Patents by Inventor Yu Peng

Yu Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230397898
    Abstract: A method and system for generating material decomposition images from plural-energy x-ray based imaging, the method comprising: modelling spatial relationships and spectral relationships among the plurality of images by learning features from the plurality of images in combination and one or more of the plurality of images individually with a deep learning neural network; generating one or more basis material images employing the spatial relationships and the spectral relationships; and generating one or more material specific or material decomposition images from the basis material images. The neural network has an encoder-decoder structure and includes a plurality of encoder branches; each of one or more of the plurality of encoder branches encodes two or more images of the plurality of images in combination; and each of one or more of the plurality of encoder branches encodes a respective individual image of the plurality of images.
    Type: Application
    Filed: June 16, 2023
    Publication date: December 14, 2023
    Inventor: Yu PENG
  • Patent number: 11830781
    Abstract: A package structure includes an insulating encapsulation, at least one die, and conductive structures. The at least one die is encapsulated in the insulating encapsulation. The conductive structures are located aside of the at least one die and surrounded by the insulating encapsulation, and at least one of the conductive structures is electrically connected to the at least one die. Each of the conductive structures has a first surface, a second surface opposite to the first surface and a slant sidewall connecting the first surface and the second surface, and each of the conductive structures has a top diameter greater than a bottom diameter thereof, and wherein each of the conductive structures has a plurality of pores distributed therein.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: November 28, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Yu Chen, Chih-Hua Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Yu-Chih Huang, Yu-Peng Tsai, Chia-Shen Cheng, Chih-Chiang Tsao, Jen-Jui Yu
  • Patent number: 11825992
    Abstract: A method and a wash, clean and dry system are provided for washing, cleaning and drying a surface region of a human body. The system includes a toilet seat assembly with a bidet assembly having a spray canister device for spraying the surface region with a solution, such as a skin protecting barrier solution, a cleaning solution or a medicated solution. In one aspect, the spray canister device can be movably insert into and out of the toilet seat assembly and is easy to operate and use. In addition, the bidet assembly further includes a spray nozzle assembly and a drying nozzle assembly, which are adapted to wash, clean and dry the region of the human body in three dimensional moments. The removable spray canister device with the removable sleeved cover element is thus easy to carry and be re-filled with new solutions.
    Type: Grant
    Filed: February 21, 2022
    Date of Patent: November 28, 2023
    Assignee: BEMIS MANUFACTURING COMPANY
    Inventors: Brian Schwab, Shao-Yu Peng, Brian Murray
  • Publication number: 20230376657
    Abstract: The present invention discloses an evaluation method for acid fracturing effect based on the theory of acid-frac “stimulated zone”, comprising the following steps: establish a structured reservoir grid, and add initial artificial fractures to the structured reservoir grid; establish a fracture propagation model considering the acid-frac stimulated zone, on the basis of the structured reservoir grid, conduct numerical simulation according to the fracture propagation model, and work out the seepage parameters during acid fracturing; establish a gas well production model, and calculate the pore distribution and liquid saturation distribution of the reservoir in gas well production; calculate the cumulative production of the gas well, and calculate the multiple proportion of cumulative production increase of the construction plan according to the cumulative production of the gas well; the greater the multiple proportion, the better the acid fracturing effect.
    Type: Application
    Filed: January 11, 2023
    Publication date: November 23, 2023
    Applicant: Southwest Petroleum University
    Inventors: Yu PENG, Pengjun SHI, Yongming LI, Weihua CHEN, Fei LIU, Ji ZENG
  • Publication number: 20230380053
    Abstract: A flip-chip bonding structure includes a chip and a circuit board, the chip is bonded to the circuit board by bumps. The circuit board includes a light-transmissive substrate, a first circuit group, a second circuit group, a boundary circuit and an identifying member. The boundary circuit is located between the first and second circuit groups and projects a boundary circuit shadow on light-transmissive substrate. The boundary circuit shadow can be recognized according to the identifying member and is provided to identify the boundary between the first and second circuit groups or identify the position of leads with the smallest pitch.
    Type: Application
    Filed: April 13, 2023
    Publication date: November 23, 2023
    Inventors: Chun-Te Lee, Chih-Ming Peng, Pi-Yu Peng, Hui-Yu Huang
  • Publication number: 20230378056
    Abstract: A method includes following steps. First transistors are formed over a substrate. An interconnect structure is formed over the plurality of first transistors. A dielectric layer is formed over the interconnect structure. 2D semiconductor seeds are formed over the dielectric layer. The 2D semiconductor seeds are annealed. An epitaxy process is performed to laterally grow a plurality of 2D semiconductor films respectively from the plurality of 2D semiconductor seeds. Second transistors are formed on the plurality of 2D semiconductor films.
    Type: Application
    Filed: July 31, 2023
    Publication date: November 23, 2023
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL YANG MING CHIAO TUNG UNIVERSITY
    Inventors: Chenming HU, Shu-Jui CHANG, Chen-Han CHOU, Yen-Teng HO, Chia-Hsing WU, Kai-Yu PENG, Cheng-Hung SHEN
  • Patent number: 11824012
    Abstract: An integrated circuit (IC) package structure includes a chip, a redistribution layer (RDL) structure, a molding compound structure and an electromagnetic interference (EMI) shielding structure. The RDL structure is formed on the chip and electrically connected thereto. The molding compound layer is provided on outer surfaces of the chip and the RDL structure. The EMI shielding structure is provided on outer surfaces of the molding compound structure. The molding compound structure layer provided on outer surfaces of the chip and the RDL structure provide protection and reinforcement to multiple faces of the IC package structure; and the EMI shielding structure provided on outer surfaces of the molding compound structure provides EMI protection to multiple faces of the chip and the RDL structure. The IC package structure has upgraded structural strength, reliability and stability in use. A method of manufacturing the above IC package structure is also introduced.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: November 21, 2023
    Assignee: Unimicron Technology Corp.
    Inventors: Kai-Ming Yang, Chia-Yu Peng, John Hon-Shing Lau
  • Publication number: 20230351588
    Abstract: A system and computer-implemented method for diagnosing, monitoring, screening for or evaluating a musculoskeletal disease or condition of a subject. The method comprises quantifying one or more features segmented and identified from a medical image of the subject; assessing the quantified one or more features with a trained machine learning model trained to diagnose, monitor, screen for or evaluate one or more musculoskeletal diseases or conditions; and outputting one or more results of the assessing, the results comprising one or more disease or condition diagnoses, disease or condition monitorings, disease or condition screenings, or disease or condition evaluations.
    Type: Application
    Filed: June 26, 2023
    Publication date: November 2, 2023
    Inventor: Yu PENG
  • Publication number: 20230335419
    Abstract: The present invention provides an etching device which comprises an oxygen supplier, so that the etching device of the present invention can etch copper gently by means of the dissolved oxygen in the etching solution to accurately control the etching degree so as to fulfill the stricter requirements of microcircuit manufacturing. The present invention further provides an etching method. Finally, the etching waste solution of the present invention can be recycled to further ameliorate the environmental pollution and reduce the production cost, so the present invention is widely applicable in integrated circuit packaging.
    Type: Application
    Filed: May 11, 2022
    Publication date: October 19, 2023
    Inventors: Chin-Sheng Wang, Chia-Yu Peng, KAI-MING YANG, PU-JU LIN, CHENG-TA KO
  • Patent number: 11786201
    Abstract: A method and system for generating material decomposition images from plural-energy x-ray based imaging, the method comprising: modelling spatial relationships and spectral relationships among the plurality of images by learning features from the plurality of images in combination and one or more of the plurality of images individually with a deep learning neural network; generating one or more basis material images employing the spatial relationships and the spectral relationships; and generating one or more material specific or material decomposition images from the basis material images. The neural network has an encoder-decoder structure and includes a plurality of encoder branches; each of one or more of the plurality of encoder branches encodes two or more images of the plurality of images in combination; and each of one or more of the plurality of encoder branches encodes a respective individual image of the plurality of images.
    Type: Grant
    Filed: June 14, 2022
    Date of Patent: October 17, 2023
    Assignee: CURVEBEAM AI LIMITED
    Inventor: Yu Peng
  • Patent number: 11784119
    Abstract: An IC structure comprises a first transistor formed on a substrate, a first interconnect structure over the first transistor, a dielectric layer over the first interconnect structure, a plurality of 2D semiconductor islands on the dielectric layer, and a plurality of second transistors formed on the plurality of 2D semiconductor islands.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: October 10, 2023
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL YANG MING CHIAO TUNG UNIVERSITY
    Inventors: Chenming Hu, Shu-Jui Chang, Chen-Han Chou, Yen-Teng Ho, Chia-Hsing Wu, Kai-Yu Peng, Cheng-Hung Shen
  • Patent number: 11767746
    Abstract: An integrated wellhead device for filtering injected and produced gases is provided. The wellhead device comprises a horizontal tank body that is internally provided with an injected gas filtering system and a produced gas filtering system. The injected gas filtering system is internally provided with an oxygen removal chamber. A gas inlet of the injected gas filtering system is connected with an injected high-pressure gas source, and a gas outlet of the injected gas filtering system is connected with a gas injection well casing of Christmas tree. The produced gas filtering system is internally equipped with an oxygen removal chamber, a sulfur removal chamber and a carbon dioxide removal chamber. A gas inlet of the produced gas filtering system is connected with a gas production tubing of the Christmas tree, and a gas outlet of the produced gas filtering system is connected with a produced gas transmission pipe.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: September 26, 2023
    Assignee: Southwest Petroleum University
    Inventors: Yongming Li, Tai Chang, Yu Peng, Yibo Li, Ang Luo, Shuxuan Li
  • Patent number: 11769253
    Abstract: A system and computer-implemented method for analysing or monitoring a subject, the method comprising: identifying one or more objects of interest that have been segmented from a first image comprising any of a baseline scan, a follow-up scan or a reference image of the subject; identifying predefined landmarks of the objects; determining reference morphometries pertaining to the objects by performing morphometrics on the objects by reference to the landmarks; selecting one or more regions of interest (ROIs) from the objects according to the reference morphometries, comprising identifying respective locations of the ROIs relative to the reference morphometries; performing a first analysis of the one or more ROIs; performing at least one corresponding second analysis of the one or more ROIs in respectively at least one second image comprising any other of a baseline scan, a follow-up scan or a reference image; and generating a comparison of one or more results of the first analysis and one or more correspondin
    Type: Grant
    Filed: November 4, 2021
    Date of Patent: September 26, 2023
    Assignee: CURVEBEAM AI LIMITED
    Inventor: Yu Peng
  • Patent number: 11764090
    Abstract: A tray includes a body for placement of a component (e.g. electronic component) and a taker disposed on a bottom surface of the body. The taker is used to take a spacer and includes a first taking element and a second taking element. The first taking element includes a first connection portion and a first confinement portion, and the second taking element includes a second connection portion and a second confinement portion. An accommodation space is provided between the first and second connection portions and a passageway is provided between the first and second confinement portions. While the spacer is moved through the passageway and into the accommodation space, it is confined in the accommodation space by the first and second confinement portions such that the taker can take away the spacer to show another tray located under the spacer as the tray is removed.
    Type: Grant
    Filed: March 9, 2022
    Date of Patent: September 19, 2023
    Assignee: CHIPBOND TECHNOLOGY CORPORATION
    Inventors: Hsu-Chi Lee, Pi-Yu Peng, Chun-Te Lee
  • Patent number: 11764120
    Abstract: A chip packaging structure includes a chip, a redistribution layer, a solder ball, an encapsulant, and a stress buffer layer. The chip has an active surface and a back surface opposite to each other, and a peripheral surface connected to the active surface and the back surface. The redistribution layer is disposed on the active surface of the chip. The solder ball is disposed on the redistribution layer, and the chip is electrically connected to the solder ball through the redistribution layer. The encapsulant encapsulates the active surface and the back surface of the chip, the redistribution layer, and part of the solder ball. The stress buffer layer at least covers the peripheral surface of the chip. An outer surface of the stress buffer layer is aligned with a side surface of the encapsulant.
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: September 19, 2023
    Assignee: Unimicron Technology Corp.
    Inventors: Kai-Ming Yang, Chia-Yu Peng, Pei-Chi Chen, Pu-Ju Lin, Cheng-Ta Ko
  • Patent number: 11747260
    Abstract: The invention discloses a digital imaging technology-based method for calculating relative permeability of tight core, comprising the following steps: step S1: preparing a small column sample of tight core satisfying resolution requirements; step S2: scanning the sample by MicroCT-400 and establish a digital core; step S3: performing statistical analysis on parameters reflecting the characteristics of rock pore structure and shape according to the digital core; step S4: calculating tortuosity fractal dimension DT and porosity fractal dimension Df by a 3D image fractal box dimension algorithm; step S5: performing statistical analysis on maximum pore equivalent diameter ?max and minimum pore equivalent diameter ?min by a label. The present invention solves the problems of time consumption of experiment, instrument accuracy, incapability of repeated calculation simulations and resource waste by repeated physical experiment.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: September 5, 2023
    Assignee: SOUTHWEST PETROLEUM UNIVERSITY
    Inventors: Yonggang Duan, Zhenglan Li, Quantang Fang, Mingqiang Wei, Yu Peng, Shihao Wei, Zijian Wu, Shuyao Sheng
  • Publication number: 20230273339
    Abstract: The present invention discloses a method for determining the stimulated reservoir volume of horizontal wells by coupling reservoir flow, comprising the following steps: establishing a reservoir grid based on the reservoir geological model of the target well and adding an initial fracture unit; calculating the stress intensity factor at the fracture tip, judging the fracture initiation and determining the total number of fracture units; calculating the fluid pressure of fracture units, the pore pressure distribution and water saturation distribution of the reservoir matrix and micro-fractures during hydraulic fracturing; working out the stimulated reservoir volume of the horizontal well according to the fracture parameters, pressure distribution and water saturation distribution in shale reservoirs. The present invention can simulate fracture propagation, fracturing fluid leak-off and reservoir fluid flow in the whole fracturing process, determine the stimulated reservoir volume of horizontal wells.
    Type: Application
    Filed: January 6, 2023
    Publication date: August 31, 2023
    Applicant: Southwest Petroleum University
    Inventors: Yongming LI, Ang LUO, Yu PENG, Xuefeng YANG, Cheng CHANG
  • Patent number: 11727562
    Abstract: A computer-implemented image analysis method and system. The method comprises: quantifying one or more features segmented and identified from a medical image of a subject; extracting clinically relevant features from non-image data pertaining to the subject; assessing the features segmented from the medical image and the features extracted from the non-image data with a trained machine learning model; and outputting one or more results of the assessing of the features.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: August 15, 2023
    Assignee: Curvebeam AI Limited.
    Inventor: Yu Peng
  • Publication number: 20230253162
    Abstract: This invention describes packaging structures and methods for electronic devices, especially for solid electrolytic capacitor devices. A packaging structure applies at least two protective substrates to sandwich one or multiple capacitor elements stacked together in between with an insulating material surrounding the capacitor elements also in between the protective substrates. Each protective substrate comprises an anodic conductor pad and a cathodic conductor pad. The anodic conductor pad is electrically connected to an external anode terminal, which is in turn electrically connected to the tip face of the anode end of the capacitor element. The cathodic pad is electrically connected to the cathode of the capacitor element as well as to an external cathode terminal.
    Type: Application
    Filed: February 9, 2022
    Publication date: August 10, 2023
    Inventors: Yu-Peng Chung, Chia-Wei Li, Che-Chih Tsao
  • Patent number: D1005387
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: November 21, 2023
    Assignee: AVISION INC.
    Inventors: Chao-Yu Peng, Shao-Lan Sheng