Patents by Inventor Yu Peng

Yu Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240107691
    Abstract: A display device includes first and second display modules and first and second turning pieces that include a first coupling piece, a first turning piece, a second turning piece, and a third turning piece, a second coupling piece and a guiding device. When the first and second display modules are switched between folding and unfolding, the first turning piece pivots relative to the first coupling piece and the second turning piece, and the third turning piece pivots relative to the second coupling piece and the second turning piece. When the display module is switched from folded to unfolded, the other side of the first display module relative to the side is pulled, the side of the first display module is guided by one end of the guiding device and slides to the other end, the first and second display modules are symmetrically unfolded with the side edge as the center.
    Type: Application
    Filed: December 8, 2023
    Publication date: March 28, 2024
    Inventors: CHIEN-FENG CHANG, TSUNG-HUAI LEE, YU-HUNG HSIAO, CHAN-PENG LIN, SHANG-CHIEN WU
  • Publication number: 20240104746
    Abstract: The present invention discloses a vessel tracking and monitoring system and operating method thereof. Specifically, the vessel tracking and monitoring system comprises at least one camera, a processing module and a storage module. On the other hand, the processing module may keep the water object which is detected and recognized by the at least one camera in the center area of a monitoring screen. Therefore, the present invention may track and recognize the type of the at least one water object, assisting areas such as ports in managing and tracking water object arrivals and departures under various environmental conditions.
    Type: Application
    Filed: December 15, 2022
    Publication date: March 28, 2024
    Inventors: CHIA-YU WU, YAN-SHENG SONG, YU-TING PENG, CHIEN-HUNG LIU
  • Publication number: 20240102025
    Abstract: The present disclosure provides a gene combination for expressing and producing terrequinone A in Escherichia coli and use thereof. The gene combination includes a tdiAS gene, a tdiBS gene, a tdiCS gene, a tdiDS gene, a tdiES gene, an sfpS gene, an ScCKS gene, and an AtIPKS gene with nucleotide sequences set forth in SEQ ID NOS:1 to 8. In the present disclosure, a recombinant engineered strain capable of producing terrequinone A having anti-cancer activity is obtained by separately constructing recombinant plasmids pC02 and pU03 through the eight genes and transforming the two recombinant plasmids into E. coli. The content of terrequinone A in a fermentation broth thereof is 106.3 mg/L, which has potential application value in the biopharmaceutical field.
    Type: Application
    Filed: May 24, 2023
    Publication date: March 28, 2024
    Inventors: Yongsheng TIAN, Lijuan WANG, Yongdong DENG, Quanhong YAO, Rihe PENG, Jianjie GAO, Zhenjun LI, Wenhui ZHANG, Bo WANG, Jing XU, Yu WANG, Xiaoyan FU, Hongjuan HAN
  • Patent number: 11938974
    Abstract: A series-parallel monorail hoist based on an oil-electric hybrid power and a controlling method thereof. The monorail hoist includes a cabin, a hydraulic driving system, a lifting beam, a gear track driving and energy storage system, and a speed adaptive control system connected in series with each other and travelling on a track. The monorail hoist is capable of implementing an independent drive by an electric motor or a diesel engine in an endurance mode, a hybrid drive of the electric motor and the diesel engine in a transportation mode, and a hybrid drive of the diesel engine and a flywheel energy storage system in a climbing mode, according to different operating conditions that include conditions of an upslope, a downslope and a load. Power requirements for the monorail hoist under various operating conditions are satisfied, and the excess energy is recovered during the process of travelling.
    Type: Grant
    Filed: September 30, 2022
    Date of Patent: March 26, 2024
    Assignees: CHINA UNIVERSITY OF MINING AND TECHNOLOGY, XUZHOU LIREN MONORAIL TRANSPORTATION EQUIPMENT CO., LTD.
    Inventors: Zhencai Zhu, Hao Lu, Yuxing Peng, Gongbo Zhou, Yu Tang, Hua Chen, Zaigang Xu, Mingzhong Wang, Mai Du, Fuping Zheng
  • Publication number: 20240096928
    Abstract: A semiconductor structure and manufacturing method thereof are provided. The semiconductor structure includes a substrate and a metallization structure over the substrate. The metallization structure includes a MIM structure, a first contact and a second contact. The MIM structure includes a bottom electrode layer, a dielectric layer on the bottom electrode layer, a ferroelectric layer on the dielectric layer, and a top electrode layer on the ferroelectric layer. The ferroelectric layer is substantially made of lead zirconate titanate (PZT), BaTiO3 (BTO), or barium strontium titanate (BST), and a thickness of the ferroelectric layer is greater than a thickness of the dielectric layer.
    Type: Application
    Filed: November 24, 2023
    Publication date: March 21, 2024
    Inventors: SAI-HOOI YEONG, CHIH-YU CHANG, CHUN-YEN PENG, CHI ON CHUI
  • Publication number: 20240098004
    Abstract: A packet forwarding method and apparatus, and a communication network, related to the field of communication technologies. In the solutions provided, a controller may obtain a correspondence between an application-aware identifier of a service flow and a network service required for transmitting the service flow, and deliver the correspondence to a network device. Further, when identifying the service flow as a service flow indicated by the application-aware identifier, the network device may directly forward a packet of the service flow by using the corresponding network service. The controller may establish and deliver the correspondence between the application-aware identifier and the network service, so that the network device can directly forward the service packet of the service flow based on the correspondence. Therefore, flexibility of forwarding the service packet is effectively improved.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 21, 2024
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Shuping PENG, Hongjie YANG, Tianran ZHOU, Peng WU, Zhenbin LI, Yu ZHOU
  • Publication number: 20240096830
    Abstract: A method includes forming a first sealing layer at a first edge region of a first wafer; and bonding the first wafer to a second wafer to form a wafer stack. At a time after the bonding, the first sealing layer is between the first edge region of the first wafer and a second edge region of the second wafer, with the first edge region and the second edge region comprising bevels. An edge trimming process is then performed on the wafer stack. After the edge trimming process, the second edge region of the second wafer is at least partially removed, and a portion of the first sealing layer is left as a part of the wafer stack. An interconnect structure is formed as a part of the second wafer. The interconnect structure includes redistribution lines electrically connected to integrated circuit devices in the second wafer.
    Type: Application
    Filed: January 9, 2023
    Publication date: March 21, 2024
    Inventors: Yu-Yi Huang, Yu-Hung Lin, Wei-Ming Wang, Chen Chen, Shih-Peng Tai, Kuo-Chung Yee
  • Publication number: 20240088019
    Abstract: A connecting structure includes a first dielectric layer, a first connecting via in the first dielectric layer, a second connecting via in the first dielectric layer, and an isolation between the first connecting via and the second connecting via. The isolation separates the first and second connecting vias from each other. The first connecting via, the isolation and the second connecting via are line symmetrical about a central line perpendicular to a top surface of the first dielectric layer.
    Type: Application
    Filed: January 11, 2023
    Publication date: March 14, 2024
    Inventors: CHIA CHEN LEE, CHIA-TIEN WU, SHIH-WEI PENG, KUAN YU CHEN
  • Publication number: 20240079472
    Abstract: The present disclosure provides a semiconductor device and a method for forming a semiconductor device. The semiconductor device includes a substrate, and a first gate dielectric stack over the substrate, wherein the first gate dielectric stack includes a first ferroelectric layer, and a first dielectric layer coupled to the first ferroelectric layer, wherein the first ferroelectric layer includes a first portion made of a ferroelectric material in orthorhombic phase, a second portion made of the ferroelectric material in monoclinic phase, and a third portion made of the ferroelectric material in tetragonal phase, wherein a total volume of the second portion is greater than a total volume of the first portion, and the total volume of the first portion is greater than a total volume of the third portion.
    Type: Application
    Filed: November 6, 2023
    Publication date: March 7, 2024
    Inventors: CHUN-YEN PENG, TE-YANG LAI, BO-FENG YOUNG, CHIH-YU CHANG, SAI-HOOI YEONG, CHI ON CHUI
  • Publication number: 20240071052
    Abstract: A method and system for training a machine learning model for reducing or removing a foreign material or artefacts due to a foreign material from an image of a subject, the method comprising: generating one or more first simulated images from one or more real or simulated images of the foreign material (and optionally artefacts due to the foreign material), and from one or more real images of one or more subjects that are free of the foreign material and of artefacts due to the foreign material, such that the generated simulated images include the foreign material and artefacts due to the foreign material; generating one or more predicted images employing at least the first simulated images with a machine learning network that implements a machine learning model; and training or updating the machine learning model with the machine learning network by reducing or minimizing a difference between the one or more predicted images and ground truth data comprising one or more real or simulated images.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Inventors: Yu PENG, Xiaoxu LI
  • Patent number: 11910780
    Abstract: A pet grooming machine and a method for pet hair grooming is provided. The pet grooming machine includes a blower having a blower air-inlet, a motor unit, a blower air-outlet, and an air channel, a tank unit having a tank, a tank air-inlet, a filter, and an air-outlet. The blower and tank unit can be in either separated configuration or combined configuration. In separated configuration, the blower is separated from the tank unit and can be independently used for blowing. In combined configuration, the blower air-inlet and the tank unit are detachably combined and sealed. In combined configuration, the negative pressure generated by airflow driven by the blower is transmitted to the tank air-inlet through the tank and the filter. The blower is a portable blower, which can be held with one hand by the user for prolonged blowing on the pet without need for an external flexible hose.
    Type: Grant
    Filed: July 28, 2023
    Date of Patent: February 27, 2024
    Assignee: SUZHOU VACS ELECTRICAL CO., LTD.
    Inventors: Jinsong Peng, Yu Liang
  • Publication number: 20240061463
    Abstract: A button structure and an electronic device are provided. The electronic device includes a housing and a button structure disposed at the housing. The button structure includes a button body and an elastic body. The button body includes a keycap and a pillar portion. The keycap is connected to one end of the pillar portion. The elastic body is sleeved on the pillar portion, and one end of the elastic body includes a first engaging portion. The first engaging portion is capable of being engaged with a part of the housing.
    Type: Application
    Filed: June 16, 2023
    Publication date: February 22, 2024
    Inventors: CHUAN-YUAN LIN, HUI-CHEN WANG, CHAN-WEI KUO, YU-PENG LAI
  • Publication number: 20240055803
    Abstract: An elastic buckling element includes a base and an elastic buckling portion. The base includes a bearing surface, and the bearing surface defines a horizontal direction parallel to the bearing surface and a vertical direction perpendicular to the bearing surface, one end of the elastic buckling portion is fixed on the bearing surface of the base, and the elastic buckling portion and the base have a first height in the vertical direction, and the elastic buckling portion is arranged along the horizontal direction and has a horizontal extension length in the horizontal direction, wherein the horizontal extension length is greater than the first height.
    Type: Application
    Filed: May 30, 2023
    Publication date: February 15, 2024
    Inventors: Yu-Peng LAI, Hui-Chen WANG, Chan-Wei KUO, Chuan-Yuan LIN
  • Patent number: 11881274
    Abstract: A program control circuit for an antifuse-type one time programming memory cell array is provided. When the program action is performed, the program control circuit monitors the program current from the memory cell in real time and increases the program voltage at proper time. When the program control circuit judges that the program current generated by the memory cell is sufficient, the program control circuit confirms that the program action is completed.
    Type: Grant
    Filed: June 17, 2022
    Date of Patent: January 23, 2024
    Assignee: EMEMORY TECHNOLOGY INC.
    Inventors: Chia-Fu Chang, Po-Ping Wang, Jen-Yu Peng
  • Publication number: 20240019908
    Abstract: A quick-release cover structure includes a casing and a cover. The casing includes a through slot, a protrusion and an engagement hole. The protrusion protrudes from a first slot wall of the through slot. The engagement hole is arranged on a second slot wall of the through slot. The cover is assembled to cover the through slot, and includes a plate, an engagement member, an elastic hook and a handle. The engagement member and the elastic hook respectively protrudes from the plate and are adjacent to different side edges, the protrusion is adapted to extend through the engagement member, and the elastic hook is adapted to be engaged with the engagement hole. When the handle is moved away from the through slot by an acting force, the elastic hook is deformed and disengaged from the engagement hole, so that the cover is separated from the casing.
    Type: Application
    Filed: May 29, 2023
    Publication date: January 18, 2024
    Inventors: Chuan-Yuan LIN, Hui-Chen WANG, Chan-Wei KUO, Yu-Peng LAI
  • Patent number: 11872343
    Abstract: A ventilator system includes a first air tank, a plurality of second air tanks communicated with the first air tank, a plurality of breathing devices respectively communicated with the second air tanks, a plurality of first vacuum tanks respectively communicated with the breathing devices, and a second vacuum tank communicated with the first vacuum tanks. The first air tank has a positive pressure relative to the second air tanks. The second vacuum tank has a negative pressure relative to the first vacuum tanks.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: January 16, 2024
    Inventors: Chen-Kun Liaw, Tai-Yin Wu, Yu-Ciao Liao, Yu-Yan Liao, Hsiang-Hung Liaw, Yu-Peng Liao, Yi-Hsuan Liao, Yen-Chun Liao, Chih-Ling Liao
  • Publication number: 20240014145
    Abstract: An integrated circuit (IC) package structure includes a chip, a redistribution layer (RDL) structure, a molding compound structure and an electromagnetic interference (EMI) shielding structure. The RDL structure is formed on the chip and electrically connected thereto. The molding compound layer is provided on outer surfaces of the chip and the RDL structure. The EMI shielding structure is provided on outer surfaces of the molding compound structure. The molding compound structure layer provided on outer surfaces of the chip and the RDL structure provide protection and reinforcement to multiple faces of the IC package structure; and the EMI shielding structure provided on outer surfaces of the molding compound structure provides EMI protection to multiple faces of the chip and the RDL structure.
    Type: Application
    Filed: September 20, 2023
    Publication date: January 11, 2024
    Applicant: Unimicron Technology Corp.
    Inventors: Kai-Ming Yang, Chia-Yu Peng, John Hon-Shing Lau
  • Publication number: 20240014118
    Abstract: In a flip chip package, lines, an identification line and a dummy line are provided on a first surface of a light-transmissive carrier, and a supportive layer is disposed on a second surface of the light-transmissive carrier. Bumps and an identification bump of a chip are bonded to the lines and the identification line, respectively. Shadows of the dummy line, the identification line and the identification bump which are projected on the second surface are visible from an opening of the supportive layer. The shadows can be inspected through the opening so as to know whether the bumps are bonded to the lines correctly.
    Type: Application
    Filed: June 27, 2023
    Publication date: January 11, 2024
    Inventors: Chun-Te Lee, Chih-Ming Peng, Pi-Yu Peng, Hui-Yu Huang, Yin-Chen Lin
  • Patent number: 11852671
    Abstract: A photovoltaic energy system and a method for detecting a ground insulation impedance, improve accuracy of detecting a ground insulation impedance after one or more conversion circuits are connected in parallel. The photovoltaic energy system includes one or more conversion circuits and a detection circuit. The detection circuit includes an alternating current signal source and a sampling resistor that are connected in series, a first sampling circuit, and a control circuit. The control circuit is configured to control the alternating current signal source to output harmonic signals of a first frequency and a second frequency. The first sampling circuit is configured to: when the alternating current signal source outputs the harmonic signal of the first frequency, collect a voltage at both terminals of the sampling resistor to obtain a first voltage.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: December 26, 2023
    Assignee: HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
    Inventors: Zhong Wang, Shengjie Zhang, Jianshan Li, Yu Peng, Shijiang Yu, He Zhou, Bo Yu
  • Patent number: D1013276
    Type: Grant
    Filed: October 16, 2023
    Date of Patent: January 30, 2024
    Assignee: Cherry Creek Beauty Corporation
    Inventors: Yu Peng, Wenxuan Wang