Abstract: Disclosed is a method for measuring gas pressure of a close-distance seam group simultaneously, including the following steps: constructing a pressure-measuring drill hole inclined downwards; lowering a first seam piezometer tube, lowering a baffle and a polyurethane blocking material after a tube head reaching a lowermost seam; and installing a gas pressure gauge; lowering a second seam piezometer tube, lowering the baffle and the polyurethane blocking material after the tube head reaching a second layer of seam; and installing the gas pressure gauge; lowering a nth seam piezometer tube, lowering the baffle and the polyurethane blocking material after the tube head reaching a nth layer of seam; and installing the gas pressure gauge; injecting a high-water and quick-solidifying material into the drill hole; and connecting the gas pressure gauges through optical fibers, and connecting the gas pressure gauges with a ground control system.

Abstract: A method may include generating an optimal operational window (OOW) that specifies operational parameter values for drilling operations using equipment at a rig site, based on data indicative of rig state and formation characteristics, and based on mutation-based optimization of the operational parameter values; and instructing a control system to perform the drilling operations according to the OOW using the equipment at the rig site.

Abstract: A camera module, an integral base component of same, and a manufacturing method therefor are provided. The camera module includes at least one lens, at least one photosensitive chip, at least one filter, and at least one integral base component. The integral base component includes a base part and a circuit board part. The base part is integrally packaged in the circuit board part. The photosensitive chip is mounted on the circuit board part. The base part forms at least one through hole so as to provide the photosensitive chip with a light path. The lens is arranged on the light path of the photosensitive chip.

Abstract: A method can include receiving real-time data during a drilling operation performed by a drillstring that includes a mud motor and a bit characterized by an expected performance profile; determining actual performance of the drillstring based at least in part on the real-time data; predicting degraded performance of the drillstring based at least in part on the real-time data and a mud motor degradation model; and updating the expected performance profile based on a comparison of the actual performance and the degraded performance.

Abstract: Disclosed a photosensitive assembly, an imaging module, a smart terminal, and a method and a mould for manufacturing the photosensitive assembly.

Abstract: A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

Abstract: A camera module and an electronic device having the same, and a method for manufacturing the camera module, wherein the fixed-focus camera module comprises a circuit board; a photosensitive element, which is conductively connected to the circuit board; a molded base, wherein the molded base is integrally molded on the circuit board and the photosensitive element, and the molded base forms a light window, so as to provide a light passage for the photosensitive chip through the light window; and an optical lens, wherein the optical lens is supported on the molded base and corresponds to the light window formed by the molded base, wherein the circuit board comprises a circuit board substrate and at least one electronic component, wherein the at least one electronic component is electrically connected to the circuit board substrate, wherein the circuit board substrate has a blank side, and wherein the blank side of the circuit board substrate is free of the at least one electronic component.

Abstract: A camera module is provided, including a circuit board, a photosensitive element, an optical lens, and a filter element. The circuit board includes a substrate having a substrate front surface, a substrate back surface, and a substrate channel. The substrate front surface and the substrate back surface correspond to each other, and the substrate channel extends from the substrate front surface to the substrate back surface. The photosensitive element has a photosensitive area and a non-photosensitive area surrounding the photosensitive area. A first part of the non-photosensitive area is mounted on the back surface substrate. The photosensitive element and the substrate are conductively connected. The photosensitive area and a second part of the non-photosensitive area correspond to the substrate channel. The optical lens is held in a photosensitive path of the photosensitive element. The filter element is directly mounted on the substrate front surface of the substrate.

Abstract: A method can include receiving input for a multiwell pad; selecting, based at least in part on a portion of the input, a template for the multiwell pad; generating, based at least in part on the template, well trajectories for the multiwell pad, where each of the well trajectories extends from a surface location of the multiwell pad to one or more reservoir target locations and where each of the well trajectories includes at least one curve generated using one or more dogleg severity values and one or more geometric control points that are not required to lie on one or more of the well trajectories; and outputting specifications for the generated trajectories of the multiwell pad.

Abstract: This invention provides a camera module having a chamfer, a photosensitive assembly, a preparation method, and an electronic device. The photosensitive assembly of the camera module having the chamfer includes: a photosensitive element; a circuit board, wherein the photosensitive element is electrically connected and attached to the circuit board, and wherein the circuit board has a circuit board chamfer; and a molded body having a light window and a molded body chamfer, wherein the molded body chamfer and the circuit board chamfer are correspondingly arranged to form a chamfer portion suitable for forming a chamfer structure of the camera module, and wherein the molded body is molded on the circuit board and encapsulates the photosensitive element, so that the camera module may be installed at a corner of the electronic device, thereby increasing the screen-to-body ratio.

Abstract: An optical actuator, including: a base; a lens module comprising two first side surfaces opposite each other; and a plurality of shape memory alloy wires forming two wire groups, the two wire groups being disposed on the two first side surfaces, respectively, wherein two ends of each shape memory alloy wire are fixed to a base-end fixing device and a lens-end fixing device, respectively; and the direction of the resultant force acting on the lens module by the two wire groups is consistent with the direction of the optical axis of the lens module, so that the lens module is driven to move along the direction of the optical axis of the lens module by means of expansion and contraction of the shape memory alloy wires of the two wire groups.

Abstract: A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.

Abstract: The present invention provides a semiconductor packaging method and semiconductor device based on a molding process. In the packaging method, first, at least a portion of a compensation part is kept on at least a portion of a bonding region formed between a first adjoining surface of a semiconductor element and a second adjoining surface of a packaging component, to form a semi-finished product of a semiconductor device; then, during hardening of the packaging component, the compensation part is caused to undergo different degrees of deformation at different positions to compensate for a difference between a magnitude of deformation of the packaging component and a magnitude of deformation of the semiconductor element, so as to package the semiconductor element to form the semiconductor device. By means of the method, undesirable phenomena such as cracking and deformation of the surface of the semiconductor element can be avoided.

Abstract: A camera module and a molded circuit board assembly thereof, a semi-finished product of the molded circuit board assembly, and an array camera module and a molded circuit board assembly thereof, as well as a manufacturing method and an electronic device, wherein the camera module comprises at least one optical lens, at least one back surface molded portion, at least one photosensitive element and a circuit board.

Abstract: A modified Y-type molecular sieve has a rare earth content of about 4% to about 11% by weight on the basis of the oxide, a phosphorus content of about 0.05% to about 10% by weight on the basis of P2O5, a sodium content of no more than about 0.5% by weight on the basis of sodium oxide, a gallium content of about 0.1% to about 2.5% by weight on the basis of gallium oxide, and a zirconium content of about 0.1% to about 2.5% by weight on the basis of zirconia; and the modified Y-type molecular sieve has a total pore volume of about 0.36 mL/g to about 0.48 mL/g, a percentage of the pore volume of secondary pores having a pore size of 2-100 nm to the total pore volume of about 20% to about 40%.

Abstract: Disclosed is a photosensitive module (21), adapted to a camera module, comprising a photosensitive element (211), a light transmitting element (212) and an isolation adhesive layer (213), wherein the photosensitive element has a photosensitive region and a non-photosensitive region, the light transmitting element is arranged in a photosensitive path of the photosensitive element, and wherein the isolation adhesive layer is arranged in the non-photosensitive region and supports the light transmitting element, and the isolation adhesive layer is formed by means of photolithography.

Abstract: A lens (10) and a camera module (100) and a manufacturing method thereof, wherein the lens (10) comprises an edge-cut lens sheet (114), wherein the edge-cut lens sheet (14) includes at least one chord edge (1141) and at least one circular edge (1142), wherein the chord edge (1141) and the circular edge (1142) are adjacently connected to each other, and wherein the chord edge (1141) and the circular edge (1142) have different curvatures, so that the lens sheet (114) becomes narrow and the width of the lens (10) become narrow, to form an ultra-narrow camera module (100).

Abstract: A live flaw detection system for a multi-bundled conductor splicing sleeve and an application method thereof are disclosed. The system includes an upper apparatus and a lower apparatus, where the upper apparatus includes an unmanned aerial vehicle and an industrial X-ray machine, and a laser sensor, and the lower apparatus includes a press plate frame apparatus, vertical screw slide table modules, a horizontal screw slide table module, a projection imager, and a linear retractable apparatus. The unmanned aerial vehicle functions as a power apparatus that controls the system to be online or offline, the industrial X-ray machine is configured to perform ray flaw detection on each splicing sleeve, the laser sensor is configured to guide the unmanned aerial vehicle to land the lower apparatus on splicing sleeves accurately, and the press plate frame apparatus is configured to fixedly clamp the splicing sleeves.

Abstract: A method for manufacturing semiconductor modules for image-sensing devices is disclosed. The method may comprise applying a removable layer on a first surface of a printed circuit board (PCB) which comprises a plurality of PCB units; mounting a photosensitive member to a second surface of each of the PCB units; and encapsulating the photosensitive member with an encapsulation layer on each PCB unit. Each PCB unit may comprise at least a semiconductor component on a second surface of the PCB and one or more opening across the first surface and the second surface. The photosensitive member and the removable layer separate the one or more opening from outside, and the photosensitive member is positioned to receive light through the opening. At least one semiconductor component is also encapsulated by the encapsulation layer on each PCB unit.