Abstract: The present invention discloses an array camera module and application thereof, wherein the array camera module comprises at least one optical lens and at least one circuit board assembly. The circuit board assembly further comprises at least one photosensitive chip, at least one circuit board, and at least one electronic component, wherein the photosensitive chip and the circuit board are conductively connected, at least one of the electronic components is attached to a back face of the circuit board, and the optical lens is held in a photosensitive path of the photosensitive chip. In this way, at least one of the length and the width of the array camera module can be reduced, so as to be beneficial to the miniaturization of the array camera module, so that the array camera module can be conveniently applied to a light-weighted and thinned electronic device.

Abstract: A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.

Abstract: An optical camera lens, a camera module, a terminal device, and assembling methods for the optical camera lens and the camera module, the optical camera lens comprising: a lens barrel (10) having an axis (11) and a lens barrel side face (12) surrounding the axis (11), the lens barrel side face (12) comprising a first side (12a) and a second side (12b) opposite to the first side (12a); and a lens sheet set (20) mounted in the lens barrel (10) and comprising a plurality of lenses, wherein the plurality of lenses comprise at least one free-form lens (21), and the at least one free-form lens (21) is adapted to deflect incident light toward the second side (12b), so that an imaging plane (24) of an optical system composed of the plurality of lens sheets is deflected toward the second side.

Abstract: A camera module, an integral base component of same, and a manufacturing method therefor are provided. The camera module includes at least one lens, at least one photosensitive chip, at least one filter, and at least one integral base component. The integral base component includes a base part and a circuit board part. The base part is integrally packaged in the circuit board part. The photosensitive chip is mounted on the circuit board part. The base part forms at least one through hole so as to provide the photosensitive chip with a light path. The lens is arranged on the light path of the photosensitive chip.

Abstract: Provided is a user side load response method based on adjustment and control on temperature of load clusters. The user side load response method includes: performing thermodynamic modeling on a temperature control load to obtain a temperature control model in direct load control; constructing a mapping quantity to describe the change state of a temperature control load relay switch; obtaining adjustable capacity of the temperature control load through the mapping quantity; introducing temperature control load clusters to solve the problem that control precision cannot satisfy condition requirements; and finally calculating the influence of each load cluster in different load cluster control schemes on comfort degree.

Abstract: An array camera module having a height difference, a circuit board assembly and a manufacturing method therefor, and an electronic device. The array camera module comprises a first camera module unit and a second camera module unit, wherein the first camera module unit comprises at least one first photosensitive assembly and at least one first lens; the first lens is located on a photosensitive path of the first photosensitive assembly; the first photosensitive assembly comprises at least one extension portion; the extension portion at least partially extends towards the direction away from the first photosensitive assembly; and the second camera module unit is fixedly connected to a second extension portion, so that the ends of the two camera module units are consistent.

Abstract: A standard conformance testing system and method for a CIM/E model of a power system and a storage medium include: converting the standards “Power Grid Common Model Description Specification (GB/T 30149)” and “Power Grid Operating Model Data Exchange Specification (DL/T 1380)” into practically operable testing rules, and performing automatic generation and verification of a CIM/E standard model and defect model. The testing system and method can improve the comprehensiveness and standardization of a CIM/E model standard compliance test, improving testing efficiency, promoting the level of standardization according to the CIM/E model in a power system software development process, and real time data exchange and interoperation between respective application systems, effectively supporting the safe and stable operation of a power grid.

Abstract: The present application provides an integrated lens barrel including: a cylindrical body having an inner side surface and a central axis; and an inner extension portion extending from the inner side surface to the central axis and the middle of the inner extension portion having a light through hole, the inner extension portion dividing the inner side surface into a first section and a second section, and a top surface of the inner extension portion and the first section forming a first groove suitable for accommodating a first lens group, and a bottom surface of the inner extension portion and the second section forming a second groove suitable for accommodating a second lens group. The present application also provides a corresponding optical camera lens, a camera module, and corresponding assembly methods of optical camera lens and camera module.

Abstract: An on-board charger is provided with a bulk capacitor adapted to couple to a vehicle traction battery and a relay for receiving electrical power from an external power supply and to pre-charge the bulk capacitor. A power factor correction (PFC) circuit is connected between the bulk capacitor and the relay. The PFC circuit includes a switch that is adjustable between an on-position and an off-position. The switch enables current flow from the relay to the bulk capacitor in the off-position. A snubber circuit is coupled to the switch to damp a transient voltage present at the switch during a transition from the on-position to the off-position. A processor is programmed to control the switch.

Abstract: Provided are a camera module, a molding photosensitive assembly and manufacturing method thereof, and an electronic device. The molding photosensitive assembly comprises a molding portion, at least one photosensitive chip and at least one circuit board, wherein the photosensitive chip is provided on the circuit board, the molding portion comprises a molding portion main body, the molding portion main body is made of a transparent material, and the molding portion main body, the photosensitive chip and the circuit board form an integral structure by means of a molding technique, so as to facilitate production.

Abstract: An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.

Abstract: The present invention discloses an array camera module and application thereof, wherein the array camera module comprises at least one optical lens and at least one circuit board assembly. The circuit board assembly further comprises at least one photosensitive chip, at least one circuit board, and at least one electronic component, wherein the photosensitive chip and the circuit board are conductively connected, at least one of the electronic components is attached to a back face of the circuit board, and the optical lens is held in a photosensitive path of the photosensitive chip. In this way, at least one of the length and the width of the array camera module can be reduced, so as to be beneficial to the miniaturization of the array camera module, so that the array camera module can be conveniently applied to a light-weighted and thinned electronic device.

Abstract: The present invention discloses a camera module with liquid lens and an image plane correction method thereof, wherein the camera module with liquid lens includes a photosensitive assembly, a lens assembly and a correction lens, and the lens assembly includes a liquid lens with adjustable focal power, the liquid lens is held in a photosensitive path of the photosensitive assembly, and the correction lens is held in the photosensitive path of the photosensitive assembly, and the correction lens is located between the liquid lens and the photosensitive assembly, the correction lens and the liquid lens of the lens assembly cooperate with each other to compensate for aberrations, so as to correct the aberration of the optical system of the camera module with liquid lens.

Abstract: The present invention provides a semiconductor packaging method and semiconductor device based on a molding process. In the packaging method, first, at least a portion of a compensation part is kept on at least a portion of a bonding region formed between a first adjoining surface of a semiconductor element and a second adjoining surface of a packaging component, to form a semi-finished product of a semiconductor device; then, during hardening of the packaging component, the compensation part is caused to undergo different degrees of deformation at different positions to compensate for a difference between a magnitude of deformation of the packaging component and a magnitude of deformation of the semiconductor element, so as to package the semiconductor element to form the semiconductor device. By means of the method, undesirable phenomena such as cracking and deformation of the surface of the semiconductor element can be avoided.

Abstract: A semiconductor module for an image-sensing device is disclosed. The semiconductor module may include: a printed circuit board (PCB), a photosensitive member, at least an electric component and a molding component. The PCB may have a first surface, and the photosensitive member and the electric component are positioned on the first surface of the PCB. The molding component may be formed along with the first surface of the PCB, and separate the photosensitive member and the electric component from the ambient environment. The molding component may be in direct contact with the photosensitive member, the electric component and the first surface of the PCB. At least a portion of the molding component may be transparent to allow at last 50% of the incident light to pass through the molding component to reach the photosensitive member.

Abstract: A method for manufacturing semiconductor modules for image-sensing devices is disclosed. The method may comprise applying a removable layer on a first surface of a printed circuit board (PCB) which comprises a plurality of PCB units; mounting a photosensitive member to a second surface of each of the PCB units; and encapsulating the photosensitive member with an encapsulation layer on each PCB unit. Each PCB unit may comprise at least a semiconductor component on a second surface of the PCB and one or more opening across the first surface and the second surface. The photosensitive member and the removable layer separate the one or more opening from outside, and the photosensitive member is positioned to receive light through the opening. At least one semiconductor component is also encapsulated by the encapsulation layer on each PCB unit.

Abstract: A variable aperture device, which is suitable for photographing and filming of a camera module, includes a main body, a fluid passage, and a fluid accommodation cavity, wherein the main body is used to be provided in the camera module, and the main body has a light-transmitting region, the fluid passage is provided in the light-transmitting region of the main body, the fluid accommodation cavity is in communication with the fluid passage for an light-impermeable fluid to be driven to flow back and forth between the fluid accommodation cavity and the fluid passage to enlarge or reduce the light transmission area of the light-transmitting region.

Abstract: A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.

Abstract: A modified Y-type molecular sieve has a rare earth content of about 4-11% by weight on the basis of rare earth oxide, a sodium content of no more than about 0.7% by weight on the basis of sodium oxide, a zinc content of about 0.5-5% by weight on the basis of zinc oxide, a phosphorus content of about 0.05-10% by weight on the basis of phosphorus pentoxide, a framework silica-alumina ratio of about 7-14 calculated on the basis of SiO2/Al2O3 molar ratio, a percentage of non-framework aluminum content to the total aluminum content of no more than about 20%, and a percentage of the pore volume of secondary pores having a pore size of 2-100 nm to the total pore volume of about 15-30%. The modified Y-type molecular sieve has a high crystallinity, a structure comprising secondary pores, and a high thermal and hydrothermal stability.

Abstract: The present application provides a photosensitive assembly, comprising: a photosensitive chip, having a first surface and a second surface facing away from the first surface, the first surface having a photosensitive region; an electronic element arranged around the photosensitive chip; a molded portion formed by a molding process and packaging the electronic element and the photosensitive chip together, the molded portion having a third surface flush with the first surface; and a first re-wiring layer formed on a non-photosensitive region of the first surface and on the third surface, a pad of the photosensitive chip being electrically connected to the electronic element through the first re-wiring layer, wherein a side surface or a bottom surface of the photosensitive assembly has a conductive region, and the conductive region is electrically connected to the first re-wiring layer. The present application further provides a corresponding manufacturing method of photosensitive assembly.