Abstract: The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.

Abstract: A method for determining tortuosity, e.g., in an oilfield well includes obtaining a planned trajectory for a hole, and obtaining a first survey of the hole using a sensor deployed into the hole. The first survey includes a first surveyed position at a first depth of the hole and a second surveyed position at a second depth of the hole, and no surveyed positions between the first and second depths. The method further includes simulating a second survey of the hole between the first and second depths using a model. The second survey includes a plurality of simulated positions of the hole between the first and second depths. The method includes determining that the simulated position at the second depth is proximal to the second surveyed position, and visualizing a trajectory of the hole based on the first and second surveys.

Abstract: A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.

Abstract: The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.

Abstract: An array camera module having a height difference, a circuit board assembly and a manufacturing method therefor, and an electronic device. The array camera module comprises a first camera module unit and a second camera module unit, wherein the first camera module unit comprises at least one first photosensitive assembly and at least one first lens; the first lens is located on a photosensitive path of the first photosensitive assembly; the first photosensitive assembly comprises at least one extension portion; the extension portion at least partially extends towards the direction away from the first photosensitive assembly; and the second camera module unit is fixedly connected to a second extension portion, so that the ends of the two camera module units are consistent.

Abstract: A lens (10) and a camera module (100) and a manufacturing method thereof, wherein the lens (10) comprises an edge-cut lens sheet (114), wherein the edge-cut lens sheet (14) includes at least one chord edge (1141) and at least one circular edge (1142), wherein the chord edge (1141) and the circular edge (1142) are adjacently connected to each other, and wherein the chord edge (1141) and the circular edge (1142) have different curvatures, so that the lens sheet (114) becomes narrow and the width of the lens (10) become narrow, to form an ultra-narrow camera module (100).

Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.

Abstract: A multi-aperture imaging system and application thereof are provided. The multi-aperture imaging system includes a long-focal length camera module, a mid-focal length camera module and a wide-angle camera module. The long-focal length camera module has a field of view-FOV3. The mid-focal length camera module has a field of view-FOV2. The wide-angle camera module has a field of view-FOV1. They satisfy the condition of FOV1>FOV2>FOV3. Besides, a portion of the field of view area of FOV1 is covered by a portion of the field of view area of FOV2, while a portion of the field of view area of FOV2 is covered by a portion of the field of view area of FOV3, so as to enable a better zooming performance.

Abstract: A camera module and photosensitive component or unit thereof and manufacturing method therefor are provided. The photosensitive unit includes an encapsulation portion and a photosensitive portion that includes a main circuit board and a photosensitive sensor, wherein the encapsulation portion is integrally encapsulated to form on the main circuit board and the photosensitive sensor.

Abstract: A glass with a reinforced layer is provided, including a glass body and the reinforced layer formed in a surface of the glass body. The compressive stress of the reinforced layer trends to decrease non-linearly from the surface of the glass body to the interior of the glass body. The compressive stress curve of the reinforced layer has an inflection point. The gradient of a first curve section in front of the inflection point is greater than the gradient of a second curve section behind the inflection point. The overall refractive index of the reinforced layer trends to decrease non-linearly from the surface of the glass body to the interior of the glass body. The refractive index curve of the reinforced layer has at least two inflection points. Furthermore, a method for preparing the glass with a reinforced layer is provided.

Abstract: A modified Y-type molecular sieve has a rare earth content of about 4-11% by weight on the basis of rare earth oxide, a sodium content of no more than about 0.5 wt % by weight on the basis of sodium oxide, a zinc content of about 0.5-5% by weight on the basis of zinc oxide, a phosphorus content of about 0.05-10% by weight on the basis of phosphorus pentoxide, a framework silica-alumina ratio of about 7-14 calculated on the basis of SiO2/Al2O3 molar ratio, a percentage of non-framework aluminum content to the total aluminum content of no more than about 10%, and a percentage of the pore volume of secondary pores having a pore size of 2-100 nm to the total pore volume of about 20-40%. The modified Y-type molecular sieve has a high crystallinity and a high thermal and hydrothermal stability, and is rich in secondary pores.

Abstract: An optical assembly, a camera module having the optical assembly, and a smart device having the camera module.

Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.

Abstract: A motor bypass valve diverts drilling fluid away from a downhole motor when the motor is off bit. Bypassing the downhole motor reduces the shock and vibration on the BHA caused by the downhole motor, thereby reducing the damage to the BHA. The motor bypass valve may divert fluid out of a housing or into a bore through the rotor of the downhole motor.

Abstract: A modified Y-type molecular sieve has a modifying metal content of about 0.5-6.3 wt % calculated on the basis of an oxide of the modifying metal and a sodium content of no more than about 0.5 wt % calculated on the basis of sodium oxide. The modifying metal is magnesium and/or calcium. The modified Y-type molecular sieve has a proportion of non-framework aluminum content to the total aluminum content of no more than about 20%, a total pore volume of about 0.33-0.39 ml/g, a proportion of the pore volume of secondary pores having a pore size of 2-100 nm to the total pore volume of about 10-25%, a lattice constant of about 2.440-2.455 nm, a lattice collapse temperature of not lower than about 1040° C., and a ratio of B acid to L acid in the total acid content of no less than about 2.30.

Abstract: A modified Y-type molecular sieve has a rare earth content of about 4% to about 11% by weight on the basis of the oxide, a phosphorus content of about 0.05% to about 10% by weight on the basis of P2O5, a sodium content of no more than about 0.5% by weight on the basis of sodium oxide, and an active element content of about 0.1% to about 5% by weight on the basis of the oxide, with the active element being gallium and/or boron. The modified Y-type molecular sieve has a total pore volume of about 0.36 mL/g to about 0.48 mL/g, a percentage of the pore volume of secondary pores having a pore size of 2-100 nm of about 20% to about 40%; a lattice constant of about 2.440 nm to about 2.455 nm, and a lattice collapse temperature of not lower than about 1060° C.

Abstract: A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.

Abstract: Provided are a fixed-focus photographing module, a manufacturing method thereof, and a focusing device and method thereof. The focusing method includes: pre-assembling an optical lens assembly in a lens assembly holder, wherein the optical lens assembly is exposed at the exterior of the lens assembly holder, and the optical lens assembly is located in a photosensing path of a photosensing component assembled in a circuit board to form a pre-assembled photographing module; performing, by the pre-assembled photographing module, a photographing operation to obtain a testing image; adjusting, according to the testing image, a relative position between the optical lens assembly and lens assembly holder until the pre-assemble photographing module outputs a clear image as required; and fixing the optical lens assembly and the lens assembly holder to complete a focusing operation and obtain an assembled fixed-focus photographing module.

Abstract: A modified Y-type molecular sieve having a calcium content of about 0.3-4 wt % calculated on the basis of calcium oxide, a rare earth content of about 2-7 wt % calculated on the basis of rare earth oxide, and a sodium content of no more than about 0.5 wt % calculated on the basis of sodium oxide. The modified Y-type molecular sieve has a total pore volume of about 0.33-0.39 ml/g, a proportion of the pore volume of secondary pores having a pore size of 2-100 nm to the total pore volume of about 10-25%, a lattice constant of about 2.440-2.455 nm, a proportion of non-framework aluminum content to the total aluminum content of no more than about 20%, a lattice collapse temperature of not lower than about 1050° C., and a ratio of B acid to L acid in the total acid content of no less than about 2.30.

Abstract: An on-board charger is provided with a bulk capacitor adapted to couple to a vehicle traction battery and a relay for receiving electrical power from an external power supply and to pre-charge the bulk capacitor. A power factor correction (PFC) circuit is connected between the bulk capacitor and the relay. The PFC circuit includes a switch that is adjustable between an on-position and an off-position. The switch enables current flow from the relay to the bulk capacitor in the off-position. A snubber circuit is coupled to the switch to damp a transient voltage present at the switch during a transition from the on-position to the off-position. A processor is programmed to control the switch.