Abstract: A test strip main body with a sample section, colloidal gold pads, an NC film and a water absorption end in sequence; and the colloidal gold pads are of 3 to 8 layers. Compared with the prior art, the test strip has higher sensitivity, which is beneficial to detection of trace or low-concentration samples.

Abstract: The present invention discloses a testing device and evaluation method for sensitivity damage of core permeability tensor, comprising the following steps: first, obtain the cubic experimental rock samples and calculate the formation pressure distribution based on the reservoir geological data; then simulate the true stress and strain state of core in formation through triaxial stress loading, design the acid liquor, alkali liquor, inorganic salt solution, formation water and different displacement rates for displacement experiments, realize the determination of core three-directional permeability tensor under the same experimental conditions through three-directional sequential displacement, process the experimental data through Darcy's law, and calculate the damage degree of core permeability tensor under different sensitivity conditions of triaxial stress state; finally, identify the real-time flow state of fluid through permeability tensor synthesis, and realize the accurate and efficient testing and evalu

Abstract: The present invention discloses a method for comprehensive evaluation of shale fracability under the geology-engineering “double-track” system, comprising the following steps: S1: Divide the target horizontal fracturing interval into multiple sampling sections; S2: Establish the reservoir property evaluation factor of each sampling section, and calculate the geological evaluation index of the target horizontal fracturing interval according to the reservoir property evaluation factor of each sampling section; S3: Establish the brittleness factor, natural fracture factor and natural fracture opening factor of each sampling section, and then establish the engineering evaluation index of each sampling section according to these factors; S4: Calculate the engineering evaluation index of the target horizontal fracturing interval according to the engineering evaluation factor of each sampling section; S5: Evaluate the fracability of the target horizontal fracturing interval according to the geological evaluation ind

Abstract: An integrated wellhead device for filtering injected and produced gases is provided by the present disclosure, comprising a horizontal tank body that is internally provided with an injected gas filtering system and a produced gas filtering system, wherein the injected gas filtering system is internally provided with an oxygen removal chamber, the gas inlet of the injected gas filtering system is connected with an injected high-pressure gas source, and the gas outlet of the injected gas filtering system is connected with a gas injection well casing of Christmas tree, the produced gas filtering system is internally equipped with an oxygen removal chamber, a sulfur removal chamber and a carbon dioxide removal chamber, the gas inlet of the produced gas filtering system is connected with a gas production tubing of the Christmas tree, and the gas outlet of the produced gas filtering system is connected with a produced gas transmission pipe.

Abstract: A device comprises a plurality of 2D semiconductor nanostructures, a gate structure, a source region, and a drain region. The plurality of 2D semiconductor nanostructures extend in a first direction above a substrate and arranged in a second direction substantially perpendicular to the first direction. The gate structure surrounds each of the plurality of 2D semiconductor nanostructures. The source region and the drain region are respectively on opposite sides of the gate structure.

Abstract: A flip-cover multifunctional image forming device includes a lower body, a first image forming module, a cover body, at least one pivoting mechanism, an upper body and a second image forming module. The first image forming module is disposed inside the lower body. The at least one pivoting mechanism is connected to the lower body and the cover body and for pivoting the cover body relative to the lower body between a folded position and an unfolded position. The upper body is detachably disposed on a side of the cover body away from the lower body. The upper body is driven by the cover body to move relative to the lower body when the cover body pivots relative to the lower body. The second image forming module is disposed inside the upper body. The present invention has advantages of simple structure, easy operation and flexibility in use.

Abstract: A method comprises forming a plurality of interconnect structures including a dielectric layer, a metal line and a redistribution line over a carrier, attaching a semiconductor die on a first side of the plurality of interconnect structures, forming an underfill layer between the semiconductor die and the plurality of interconnect structures, mounting a top package on the first side the plurality of interconnect structures, wherein the top package comprises a plurality of conductive bumps, forming an encapsulation layer over the first side of the plurality of interconnect structures, wherein the top package is embedded in the encapsulation layer, detaching the carrier from the plurality of interconnect structures and mounting a plurality of bumps on a second side of the plurality of interconnect structures.

Abstract: A method for heap space management includes, in response to a determination that consumption of a first heap space of an application exceeds a first threshold, determining whether a second heap space of the application after garbage collection is sufficient to accommodate data stored in the first heap space. The method further includes, in response to a determination that the second heap space after the garbage collection is sufficient to accommodate the data, performing the garbage collection on the second heap space. The method further includes storing the data into the second heap space.

Abstract: A method for heap space management includes, in response to a determination that consumption of a first heap space of an application exceeds a first threshold, determining whether a second heap space of the application after garbage collection is sufficient to accommodate data stored in the first heap space. The method further includes, in response to a determination that the second heap space after the garbage collection is sufficient to accommodate the data, performing the garbage collection on the second heap space. The method further includes storing the data into the second heap space.

Abstract: A spray canister device includes a canister element containing a sprayable solution and a sleeved cover element. The sleeved cover element includes a sleeve portion having a first end and a second end opposite the first end, a handle grip extending from the second end of the sleeve portion, a projection extending from the sleeve portion, the projection disposed on a side of the sleeve portion opposite from the handle grip, and a cap portion extending form the first end of the sleeve portion. The cap portion having a body portion, a cut-out portion including an opening configured to spray the solution, and a channel disposed within the body portion. The channel forming a conduit between an outlet of the canister device and the opening.

Abstract: A circuit board structure includes a redistribution structure layer, a build-up circuit structure layer, and a connection structure layer. The redistribution structure layer has a first and second surface, and includes an inner and outer dielectric layer, first connecting pads, and chip pads. A bottom surface of each first connecting pad is aligned with the first surface, and the chip pads are protruded from and located on the second surface. The build-up circuit structure layer includes second connecting pads. The connection structure layer is disposed between the redistribution structure layer and the build-up circuit structure layer and includes a substrate and conductive paste pillars penetrating the substrate. The first connecting pads are electrically connected to the second connecting pads via the conductive paste pillars, respectively. A top surface of each conductive paste pillar is aligned with the first surface of the redistribution structure layer.

Abstract: A package structure includes an insulating encapsulation, at least one die, and conductive structures. The at least one die is encapsulated in the insulating encapsulation. The conductive structures are located aside of the at least one die and surrounded by the insulating encapsulation, and at least one of the conductive structures is electrically connected to the at least one die. Each of the conductive structures has a first surface, a second surface opposite to the first surface and a slant sidewall connecting the first surface and the second surface, and each of the conductive structures has a top diameter greater than a bottom diameter thereof, and wherein each of the conductive structures has a plurality of pores distributed therein.

Abstract: A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.

Abstract: Disclosed herein are methods for obtaining endometrial stromal fibroblast cells from pluripotent stem cells, such as induced pluripotent stem cells. The present disclosure also provides methods of obtaining a three-dimensional, multilayered endometrial tissue composition. Methods of using the cells and tissue compositions in drug screening and therapeutic applications are also provided.

Abstract: A package structure includes a redistribution layer, a chip assembly, a plurality of solder balls, and a molding compound. The redistribution layer includes redistribution circuits, photoimageable dielectric layers, conductive through holes, and chip pads. One of the photoimageable dielectric layers located on opposite two outermost sides has an upper surface and openings. The chip pads are located on the upper surface and are electrically connected to the redistribution circuits through the conductive through holes. The openings expose portions of the redistribution circuits to define solder ball pads. Line widths and line spacings of the redistribution circuits decrease in a direction from the solder ball pads towards the chip pads. The chip assembly is disposed on the chip pads and includes at least two chips with different sizes. The solder balls are disposed on the solder ball pads, and the molding compound at least covers the chip assembly.

Abstract: A package structure includes an insulating encapsulation, at least one die, and conductive structures. The at least one die is encapsulated in the insulating encapsulation. The conductive structures are located aside of the at least one die and surrounded by the insulating encapsulation, and at least one of the conductive structures is electrically connected to the at least one die. Each of the conductive structures has a first surface, a second surface opposite to the first surface and a slant sidewall connecting the first surface and the second surface, and each of the conductive structures has a top diameter greater than a bottom diameter thereof, and wherein each of the conductive structures has a plurality of pores distributed therein.

Abstract: The present disclosure provides a toilet seat assembly for delivering medicine, washing, cleaning, and drying a perineal region of a user. The toilet seat assembly includes a spraying nozzle assembly having one or more retractable spray nozzle units for delivering a liquid product, a drying nozzle assembly having one or more retractable drying nozzle units for drying the region, and a medicine delivery assembly for delivering a medicinal product to the region, the medicine delivery assembly having a medicine delivery nozzle connected to a medicine storage element containing the medicinal product.