing a portion of the second conductive layer; forming a first electrode by removing a portion of the first conductive layer in correspondence with the second electrode; and forming a dielectric layer on one side of the second electrode.
    Type: Grant
    Filed: October 19, 2010
    Date of Patent: February 3, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young Do Kweon, Sung Yi, Hong-Won Kim
  • PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
    Publication number: 20150000958
    Abstract: The present invention discloses a printed circuit board including a lower wiring layer, an insulating layer which buries the lower wiring layer, and an upper wiring layer formed on the insulating layer to improve reliability of interlayer electrical connection between the wiring layers, wherein the interlayer connection between the upper wiring layer and the lower wiring layer is performed by a via electrode which is provided between the upper wiring layer and the lower wiring layer and has an upper surface bonded to the upper wiring layer and a lower surface bonded to the lower wiring layer, wherein the lower surface of the via electrode is larger than the upper surface thereof.
    Type: Application
    Filed: November 7, 2013
    Publication date: January 1, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyoung Moo HARR, Hyung Jin JEON, Jin Gu KIM, Young Jae LEE, Young Do KWEON, Chang Bae LEE
  • Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
    Patent number: 8922002
    Abstract: Microelectronic devices and method of forming a plurality of microelectronic devices on a semiconductor workpiece are disclosed herein. One such method includes placing a plurality of first interconnect elements on a side of a semiconductor workpiece, forming a layer on the side of the workpiece, reshaping the first interconnect elements by heating the first interconnect elements, and coupling a first portion of a plurality of individual second interconnect elements to corresponding first interconnect elements with a second portion of the individual second interconnect elements exposed.
    Type: Grant
    Filed: June 8, 2010
    Date of Patent: December 30, 2014
    Assignee: Micron Technology, Inc.
    Inventors: Young Do Kweon, Tongbi Jiang
  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140345916
    Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board according to a preferred embodiment of the present invention includes a base substrate; a through via formed to penetrate through the base substrate; and circuit patterns formed on one side and the other side of the base substrate and formed to be thinner than an inner wall of the through via.
    Type: Application
    Filed: January 30, 2014
    Publication date: November 27, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Wook Park, Young Do Kweon, Jin Gu Kim
  • PRINTED CIRCUIT BOARD
    Publication number: 20140338955
    Abstract: Disclosed herein is a printed circuit board. According to a preferred embodiment of the present invention, the printed circuit board, includes: a base board; an upper build-up layer which is formed on the base board and includes an upper insulating layer and an upper circuit layer having at least one layer; and a lower build-up layer which is formed beneath the base board, has a different thickness from the upper build-up layer, and includes a lower insulating layer and a lower circuit layer having at least one layer.
    Type: Application
    Filed: December 2, 2013
    Publication date: November 20, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Mi Jin Park, Jeong Ho Lee, Young Nam Hwang, Young Do Kweon
  • COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140333406
    Abstract: The present invention relates to a common mode filter. A common mode filter in accordance with the present invention includes a magnetic substrate formed of a magnetic ceramic material; a first coil pattern and a second coil pattern sequentially formed on the magnetic substrate; an external electrode laminated on the second coil pattern; a via for connecting the first coil pattern and the second coil pattern; and a second insulating layer formed between the first coil pattern and the second coil pattern, wherein the height of the second insulating layer is 5 ?m to 20 ?m while being proportional to the height of the via and thus it is possible to improve SRF and insertion loss characteristics by adjusting the height of the second insulating layer.
    Type: Application
    Filed: May 6, 2014
    Publication date: November 13, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Hyuck YANG, Kang Heon HUR, Sung Kwon WI, Ho Jin YUN, Hye Won BANG, Young Do KWEON, Won Chul SIM
  • THIN FILM CHIP DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20140320251
    Abstract: Disclosed herein is a thin film chip device, including: a substrate; a circuit layer disposed on the substrate and having coil patterns; and a functional layer formed on the circuit layer and having an embossed shape.
    Type: Application
    Filed: April 23, 2014
    Publication date: October 30, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Hyuck YANG, Young Seuck YOO, Jeong Min CHO, Ji Hoon PARK, Kyong Bok MIN, Young Do KWEON, Jong Yun LEE
  • COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140313005
    Abstract: Disclosed herein is a common mode filter capable of increasing a thickness of the coil electrode in a more simple and stable scheme. The common mode filter includes: a magnetic substrate; a coil electrode formed on one surface of the magnetic substrate and enclosed by an insulating resin; and external electrode terminals connected to both ends of the coil electrode, wherein the coil electrode includes a first metal pattern layer and a second metal pattern layer formed on the first metal pattern layer by performing electroplating using the first metal pattern layer as a lead wire.
    Type: Application
    Filed: April 17, 2014
    Publication date: October 23, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Won BANG, Young Seuck YOO, Young Do KWEON, Sung Kwon WI, Kang Heon HUR
  • ESD PROTECTION MATERIAL AND ESD PROTECTION DEVICE USING THE SAME
    Publication number: 20140301002
    Abstract: Disclosed herein are an electrostatic discharge protection material for improving connectivity between conductive particles dispersed in a resin matrix and evenly distributing the conductive particles in the resin material, and an electrostatic discharge protection device using the same. The electrostatic discharge protection material includes a resin matrix; needle-shaped conductive particles dispersed in the resin matrix; and dispersion particles dispersed in the resin matrix, wherein the dispersion particles are located between the needle-shaped conductive particles.
    Type: Application
    Filed: April 8, 2014
    Publication date: October 9, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong Ryul LEE, Kang-Heon Hur, Sang Moon Lee, Young Do Kweon, Young Seuck Yoo
  • POWER INDUCTOR AND MANUFACTURING METHOD THEREOF
    Publication number: 20140292469
    Abstract: Disclosed herein is a power inductor including: an opening part penetrating through the insulating layer; an upper coil electrode pattern formed on an upper surface of the insulating layer and having a form in which it is wound around the opening part; a lower coil electrode pattern formed on a lower surface of the insulating layer and having a form in which it is wound around the opening part; and metal layers plated on a surface of the innermost pattern of the upper coil electrode pattern and a surface of the innermost pattern of the lower coil electrode pattern, wherein the metal layers plated on the surfaces of the innermost patterns of the upper and lower coil electrode patterns are extended to an inner wall of the opening part to thereby be connected to each other.
    Type: Application
    Filed: January 27, 2014
    Publication date: October 2, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Yeon CHA, Hwan Soo LEE, Moon Soo PARK, Young Do KWEON
  • INDUCTOR AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20140285305
    Abstract: The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: an insulating layer having a hole; a conductive pattern disposed on both surfaces of the insulating layer and having a structure in which portions disposed on the both surfaces are electrically connected to each other through the hole; and a magnetic layer disposed on the insulating layer to cover the conductive pattern, wherein the conductive pattern has a plating pattern formed by performing a plating process.
    Type: Application
    Filed: March 24, 2014
    Publication date: September 25, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Seuck YOO, Kang Heon HUR, Jin Hyuck YANG, Sung Kwon WI, Jong Yun LEE, Young Do KWEON
  • INDUCTOR AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20140285304
    Abstract: Disclosed herein is an inductor including: a core layer having a conductive pattern formed on a surface thereof and having a through-hole formed at a region in which the conductive pattern is not formed; and a magnetic layer covering the core layer, wherein the magnetic layer includes: a filled part filled in the through-hole and having high magnetic material filling density; and a cover part covering the surface of the core layer and having magnetic material filling density lower than that of the filled part.
    Type: Application
    Filed: October 15, 2013
    Publication date: September 25, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Seuck YOO, Young Do KWEON, Kang Heon HUR, Jin Hyuck YANG, Sung Kwon WI, Jong Yun LEE
  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140251657
    Abstract: Embodiments of the invention provide a printed circuit board, including a base member, an insulating layer formed on each of both surfaces of the base member so that the surfaces of the base member are flattened, a circuit layer formed on the insulating layer, and a via for connecting the circuit layer formed on one surface of the base member with the circuit layer formed on the other surface of the base member. A method of manufacturing the printed circuit board is also provided.
    Type: Application
    Filed: May 19, 2014
    Publication date: September 11, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyung Jin JEON, Young Do KWEON, Seung Wook PARK, Seon Hee MOON
  • Interposer-embedded printed circuit board
    Patent number: 8830689
    Abstract: Disclosed herein is an interposer-embedded printed circuit board, including: a substrate including a cavity formed in one side thereof and having a predetermined height in a thickness direction of the substrate; an interposer disposed in the cavity and including a wiring region and an insulating region; and a circuit layer formed in the substrate and including a connection pattern connected with one side of the wiring region. The interposer-embedded printed circuit board is advantageous in that an interposer is embedded in a substrate, so that the thickness of a semiconductor package can be reduced, thereby keeping up with the trend of slimming the semiconductor package.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: September 9, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Gu Kim, Mi Jin Park, Young Ho Kim, Seung Wook Park, Hee Kon Lee, Young Do Kweon
  • POWER INDUCTOR AND MANUFACTURING METHOD THEREOF
    Publication number: 20140247101
    Abstract: Disclosed herein are a power inductor in which aspect ratios of the innermost pattern and the outermost pattern are similar with those of the intermediate pattern and a manufacturing method thereof. The power inductor includes coil patterns formed on one surface or both surfaces of a core insulating layer; insulating patterns bonded to at least one of an innermost pattern and an outermost pattern of the coil patterns; metal layers plated on surfaces of the coil patterns; and an insulator covering the coil patterns including the metal layers.
    Type: Application
    Filed: February 7, 2014
    Publication date: September 4, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS, CO., LTD.
    Inventors: Hye Yeon CHA, Young Do KWEON, Young Seuck YOO, Hwan Soo LEE, Woon Chul CHOI
  • COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140240075
    Abstract: Disclosed herein is a common mode filter, including: a magnetic substrate; and a body part formed on the magnetic substrate, wherein the body part is configured of an insulating layer surrounding a coil electrode, an outer electrode terminal connected with an end of the coil electrode, and a magnetic resin composite, the insulating layer is formed on the magnetic substrate, having a margin part M disposed at an edge of the magnetic substrate, and the magnetic resin composite is filled in an empty space of the body part including the margin part M, thereby promoting a consecutive flow of magnetic flux that is generated from the coil electrode.
    Type: Application
    Filed: February 27, 2014
    Publication date: August 28, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Hyuck YANG, Young Seuck YOO, Sung Kwon WI, Hye Won BANG, Geon Se CHANG, Young Do KWEON, Ju Hwan YANG
  • ELECTROSTATIC DISCHARGE PROTECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20140192446
    Abstract: Disclosed herein is an electrostatic discharge protection device including: a substrate; electrodes disposed to be spaced apart from each other on the substrate; and an electrostatic discharge absorbing layer having atypical metal lumps formed on the substrate.
    Type: Application
    Filed: January 3, 2014
    Publication date: July 10, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Kwon WI, Young Seuck YOO, Kyong Bok MIN, Won Chul SIM, Young Do KWEON
  • PRINTED CIRCUIT BOARD AND SURFACE TREATMENT METHOD OF PRINTED CIRCUIT BOARD
    Publication number: 20140182905
    Abstract: Disclosed herein are a printed circuit board including a copper foil layer surface treated with Pb-free solder having the same height as that of a solder resist, and a surface treatment method of the printed circuit board. According to the present invention, the surface treatment of the package board or interposer board having an ultra-fine pitch (300 ?m or less) may be easily implemented by a cheap process. In addition, the surface treatment of the printed circuit board may be eco-friendly performed by using the Pb-free solder, and it may be easy to surface treat the package board or interposer board based on the organic material sensitive to a high temperature.
    Type: Application
    Filed: December 30, 2013
    Publication date: July 3, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kyung Moo HAR, Chang Bae LEE, Jin Gu KIM, Young Do KWEON
  • CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20140182915
    Abstract: The present invention relates to a circuit board. A circuit board in accordance with an embodiment of the present invention includes a base substrate; an interlayer insulating layer covering the base substrate; a via structure passing through at least the interlayer insulating layer of the base substrate and the interlayer insulating layer in the vertical direction; and an etch stop pattern disposed on the interlayer insulating layer in the horizontal direction to surround the via structure and made of an insulating material.
    Type: Application
    Filed: October 22, 2013
    Publication date: July 3, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung HAN, Young Do KWEON, Jin Gu KIM, Hyung Jin JEON, Yoon Su KIM