Abstract: A semiconductor memory device includes data path circuits and control circuits alternately disposed along a first direction. A first metal layer is disposed on the data path circuits and control circuits. Each of data path circuits includes a memory cells disposed in rows along the first direction and columns along a second direction crossing the first direction and a read/write circuit disposed at an end of the columns of memory cells. At least one pair of adjacent columns of memory cells has an electrical separation between the gate polysilicon layer the pair of adjacent memory cell columns—that is, gate conductor layer of the adjacent memory columns are electrically distinct. A word line in the first metal layer is segmented along the first direction into separately addressable portions.

Abstract: A semiconductor memory device includes data path circuits and control circuits alternately disposed along a first direction. A first metal layer is disposed on the data path circuits and control circuits. Each of data path circuits includes a memory cells disposed in rows along the first direction and columns along a second direction crossing the first direction and a read/write circuit disposed at an end of the columns of memory cells. At least one pair of adjacent columns of memory cells has an electrical separation between the gate polysilicon layer the pair of adjacent memory cell columns—that is, gate conductor layer of the adjacent memory columns are electrically distinct. A word line in the first metal layer is segmented along the first direction into separately addressable portions.

Abstract: ONU 2A for P-P includes a signal-type discriminating unit 22A that discriminates whether a type of a downstream signal transmitted from OLT is for the P-P or not, and outputs an enable/disable control signal that controls an optical transmitter to an enable state or a disable state, and a control unit 21 that controls the optical transmitter to the enable state or the disable state according to the enable/disable control signal, wherein the signal-type discriminating unit 22A outputs to the control unit 21 a disable control signal that controls the optical transmitter to the disable state under an initial state before the type of the downstream signal is discriminated, and outputs to the control unit 21 an enable control signal that controls the optical transmitter to the enable state after the downstream signal is discriminated to be for the P-P.

Abstract: A semiconductor integrated circuit includes a first region configured to operate at a specified first voltage, a second region configured to operate at a varying second voltage, and a memory device formed between the first region and the second region so as to straddle the first and second regions, wherein the memory device comprises a first port driven at the first voltage to transmit an output signal to and receive an input signal from the first region, a second port driven at the second voltage to transmit an output signal to and receive an input signal from the second region, and a memory cell accessed by the first and second ports.

Abstract: A semiconductor memory device includes a memory cell array. The memory cell array includes a plurality of sub arrays. Each sub array includes a plurality of memory cells. The memory cell includes a pair of storage nodes that are complementary to each other. One storage node constituting the pair of storage nodes in each of the memory cells in each of the sub arrays is connected to a global bit-line. The other storage node constituting the pair of storage nodes in each of the memory cells in each of the sub arrays is connected to a local bit-line. The global bit-line is a bit-line connected in common to the plurality of the sub arrays. The local bit-line is provided for each of the sub arrays.

Abstract: A semiconductor integrated circuit includes a first region configured to operate at a specified first voltage, a second region configured to operate at a varying second voltage, and a memory device formed between the first region and the second region so as to straddle the first and second regions, wherein the memory device comprises a first port driven at the first voltage to transmit an output signal to and receive an input signal from the first region, a second port driven at the second voltage to transmit an output signal to and receive an input signal from the second region, and a memory cell accessed by the first and second ports.

Abstract: ONU 2A for P-P includes a signal-type discriminating unit 22A that discriminates whether a type of a downstream signal transmitted from OLT is for the P-P or not, and outputs an enable/disable control signal that controls an optical transmitter to an enable state or a disable state, and a control unit 21 that controls the optical transmitter to the enable state or the disable state according to the enable/disable control signal, wherein the signal-type discriminating unit 22A outputs to the control unit 21 a disable control signal that controls the optical transmitter to the disable state under an initial state before the type of the downstream signal is discriminated, and outputs to the control unit 21 an enable control signal that controls the optical transmitter to the enable state after the downstream signal is discriminated to be for the P-P.

Abstract: A semiconductor memory device includes a memory cell array. The memory cell array includes a plurality of sub arrays. Each sub array includes a plurality of memory cells. The memory cell includes a pair of storage nodes that are complementary to each other. One storage node constituting the pair of storage nodes in each of the memory cells in each of the sub arrays is connected to a global bit-line. The other storage node constituting the pair of storage nodes in each of the memory cells in each of the sub arrays is connected to a local bit-line. The global bit-line is a bit-line connected in common to the plurality of the sub arrays. The local bit-line is provided for each of the sub arrays.

Abstract: LSI device 100 is provided with standard cell regions 10, a plurality of standard cells 20, memory blocks 11 and a plurality of memory cells 21. Standard cells 20 are equal in height “Hs” and disposed in standard cell regions 10 in a vertical direction. Memory blocks 11 are provided in contact with standard cell region 10 in a horizontal direction and memory cells 21 are disposed in memory blocks 11 in the vertical direction. Height “Hm” of memory cells 21 is equal to the height “Hs” or the height of the standard cell divided by an integer. Boundary positions of standard cells 20 neighboring each other are consistent with those of memory cells 21 neighboring each other.

Abstract: A semiconductor memory includes memory cells for even addresses arranged in a first memory array and storing even addressed data, word lines for even addresses arranged parallel to a row direction of the first memory array and selecting the memory cells for even addresses, bit lines for even addresses arranged parallel to a column direction of the first memory array and transferring the even addressed data to the memory cells for even addresses, memory cells for odd addresses arranged in a second memory array and storing odd addressed data, word lines for odd addresses arranged parallel to a row direction of the second memory array and selecting the memory cells for odd addresses, and bit lines for odd addresses arranged parallel to a column direction of the second memory array and transferring the odd addressed data to the memory cells for odd addresses.

Abstract: A semiconductor memory device is disclosed, which includes a first SRAM cell which includes cross-connected first and second inverters having first and second nodes, a first transistor connected between a first bit line and the first node and having a gate connected to a first write word line, a second transistor connected between a second bit line and the second node and having a gate connected to the first write word line, a third transistor having a gate connected to the second node, a fourth transistor connected between the first bit line and the third transistor and having a gate connected to a read word line, and a second SRAM cell which includes fifth-eighth transistors corresponding to the first-fourth transistors and has substantially the same configuration as the first SRAM, wherein the drains of the fourth and eighth transistors are connected to the first and second bit lines, respectively.

Abstract: A semiconductor memory device includes first and second bit lines, memory cells each including first and second storage nodes, which are connected through selecting transistors to the first and second bit lines, respectively, a pre-charge circuit configured to pre-charge the first and second bit lines to a predetermined potential so as to read data, a hold circuit configured to maintain a potential level of the first and second bit lines, a read circuit connected to the first bit line, and a leak circuit having one terminal connected to the second bit line and another terminal connected to a ground. The leak circuit allows a current to leak from the second bit line.

Abstract: A semiconductor memory device is disclosed, which includes a first SRAM cell which includes cross-connected first and second inverters having first and second nodes, a first transistor connected between a first bit line and the first node and having a gate connected to a first write word line, a second transistor connected between a second bit line and the second node and having a gate connected to the first write word line, a third transistor having a gate connected to the second node, a fourth transistor connected between the first bit line and the third transistor and having a gate connected to a read word line, and a second SRAM cell which includes fifth-eighth transistors corresponding to the first-fourth transistors and has substantially the same configuration as the first SRAM, wherein the drains of the fourth and eighth transistors are connected to the first and second bit lines, respectively.

Abstract: A semiconductor memory includes memory cells for even addresses arranged in a first memory array and storing even addressed data, word lines for even addresses arranged parallel to a row direction of the first memory array and selecting the memory cells for even addresses, bit lines for even addresses arranged parallel to a column direction of the first memory array and transferring the even addressed data to the memory cells for even addresses, memory cells for odd addresses arranged in a second memory array and storing odd addressed data, word lines for odd addresses arranged parallel to a row direction of the second memory array and selecting the memory cells for odd addresses, and bit lines for odd addresses arranged parallel to a column direction of the second memory array and transferring the odd addressed data to the memory cells for odd addresses

Abstract: A semiconductor memory device comprising: a memory array including a plurality of memory cells; a plurality of word lines corresponding to the respective memory cells; a pair of local bit lines corresponding to the memory array; a pair of global bit lines corresponding to the pair of local bit lines; a precharge circuit including an output terminal being connected to the pair of local bit lines; a local write amplifier circuit including a data input terminal being connected to the pair of global bit lines and an output terminal being connected to the pair of local bit lines; and a control signal line being connected to an input terminal of the precharge circuit and to a control input terminal of the local write amplifier circuit, wherein the local write amplifier circuit is deactivated by the control signal line when the precharge circuit is activated, and the precharge circuit is deactivated by the control signal line when the local write amplifier circuit is activated.

Abstract: A semiconductor memory device includes first and second bit lines, memory cells each including first and second storage nodes, which are connected through selecting transistors to the first and second bit lines, respectively, a pre-charge circuit configured to pre-charge the first and second bit lines to a predetermined potential so as to read data, a hold circuit configured to maintain a potential level of the first and second bit lines, a read circuit connected to the first bit line, and a leak circuit having one terminal connected to the second bit line and another terminal connected to a ground. The leak circuit allows a current to leak from the second bit line.

Abstract: LSI device 100 is provided with standard cell regions 10, a plurality of standard cells 20, memory blocks 11 and a plurality of memory cells 21. Standard cells 20 are equal in height “Hs” and disposed in standard cell regions 10 in a vertical direction. Memory blocks 11 are provided in contact with standard cell region 10 in a horizontal direction and memory cells 21 are disposed in memory blocks 11 in the vertical direction. Height “Hm” of memory cells 21 are multiple times by integers of height “Hs” of standard cells 20. Boundary positions of standard cells 20 neighboring each other are consistent with those of memory cells 21 neighboring each other.

Abstract: A semiconductor memory device includes first and second bit lines, memory cells each including first and second storage nodes, which are connected through selecting transistors to the first and second bit lines, respectively, a pre-charge circuit configured to pre-charge the first and second bit lines to a predetermined potential so as to read data, a hold circuit configured to maintain a potential level of the first and second bit lines, a read circuit connected to the first bit line, and a leak circuit having one terminal connected to the second bit line and another terminal connected to a ground. The leak circuit allows a current to leak from the second bit line.

Abstract: A plurality of sub-arrays include a plurality of memory elements. First bit line pairs are connected to a plurality of memory elements provided in each of the sub-arrays. Second bit line pairs are provided so as to correspond to a plurality of sub-arrays. The first bit line pairs supply signals to the second bit line pairs. The second bit line pairs are operated at a lower frequency than the first bit line pairs.

Abstract: A plurality of sub-arrays include a plurality of memory elements. First bit line pairs are connected to a plurality of memory elements provided in each of the sub-arrays. Second bit line pairs are provided so as to correspond to a plurality of sub-arrays. The first bit line pairs supply signals to the second bit line pairs. The second bit line pairs are operated at a lower frequency than the first bit line pairs.